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Pads for surface mounting

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  • H05K1/111
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/111Pads for surface mounting
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
    • Publication number 20240147629
    • Publication date May 2, 2024
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • CHANG-HE ZHU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATING AGENT MANUFACTURING KIT, COATING AGENT, AND METHOD FOR PROD...
    • Publication number 20240141183
    • Publication date May 2, 2024
    • Sekisui Chemical Co., Ltd
    • Akira KAMIYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    PRESSURE SENSITIVE BUTTON AND ELECTRONIC DEVICE
    • Publication number 20240146303
    • Publication date May 2, 2024
    • VIVO MOBILE COMMUNICATION CO., LTD.
    • Zhenxing SHANG
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
    • Publication number 20240147619
    • Publication date May 2, 2024
    • Samsung Electronics Co., Ltd.
    • Jongwan SHIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
    • Publication number 20240138077
    • Publication date Apr 25, 2024
    • LG Innotek Co., Ltd.
    • Jong Bae SHIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
    • Publication number 20240133940
    • Publication date Apr 25, 2024
    • VueReal Inc.
    • Gholamreza Chaji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC SUBSTRATE
    • Publication number 20240138058
    • Publication date Apr 25, 2024
    • LG Innotek Co., Ltd.
    • Heun PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEATSINK BASED POWER DELIVERY FOR CPUS
    • Publication number 20240130033
    • Publication date Apr 18, 2024
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Carrier Substrate
    • Publication number 20240107658
    • Publication date Mar 28, 2024
    • Solid-tech Co., Ltd.
    • Tzu Chien Hung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
    • Publication number 20240096684
    • Publication date Mar 21, 2024
    • VueReal Inc.
    • Gholamreza Chaji
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOW-CURRENT VOLTAGE SOURCE WATCHDOG
    • Publication number 20240097292
    • Publication date Mar 21, 2024
    • International Business Machines Corporation
    • Mark K. Hoffmeyer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOND PAD CONNECTOR FOR SECURING AN ELECTRONIC COMPONENT THEREON
    • Publication number 20240098895
    • Publication date Mar 21, 2024
    • Jabil Inc.
    • Lun Hao Tung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUS AND POWER MODULE
    • Publication number 20240096543
    • Publication date Mar 21, 2024
    • DELTA ELECTRONICS, INC.
    • Yahong Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20240098912
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Jinhwan JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20240098894
    • Publication date Mar 21, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • Hyung Jin KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ISOLATOR
    • Publication number 20240090120
    • Publication date Mar 14, 2024
    • Kabushiki Kaisha Toshiba
    • Yoshinari TAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240090129
    • Publication date Mar 14, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGING SUBSTRATE HAVING METAL POSTS
    • Publication number 20240087999
    • Publication date Mar 14, 2024
    • Skyworks Solutions, Inc.
    • Chien Jen WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...
    • Publication number 20240090125
    • Publication date Mar 14, 2024
    • KIOXIA Corporation
    • Takashi YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INDUCTOR WITH INTEGRATED CONDUCTORS FOR POWER MODULES
    • Publication number 20240080977
    • Publication date Mar 7, 2024
    • Renesas Electronics America Inc.
    • Zhizheng LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT ELEMENT
    • Publication number 20240080968
    • Publication date Mar 7, 2024
    • Kabushiki Kaisha Toshiba
    • Hiroaki IKEUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240074050
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Ki Min
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE
    • Publication number 20240074067
    • Publication date Feb 29, 2024
    • KOLLMORGEN CORPORATION
    • Jeffery Todd BREWSTER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240074041
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Gwo-Shyan Sheu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
    • Publication number 20240074048
    • Publication date Feb 29, 2024
    • Micron Technology, Inc.
    • Ling Pan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE INK INTERCONNECTED DEVICES
    • Publication number 20240074045
    • Publication date Feb 29, 2024
    • NCR Corporation
    • John Paul Bacalso Aliganga
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074049
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Kyun Bae
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074051
    • Publication date Feb 29, 2024
    • Samsung Electronics Co., Ltd.
    • Jonghyun SEOK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PCB PAD FOR SMT PROCESS
    • Publication number 20240064896
    • Publication date Feb 22, 2024
    • Delta Electronics, Inc.
    • Heng-Chao CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PCB PRODUCTION BY LASER SYSTEMS
    • Publication number 20240064897
    • Publication date Feb 22, 2024
    • IO Tech Group Ltd.
    • Michael Zenou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR