Partitioned multilayer circuits having adjacent regions with different properties

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CPC
H05K3/4694

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4694Partitioned multilayer circuits having adjacent regions with different properties

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with interposer substrate surrounded by underfill and...
- Patent number 11,488,900
- Issue date Nov 1, 2022
- Unimicron Technology Corp.
- Yan-Jia Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,469,166
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,343,915
- Issue date May 24, 2022
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically robust component carrier with rigid and flexible portions
- Patent number 11,324,126
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,127,664
- Issue date Sep 21, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,089,689
- Issue date Aug 10, 2021
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded organic interposer for high bandwidth
- Patent number 11,063,017
- Issue date Jul 13, 2021
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a partially uncured component carrier body for manufacturing...
- Patent number 10,905,016
- Issue date Jan 26, 2021
- AT & Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate
- Patent number 10,856,412
- Issue date Dec 1, 2020
- TDK ELECTRONICS AG
- Thomas Feichtinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with alternatingly vertically stacked layer struc...
- Patent number 10,834,831
- Issue date Nov 10, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding a component in a printed circuit board
- Patent number 10,779,413
- Issue date Sep 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,748,841
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including sub-circuit board
- Patent number 10,701,806
- Issue date Jun 30, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding into printed circuit board with drilling
- Patent number 10,681,819
- Issue date Jun 9, 2020
- Infineon Technologies Austria AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 10,609,819
- Issue date Mar 31, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Patent number 10,602,606
- Issue date Mar 24, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Band pass filter-based galvanic isolator
- Patent number 10,575,395
- Issue date Feb 25, 2020
- Honeywell International Inc.
- Fouad Nusseibeh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Conductor-structure element having an internal layer substrate lami...
- Patent number 10,555,419
- Issue date Feb 4, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,522,449
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board including sub-circuit board
- Patent number 10,477,683
- Issue date Nov 12, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip card module and method for producing a chip card module
- Patent number 10,440,825
- Issue date Oct 8, 2019
- Infineon Technologies Austria AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board having isolator and bridging element and method of mak...
- Patent number 10,361,151
- Issue date Jul 23, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board having three-layer dielectric body and four-...
- Patent number 10,362,675
- Issue date Jul 23, 2019
- Gigalane Co., Ltd.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with dual stiffeners and dual routing circuitries inte...
- Patent number 10,306,777
- Issue date May 28, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and manufacturing method for the multilayer su...
- Patent number 10,285,269
- Issue date May 7, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...
- Publication number 20240155770
- Publication date May 9, 2024
- Rogers Germany GmbH
- Andreas MEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME
- Publication number 20230276112
- Publication date Aug 31, 2023
- LG Innotek Co., Ltd.
- Seong Su EOM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD WITH EMBEDDED INTERPOSER SUBSTRATE AND METHOD OF FABRI...
- Publication number 20220285255
- Publication date Sep 8, 2022
- Unimicron Technology Corp.
- Yan-Jia Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20210352807
- Publication date Nov 11, 2021
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH
- Publication number 20210327851
- Publication date Oct 21, 2021
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20200381346
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200367361
- Publication date Nov 19, 2020
- Shinko Electric Industries Co., Ltd.
- Tomoharu FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanically Robust Component Carrier With Rigid and Flexible Portions
- Publication number 20200367370
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate
- Publication number 20200296829
- Publication date Sep 17, 2020
- TDK Electronics AG
- Thomas Feichtinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20200083151
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanically Robust Component Carrier With Rigid and Flexible Portions
- Publication number 20200053887
- Publication date Feb 13, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING SUB-CIRCUIT BOARD
- Publication number 20200029435
- Publication date Jan 23, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yong-Ho BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING
- Publication number 20190124773
- Publication date Apr 25, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20190045636
- Publication date Feb 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Alternatingly Vertically Stacked Layer Struc...
- Publication number 20180343751
- Publication date Nov 29, 2018
- Mikael Tuominen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS
- Publication number 20180302988
- Publication date Oct 18, 2018
- MC10, Inc.
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor-Structure Element Having an Internal Layer Substrate Lami...
- Publication number 20180242456
- Publication date Aug 23, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Publication number 20180220526
- Publication date Aug 2, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...
- Publication number 20170303401
- Publication date Oct 19, 2017
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME
- Publication number 20160219699
- Publication date Jul 28, 2016
- GLOBAL UNICHIP CORP.
- Yu-Ru Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...
- Publication number 20140376196
- Publication date Dec 25, 2014
- Volodymyr Karpovych
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140347837
- Publication date Nov 27, 2014
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF A RIGID-FLEXIBLE CIRCUIT BOARD AND RIGID-FLEX...
- Publication number 20140318832
- Publication date Oct 30, 2014
- Yong Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND FABRICATION METHOD THEREFOR
- Publication number 20140318848
- Publication date Oct 30, 2014
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...
- Publication number 20140291001
- Publication date Oct 2, 2014
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS
- Publication number 20140240932
- Publication date Aug 28, 2014
- MC10, Inc.
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME
- Publication number 20140216802
- Publication date Aug 7, 2014
- Yu-Ru Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140144675
- Publication date May 29, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- SHIH-PING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOA...
- Publication number 20140118976
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Partitioned multilayer circuits having adjacent regions with different properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fine feature formation techniques for printed circuit boards

Manufacturing method of package structure

Packages with Si-substrate-free interposer and method forming same

Component embedded in component carrier and having an exposed side...

Wiring board with interposer substrate surrounded by underfill and...

Packages with Si-substrate-free interposer and method forming same

Semiconductor device

Mechanically robust component carrier with rigid and flexible portions

Circuit board and manufacturing method thereof

Fine feature formation techniques for printed circuit boards

Embedded organic interposer for high bandwidth

Using a partially uncured component carrier body for manufacturing...

Substrate

Component carrier with alternatingly vertically stacked layer struc...

Method of manufacturing a component embedded package carrier

Method of embedding a component in a printed circuit board

Packages with Si-substrate-free interposer and method forming same

Printed circuit board including sub-circuit board

Embedding into printed circuit board with drilling

Hybrid printed circuit assembly with low density main core and embe...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

Band pass filter-based galvanic isolator

Conductor-structure element having an internal layer substrate lami...

Packages with Si-substrate-free interposer and method forming same

Printed circuit board including sub-circuit board

Chip card module and method for producing a chip card module

Wiring board having isolator and bridging element and method of mak...

Flexible circuit board having three-layer dielectric body and four-...

Wiring board with dual stiffeners and dual routing circuitries inte...

Multilayer substrate and manufacturing method for the multilayer su...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...

IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME

WIRING BOARD WITH EMBEDDED INTERPOSER SUBSTRATE AND METHOD OF FABRI...

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH

MANUFACTURING METHOD OF PACKAGE STRUCTURE

Packages with Si-Substrate-Free Interposer and Method Forming Same

SEMICONDUCTOR DEVICE

Mechanically Robust Component Carrier With Rigid and Flexible Portions

Substrate

Packages with Si-Substrate-Free Interposer and Method Forming Same

Mechanically Robust Component Carrier With Rigid and Flexible Portions

PRINTED CIRCUIT BOARD INCLUDING SUB-CIRCUIT BOARD

EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING

Component Embedded in Component Carrier and Having an Exposed Side...

Component Carrier With Alternatingly Vertically Stacked Layer Struc...

STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS

Conductor-Structure Element Having an Internal Layer Substrate Lami...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...

SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FABRICATION METHOD OF A RIGID-FLEXIBLE CIRCUIT BOARD AND RIGID-FLEX...

WIRING BOARD AND FABRICATION METHOD THEREFOR

METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...

STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS

SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOA...