Parallel connecting processes

Industry

CPC
H01L2224/9221

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/9221Parallel connecting processes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed-circuit board assembly
- Patent number 10,426,041
- Issue date Sep 24, 2019
- Samsung Electronics Co., Ltd.
- Jung-Je Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with tapered pedestal
- Patent number 10,424,527
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed-circuit board assembly
- Patent number 10,383,235
- Issue date Aug 13, 2019
- Samsung Electronics Co., Ltd.
- Jung-Je Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Die package component with jumper structure
- Patent number 10,312,183
- Issue date Jun 4, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package component with jumper structure and manufacturing metho...
- Patent number 10,297,535
- Issue date May 21, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,991,184
- Issue date Jun 5, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having magnetic alignment marks and underfill...
- Patent number 9,548,290
- Issue date Jan 17, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 9,462,693
- Issue date Oct 4, 2016
- Fujitsu Limited
- Keishiro Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process for connecting two components to each other
- Patent number 9,368,472
- Issue date Jun 14, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,324,683
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Tae-Hong Min
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411337
- Publication date Dec 21, 2023
- Kabushiki Kaisha Toshiba
- Kyo TANABIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
- Publication number 20230317554
- Publication date Oct 5, 2023
- Qorvo US, Inc.
- Christine Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR
- Publication number 20220085265
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...
- Publication number 20210242166
- Publication date Aug 5, 2021
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FILM AND APPLICATION THEREOF
- Publication number 20190244927
- Publication date Aug 8, 2019
- TAIFLEX SCIENTIFIC CO., LTD.
- Sheng-Chin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH TAPERED PEDESTAL
- Publication number 20190148260
- Publication date May 16, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES
- Publication number 20140070226
- Publication date Mar 13, 2014
- AVOGY, INC.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Assembly Process for Connecting Two Components to Each Other
- Publication number 20140038355
- Publication date Feb 6, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN POWER DEVICE WITH SOLDERABLE BACK METAL
- Publication number 20140021479
- Publication date Jan 23, 2014
- AVOGY, INC.
- Patrick James Lazlo Hyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
- Publication number 20130341804
- Publication date Dec 26, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Stacking Devices and Structure Thereof
- Publication number 20130127049
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20120313236
- Publication date Dec 13, 2012
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...
- Publication number 20120299202
- Publication date Nov 29, 2012
- PANASONIC CORPORATION
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
- Publication number 20120153488
- Publication date Jun 21, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNT...
- Publication number 20110175237
- Publication date Jul 21, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME
- Publication number 20110101533
- Publication date May 5, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
- Publication number 20110031596
- Publication date Feb 10, 2011
- Mike D. Gruenhagen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Package System Vertical Interconnect
- Publication number 20100084755
- Publication date Apr 8, 2010
- Mark Allen Gerber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STACKING DEVICES
- Publication number 20090321948
- Publication date Dec 31, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL P...
- Publication number 20080290502
- Publication date Nov 27, 2008
- Zafer Kutlu
- H01 - BASIC ELECTRIC ELEMENTS

Parallel connecting processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of making the same

Method for die and clip attachment

Low temperature hybrid bonding structures and manufacturing method...

Method for electrically contacting a component by galvanic connecti...

Solid top terminal for discrete power devices

Semiconductor devices and methods of making the same

Package with vertical interconnect between carrier and clip

Method for manufacturing semiconductor chips

Method for fabricating stack die package

Method of manufacturing printed-circuit board assembly

Electronic package with tapered pedestal

Method of manufacturing printed-circuit board assembly

Carrier and clip each having sinterable, solidified paste for conne...

Semiconductor device, and alternator and power conversion device wh...

Die package component with jumper structure

Die package component with jumper structure and manufacturing metho...

Semiconductor device

Electronic module and method of manufacturing the same

Small footprint semiconductor package

Semiconductor module

Semiconductor module

Component built-in board and method of manufacturing the same, and...

Method for fabricating stack die package

Semiconductor device having magnetic alignment marks and underfill...

Electronic device and method of manufacturing electronic device

Stacked synchronous buck converter having chip embedded in outside...

Interposer package-on-package structure

Semiconductor module

Flip-chip assembly process for connecting two components to each other

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE

EMBEDDED HEAT SLUG IN A SUBSTRATE

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...

COVER FILM AND APPLICATION THEREOF

ELECTRONIC PACKAGE WITH TAPERED PEDESTAL

Small Footprint Semiconductor Package

METHOD FOR FABRICATING STACK DIE PACKAGE

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES

Flip-Chip Assembly Process for Connecting Two Components to Each Other

GAN POWER DEVICE WITH SOLDERABLE BACK METAL

SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

Semiconductor Device Using Diffusion Soldering

Method for Stacking Devices and Structure Thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNT...

INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME

NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES

Semiconductor Chip Package System Vertical Interconnect

METHOD FOR STACKING DEVICES

INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL P...