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Passive alignment, i.e. self alignment
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H01L2224/83143
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83143
Passive alignment, i.e. self alignment
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Patents Grants
last 30 patents
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Patent Grant
Selective transfer of micro devices
Patent number
12,075,565
Issue date
Aug 27, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
12,009,339
Issue date
Jun 11, 2024
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
11,923,330
Issue date
Mar 5, 2024
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device including anisotropic conductive film and method of...
Patent number
11,864,437
Issue date
Jan 2, 2024
Samsung Display Co., Ltd.
Joo-nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
11,848,303
Issue date
Dec 19, 2023
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,545
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,547
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,546
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,302
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,306
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device and fluidic manufacture thereof
Patent number
11,721,792
Issue date
Aug 8, 2023
eLux Inc.
Kenji Alexander Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,488,930
Issue date
Nov 1, 2022
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,476,216
Issue date
Oct 18, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
Patent number
11,380,648
Issue date
Jul 5, 2022
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Léa Di Cioccio
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Method for assembling a carrier with components, pigment for assemb...
Patent number
11,127,890
Issue date
Sep 21, 2021
OSRAM OLED GmbH
Andreas Ploessl
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Light emitting device and fluidic manufacture thereof
Patent number
10,930,819
Issue date
Feb 23, 2021
eLux Inc.
Kenji Alexander Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
10,910,341
Issue date
Feb 2, 2021
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding semiconductor chips to a landing wafer
Patent number
10,797,016
Issue date
Oct 6, 2020
Imec VZW
Vikas Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
ASICS face to face self assembly
Patent number
10,770,432
Issue date
Sep 8, 2020
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solution deposited magnetically guided chiplet displacement
Patent number
10,636,837
Issue date
Apr 28, 2020
International Business Machines Corporation
Stephen W. Bedell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
10,636,766
Issue date
Apr 28, 2020
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
Patent number
10,636,838
Issue date
Apr 28, 2020
Shaoher Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
10,541,224
Issue date
Jan 21, 2020
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing stacked wafer assembly
Patent number
10,522,503
Issue date
Dec 31, 2019
Disco Corporation
Kazuma Sekiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for self-alignment of integrated circuit dies
Patent number
10,431,515
Issue date
Oct 1, 2019
Marvell World Trade Ltd.
Long-Ching Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
Patent number
10,325,894
Issue date
Jun 18, 2019
Shaoher Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transferring method, manufacturing method, device and electronic ap...
Patent number
10,319,697
Issue date
Jun 11, 2019
Goertek, Inc.
Quanbo Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a three-dimensional bonded semiconductor structur...
Patent number
10,297,569
Issue date
May 21, 2019
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
Publication number
20240258270
Publication date
Aug 1, 2024
LG Display Co., Ltd.
Sunghwan YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20240128224
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...
Publication number
20220415847
Publication date
Dec 29, 2022
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
Publication number
20220271004
Publication date
Aug 25, 2022
Seoul National University R&DB Foundation
Yongtaek HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220254745
Publication date
Aug 11, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20220216172
Publication date
Jul 7, 2022
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...
Publication number
20220199743
Publication date
Jun 23, 2022
SAMSUNG DISPLAY CO., LTD.
Joo-nyung JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220139856
Publication date
May 5, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220139857
Publication date
May 5, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220130783
Publication date
Apr 28, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
Publication number
20220059496
Publication date
Feb 24, 2022
Seoul National University R&DB Foundation
Yongtaek HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20210327739
Publication date
Oct 21, 2021
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20210327740
Publication date
Oct 21, 2021
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
Publication number
20210243894
Publication date
Aug 5, 2021
VueReal Inc.
Gholamreza Chaji
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20200350281
Publication date
Nov 5, 2020
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
Publication number
20200219848
Publication date
Jul 9, 2020
INFINEON TECHNOLOGIES AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASICS FACE TO FACE SELF ASSEMBLY
Publication number
20190287944
Publication date
Sep 19, 2019
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
Publication number
20190181304
Publication date
Jun 13, 2019
eLux Inc.
Kenji Alexander Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING STACKED WAFER ASSEMBLY
Publication number
20190081021
Publication date
Mar 14, 2019
Disco Corporation
Kazuma Sekiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
Publication number
20180358238
Publication date
Dec 13, 2018
Advanced Semiconductor Engineering, Inc.
Jin-Yuan LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Massively parallel transfer of microLED devices
Publication number
20180190614
Publication date
Jul 5, 2018
Ananda H. Kumar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR BONDING SEMICONDUCTOR CHIPS TO A LANDING WAFER
Publication number
20180130765
Publication date
May 10, 2018
IMEC vzw
Vikas Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive with Self-Connecting Interconnects
Publication number
20180130766
Publication date
May 10, 2018
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR WAFER-WAFER BONDING
Publication number
20180082976
Publication date
Mar 22, 2018
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR WAFER-WAFER BONDING
Publication number
20180005978
Publication date
Jan 4, 2018
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transferring Method, Manufacturing Method, Device and Electronic Ap...
Publication number
20170338199
Publication date
Nov 23, 2017
Goertek, Inc.
Quanbo Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPA...
Publication number
20170330856
Publication date
Nov 16, 2017
Goertek, Inc.
Quanbo Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...
Publication number
20170330857
Publication date
Nov 16, 2017
Goertek, Inc.
Quanbo Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER...
Publication number
20170117248
Publication date
Apr 27, 2017
SKYWORKS SOLUTIONS, INC.
Hong Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...
Publication number
20170069595
Publication date
Mar 9, 2017
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS