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Semiconductor module
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Patent number 11,955,451
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Issue date Apr 9, 2024
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Rohm Co., Ltd.
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Kenji Hayashi
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor module
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Patent number 11,955,452
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Issue date Apr 9, 2024
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Rohm Co., Ltd.
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Kenji Hayashi
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H01 - BASIC ELECTRIC ELEMENTS
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Contact pad for semiconductor device
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Patent number 11,901,320
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Issue date Feb 13, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chang-Chia Huang
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 11,887,902
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Issue date Jan 30, 2024
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Fuji Electric Co., Ltd.
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Satoshi Kaneko
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 11,876,062
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Issue date Jan 16, 2024
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Mitsubishi Electric Corporation
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Tsuyoshi Osaga
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H01 - BASIC ELECTRIC ELEMENTS
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Electronic component
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Patent number 11,817,846
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Issue date Nov 14, 2023
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Murata Manufacturing Co., Ltd.
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Yasuaki Shin
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,784,148
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Issue date Oct 10, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd
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Chia-Kuei Hsu
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H01 - BASIC ELECTRIC ELEMENTS