Passive alignment, i.e. self alignment

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H01L2224/83143

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83143Passive alignment, i.e. self alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including anisotropic conductive film and method of...
- Patent number 11,864,437
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for assembling a carrier with components, pigment for assemb...
- Patent number 11,127,890
- Issue date Sep 21, 2021
- OSRAM OLED GmbH
- Andreas Ploessl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASICS face to face self assembly
- Patent number 10,770,432
- Issue date Sep 8, 2020
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution deposited magnetically guided chiplet displacement
- Patent number 10,636,837
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,541,224
- Issue date Jan 21, 2020
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing stacked wafer assembly
- Patent number 10,522,503
- Issue date Dec 31, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for self-alignment of integrated circuit dies
- Patent number 10,431,515
- Issue date Oct 1, 2019
- Marvell World Trade Ltd.
- Long-Ching Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring method, manufacturing method, device and electronic ap...
- Patent number 10,319,697
- Issue date Jun 11, 2019
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a three-dimensional bonded semiconductor structur...
- Patent number 10,297,569
- Issue date May 21, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...
- Publication number 20220415847
- Publication date Dec 29, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220271004
- Publication date Aug 25, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...
- Publication number 20220199743
- Publication date Jun 23, 2022
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220059496
- Publication date Feb 24, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASICS FACE TO FACE SELF ASSEMBLY
- Publication number 20190287944
- Publication date Sep 19, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING STACKED WAFER ASSEMBLY
- Publication number 20190081021
- Publication date Mar 14, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
- Publication number 20180358238
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR CHIPS TO A LANDING WAFER
- Publication number 20180130765
- Publication date May 10, 2018
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive with Self-Connecting Interconnects
- Publication number 20180130766
- Publication date May 10, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER-WAFER BONDING
- Publication number 20180082976
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER-WAFER BONDING
- Publication number 20180005978
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transferring Method, Manufacturing Method, Device and Electronic Ap...
- Publication number 20170338199
- Publication date Nov 23, 2017
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPA...
- Publication number 20170330856
- Publication date Nov 16, 2017
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...
- Publication number 20170330857
- Publication date Nov 16, 2017
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER...
- Publication number 20170117248
- Publication date Apr 27, 2017
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS

Passive alignment, i.e. self alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective transfer of micro devices

Electronic device and method of transferring electronic element usi...

Adhesive member, display device, and manufacturing method of displa...

Bonding process with inhibited oxide formation

Display device including anisotropic conductive film and method of...

Electronic device and method of transferring electronic element usi...

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Light emitting device and fluidic manufacture thereof

Chip assembly

Bonding process with inhibited oxide formation

Selective micro device transfer to receiver substrate

Process for manufacturing assembly pads on a carrier for the self-a...

Method for assembling a carrier with components, pigment for assemb...

Light emitting device and fluidic manufacture thereof

Bonding process with inhibited oxide formation

Method for bonding semiconductor chips to a landing wafer

ASICS face to face self assembly

Solution deposited magnetically guided chiplet displacement

Chip assembly

Integrated multi-color light-emitting pixel arrays based devices by...

Bonding process with inhibited oxide formation

Method of manufacturing stacked wafer assembly

Methods and apparatus for self-alignment of integrated circuit dies

Integrated multi-color light-emitting pixel arrays based devices by...

Transferring method, manufacturing method, device and electronic ap...

Method of forming a three-dimensional bonded semiconductor structur...

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

ASICS FACE TO FACE SELF ASSEMBLY

Light Emitting Device and Fluidic Manufacture Thereof

METHOD OF MANUFACTURING STACKED WAFER ASSEMBLY

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

Massively parallel transfer of microLED devices

METHOD FOR BONDING SEMICONDUCTOR CHIPS TO A LANDING WAFER

Adhesive with Self-Connecting Interconnects

METHOD FOR WAFER-WAFER BONDING

METHOD FOR WAFER-WAFER BONDING

Transferring Method, Manufacturing Method, Device and Electronic Ap...

ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPA...

TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...

GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER...