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H05K3/368

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/368parallel to each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board assembly with interposer circuit board and correspond...
- Patent number 12,284,760
- Issue date Apr 22, 2025
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure
- Patent number 12,232,288
- Issue date Feb 18, 2025
- Delta Electronics, Inc.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display screen and manufacturing method thereof
- Patent number 12,193,157
- Issue date Jan 7, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Chengsheng Luo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Smart connector and method of manufacturing same using an applicati...
- Patent number 12,176,659
- Issue date Dec 24, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integration method
- Patent number 12,117,648
- Issue date Oct 15, 2024
- Huazhong University of Science & Technology
- Weihua Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,057,670
- Issue date Aug 6, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for stacking printed circuit board
- Patent number 12,035,474
- Issue date Jul 9, 2024
- Chiun Mai Communication Systems, Inc.
- Chi-Yi Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit module and manufacturing method thereof
- Patent number 11,979,988
- Issue date May 7, 2024
- TDK Corporation
- Shuichi Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including a compression assembly for cable conn...
- Patent number 11,943,886
- Issue date Mar 26, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test element support
- Patent number 11,911,768
- Issue date Feb 27, 2024
- Roche Diagnostics Operations, Inc.
- Reiner Stein
- G01 - MEASURING TESTING
Information Patent Grant
Method of interconnecting printed circuit boards
- Patent number 11,901,654
- Issue date Feb 13, 2024
- Amphenol Corporation
- Michael A. Hoyack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with connected component carrier and fluid coolin...
- Patent number 11,889,622
- Issue date Jan 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Composite printed wiring board and method of manufacturing the same
- Patent number 11,785,718
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Takamichi Kono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductive position sensor for electronic throttle control
- Patent number 11,680,826
- Issue date Jun 20, 2023
- Integrated Device Technology, Inc.
- Andreas Buchinger
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Display device and wiring substrate
- Patent number 11,668,984
- Issue date Jun 6, 2023
- Japan Display Inc.
- Hideaki Abe
- G02 - OPTICS
Information Patent Grant
Camera module with imaging sensor and light emitter
- Patent number 11,665,413
- Issue date May 30, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Eiji Machii
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Parallel printed circuit board assembly
- Patent number 11,596,053
- Issue date Feb 28, 2023
- Dell Products L.P.
- Jace W. Files
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, multilayer substrate mounting structure, meth...
- Patent number 11,540,393
- Issue date Dec 27, 2022
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Assembly structure and electronic device having the same
- Patent number 11,503,731
- Issue date Nov 15, 2022
- DELTA ELECTRONICS INC.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY STRUCTURE
- Publication number 20250113454
- Publication date Apr 3, 2025
- DELTA ELECTRONICS,INC.
- Haoyi YE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SMART CONNECTOR AND METHOD OF MANUFACTURING SAME USING AN APPLICATI...
- Publication number 20250070520
- Publication date Feb 27, 2025
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE SUBSTRATES AND METHODS OF USE
- Publication number 20250071911
- Publication date Feb 27, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular Printed Circuit Boards with Connectors
- Publication number 20240405459
- Publication date Dec 5, 2024
- Intel Corporation
- Navneet K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389232
- Publication date Nov 21, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB SPACER
- Publication number 20240373556
- Publication date Nov 7, 2024
- Intel Corporation
- Gabriel Khouri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240349428
- Publication date Oct 17, 2024
- U-BLOX AG
- Anthony Gergis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
- Publication number 20240341029
- Publication date Oct 10, 2024
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Li YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD
- Publication number 20240292539
- Publication date Aug 29, 2024
- Intel Corporation
- Juha Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20240268028
- Publication date Aug 8, 2024
- HARTING ELECTRONICS GMBH
- Marc GENAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Energy Storage Unit for an Electrical Consumer and Method for Manuf...
- Publication number 20240204268
- Publication date Jun 20, 2024
- ROBERT BOSCH GmbH
- Holger Wernerus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF...
- Publication number 20240206066
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Christopher Kong Yee Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SCREEN AND MANUFACTURING METHOD THEREOF
- Publication number 20240179842
- Publication date May 30, 2024
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Chengsheng LUO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOPLASTIC INTERPOSER
- Publication number 20240121882
- Publication date Apr 11, 2024
- Meta Platforms Technologies, LLC
- Brian Toleno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductive Position Sensor for Electronic Throttle Control
- Publication number 20240077335
- Publication date Mar 7, 2024
- Integrated Device Technology, Inc.
- Andreas Buchinger
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
Circuit Board Assembly with Interposer Circuit Board and Correspond...
- Publication number 20240064898
- Publication date Feb 22, 2024
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Assembly with Interposer Circuit Board and Correspond...
- Publication number 20240064899
- Publication date Feb 22, 2024
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
- Publication number 20230395395
- Publication date Dec 7, 2023
- TOPPAN INC.
- Takashi KIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONTACT ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND METH...
- Publication number 20230318208
- Publication date Oct 5, 2023
- ROBERT BOSCH GmbH
- Andreas Otto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...
- Publication number 20230307408
- Publication date Sep 28, 2023
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230269868
- Publication date Aug 24, 2023
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF
- Publication number 20230262896
- Publication date Aug 17, 2023
- Getac Technology Corporation
- Jui-Lin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS

parallel to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board assembly with interposer circuit board and correspond...

Circuit board with bridge chiplets

Assembly structure

Display screen and manufacturing method thereof

Smart connector and method of manufacturing same using an applicati...

Wiring circuit board, producing method thereof, and wiring circuit...

Hybrid integration method

Connection structure and manufacturing method therefor

Semiconductor package structure and method for manufacturing the same

Method and process for creating high-performance coax sockets

Camera module and manufacturing method thereof

Electronic assembly for a vehicle display

Method and system for stacking printed circuit board

Resilient micro lattice electrical interconnection assembly

Insulating paste-based conductive device and manufacturing method t...

Redistribution plate

Electric circuit module and manufacturing method thereof

Electronic assembly including a compression assembly for cable conn...

Test element support

Method of interconnecting printed circuit boards

Electronic device with connected component carrier and fluid coolin...

Power electronics assembly

Composite printed wiring board and method of manufacturing the same

Inductive position sensor for electronic throttle control

Display device and wiring substrate

Camera module with imaging sensor and light emitter

Parallel printed circuit board assembly

Multilayer substrate, multilayer substrate mounting structure, meth...

Redistribution plate

Assembly structure and electronic device having the same

Patents Applicationslast 30 patents

ASSEMBLY STRUCTURE

SMART CONNECTOR AND METHOD OF MANUFACTURING SAME USING AN APPLICATI...

ANISOTROPIC CONDUCTIVE SUBSTRATES AND METHODS OF USE

Modular Printed Circuit Boards with Connectors

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PCB SPACER

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...

Coating of Nanowires

CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD

BONDING SHEET AND METHOD FOR PRODUCING SAME

PRINTED CIRCUIT BOARD ARRANGEMENT

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

Energy Storage Unit for an Electrical Consumer and Method for Manuf...

HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF...

DISPLAY SCREEN AND MANUFACTURING METHOD THEREOF

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

THERMOPLASTIC INTERPOSER

Inductive Position Sensor for Electronic Throttle Control

Circuit Board Assembly with Interposer Circuit Board and Correspond...

Circuit Board Assembly with Interposer Circuit Board and Correspond...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

ASSEMBLING METHOD OF ELECTRONIC MODULE

BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...

ELECTRIC CONTACT ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND METH...

INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...