Passive alignment, i.e. self alignment

Industry

CPC
H01L2224/95143

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/95143Passive alignment, i.e. self alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated emissive element for fluidic assembly
- Patent number 10,777,714
- Issue date Sep 15, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating emissive elements for fluidic assembly
- Patent number 10,749,083
- Issue date Aug 18, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated fluid assembly emissive elements
- Patent number 10,516,084
- Issue date Dec 24, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits
- Patent number 9,572,249
- Issue date Feb 14, 2017
- Nthdegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip having a water-repellent obverse surf...
- Patent number 9,018,042
- Issue date Apr 28, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Arase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device...
- Patent number 8,883,566
- Issue date Nov 11, 2014
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device...
- Patent number 8,729,698
- Issue date May 20, 2014
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for disposing a component
- Patent number 8,414,976
- Issue date Apr 9, 2013
- Panasonic Corporation
- Hidekazu Arase
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of device assembly for a generalization of three-dimensional me...
- Patent number 8,349,653
- Issue date Jan 8, 2013
- Maxim Integrated Products, Inc.
- Pirooz Parvarandeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20140268591
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20140220740
- Publication date Aug 7, 2014
- Rohm Co., Ltd.
- Tadahiro MORIFUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CHIP HAVING A WATER-REPELLENT OBVERSE SURF...
- Publication number 20140080261
- Publication date Mar 20, 2014
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20120269971
- Publication date Oct 25, 2012
- PANASONIC CORPORATION
- Hidekazu ARASE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
USE OF DEVICE ASSEMBLY FOR A GENERALIZATION OF THREE-DIMENSIONAL ME...
- Publication number 20110300668
- Publication date Dec 8, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Pirooz Parvarandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20110074017
- Publication date Mar 31, 2011
- Rohm Co., Ltd.
- Tadahiro MORIFUJI
- H01 - BASIC ELECTRIC ELEMENTS

Passive alignment, i.e. self alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Encapsulated light emitting diodes for selective fluidic assembly

Method for forming complex electronic circuits by interconnecting g...

Encapsulated emissive element for fluidic assembly

Method for encapsulating emissive elements for fluidic assembly

Encapsulated fluid assembly emissive elements

Printing complex electronic circuits using a printable solution def...

Printing complex electronic circuits using a patterned hydrophobic...

Printing complex electronic circuits

Method for fabricating a chip having a water-repellent obverse surf...

Method of manufacturing semiconductor device, semiconductor device...

Method of manufacturing semiconductor device, semiconductor device...

Method for disposing a component

Use of device assembly for a generalization of three-dimensional me...

Patents Applicationslast 30 patents

PRINTING COMPLEX ELECTRONIC CIRCUITS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

METHOD FOR FABRICATING A CHIP HAVING A WATER-REPELLENT OBVERSE SURF...

METHOD FOR DISPOSING A COMPONENT

USE OF DEVICE ASSEMBLY FOR A GENERALIZATION OF THREE-DIMENSIONAL ME...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...