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H01L2224/49095

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,994,195
- Issue date Mar 31, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,575,766
- Issue date Nov 5, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and its design method
- Patent number 8,373,263
- Issue date Feb 12, 2013
- Renesas Electronics Corporation
- Ryuichi Oikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,269,357
- Issue date Sep 18, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 7,923,851
- Issue date Apr 12, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-less semiconductor device with improved electrode pattern stru...
- Patent number 6,706,967
- Issue date Mar 16, 2004
- NEC Compound Semiconductor Devices, Ltd.
- Kouzi Hayasi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150270240
- Publication date Sep 24, 2015
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20140103500
- Publication date Apr 17, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS
- Publication number 20130193589
- Publication date Aug 1, 2013
- ROBERT J. WENZEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND ITS DESIGN METHOD
- Publication number 20110180940
- Publication date Jul 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20110101535
- Publication date May 5, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20110095408
- Publication date Apr 28, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20100230828
- Publication date Sep 16, 2010
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled impedance for wire bonding interconnects
- Publication number 20040070065
- Publication date Apr 15, 2004
- Aritharan Thurairajaratnam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-less semiconductor device with improved electrode pattern stru...
- Publication number 20030201113
- Publication date Oct 30, 2003
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Kouzi Hayasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-less semiconductor device with improved electrode pattern stru...
- Publication number 20010032739
- Publication date Oct 25, 2001
- NEC Corporation
- Kouzi Hayasi
- H01 - BASIC ELECTRIC ELEMENTS

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Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic assembly with impedance controlled wirebond and con...

Microelectronic assembly with impedance controlled wirebond and con...

Interconnection structure and its design method

Microelectronic assembly with impedance controlled wirebond and con...

Microelectronic assembly with impedance controlled wirebond and con...

Lead-less semiconductor device with improved electrode pattern stru...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS

INTERCONNECTION STRUCTURE AND ITS DESIGN METHOD

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

Controlled impedance for wire bonding interconnects

Lead-less semiconductor device with improved electrode pattern stru...

Lead-less semiconductor device with improved electrode pattern stru...