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H05K2203/1492

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1492Periodical treatments

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Single step electrolytic method of filling through holes in printed...
- Patent number 11,746,433
- Issue date Sep 5, 2023
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for plating printed circuit board and printed circuit board...
- Patent number 11,096,291
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Chan Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pulsed-mode direct-write laser metallization
- Patent number 10,622,244
- Issue date Apr 14, 2020
- Orbotech Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling through-holes
- Patent number 10,154,598
- Issue date Dec 11, 2018
- Rohm and Haas Electronic Materials LLC
- Nagarajan Jayaraju
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 10,076,044
- Issue date Sep 11, 2018
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming thin film conductors on a substrate
- Patent number 9,743,516
- Issue date Aug 22, 2017
- NCC Nano, LLC
- Andrew E. Edd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Galvanic process for filling through-holes with metals, in particul...
- Patent number 9,526,183
- Issue date Dec 20, 2016
- Atotech Deutschland GmbH
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanic process for filling through-holes with metals, in particul...
- Patent number 9,445,510
- Issue date Sep 13, 2016
- Atotech Deutschland GmbH
- Bert Reents
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,313,901
- Issue date Apr 12, 2016
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,222,186
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Satoru Kawai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of etching metal layer
- Patent number 9,150,969
- Issue date Oct 6, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic method for filling holes and cavities with metals
- Patent number 8,784,634
- Issue date Jul 22, 2014
- Atotech Deutschland GmbH
- Bert Reents
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a through hole electrode substrate
- Patent number 8,637,397
- Issue date Jan 28, 2014
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin and tin alloy electroplating method with controlled internal st...
- Patent number 8,603,315
- Issue date Dec 10, 2013
- Faraday Technology, Inc.
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole in pad thermal management
- Patent number 8,575,492
- Issue date Nov 5, 2013
- Honeywell International Inc.
- Lee H. Tullidge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board using bump and method for manufacturing thereof
- Patent number 8,549,744
- Issue date Oct 8, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder feeder, printer, and printing method
- Patent number 8,342,381
- Issue date Jan 1, 2013
- Yamaha Hatsudoki Kabushiki Kaisha
- Kouichi Sumioka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Through hole electrode substrate with different area weighted avera...
- Patent number 8,288,772
- Issue date Oct 16, 2012
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for inhibiting electromigration-induced phase segregation in...
- Patent number 8,207,469
- Issue date Jun 26, 2012
- Yuan Ze University
- Cheng-En Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing an efficient thermal transfer through a printe...
- Patent number 8,112,884
- Issue date Feb 14, 2012
- Honeywell International Inc.
- Lee H. Tullidge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 8,065,794
- Issue date Nov 29, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid cleaning apparatus for cleaning printed circuit boards
- Patent number 7,951,244
- Issue date May 31, 2011
- Illinois Tool Works Inc.
- Eric Becker
- B08 - CLEANING
Information Patent Grant
Electroplating process of electroplating an elecrically conductive...
- Patent number 7,827,680
- Issue date Nov 9, 2010
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 7,691,189
- Issue date Apr 6, 2010
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 7,230,188
- Issue date Jun 12, 2007
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic methods and apparatus for mounting and demounting par...
- Patent number 7,191,930
- Issue date Mar 20, 2007
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic methods and apparatus for mounting and demounting par...
- Patent number 6,871,777
- Issue date Mar 29, 2005
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen printing method including variable speed plate separating op...
- Patent number 6,868,780
- Issue date Mar 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yuji Otake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sequential electrodeposition of metals using modulated electric fie...
- Patent number 6,863,793
- Issue date Mar 8, 2005
- Faraday Technology Marketing Group, LLC
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM
- Publication number 20230240022
- Publication date Jul 27, 2023
- IO TECH GROUP LTD.
- Ralph S. Birnbaum
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...
- Publication number 20210329794
- Publication date Oct 21, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Jong Chan CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...
- Publication number 20200413548
- Publication date Dec 31, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jong Chan CHOI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PULSED-MODE DIRECT-WRITE LASER METALLIZATION
- Publication number 20170178946
- Publication date Jun 22, 2017
- ORBOTECH LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING METAL LAYER
- Publication number 20140251945
- Publication date Sep 11, 2014
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING THIN FILM CONDUCTORS ON A SUBSTRATE
- Publication number 20140154427
- Publication date Jun 5, 2014
- NCC NANO, LLC
- ANDREW E. EDD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A THROUGH HOLE ELECTRODE SUBSTRATE
- Publication number 20120329276
- Publication date Dec 27, 2012
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLE IN PAD THERMAL MANAGEMENT
- Publication number 20120138341
- Publication date Jun 7, 2012
- Honeywell International Inc.
- Lee H. Tullidge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER FEEDER, PRINTER, AND PRINTING METHOD
- Publication number 20120138664
- Publication date Jun 7, 2012
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Kouichi Sumioka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for Manufacturing Circuit Board and Method for Manufacturing...
- Publication number 20120047731
- Publication date Mar 1, 2012
- Kyocera Corporation
- Tomohisa Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH HOLE ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING THE THRO...
- Publication number 20110062594
- Publication date Mar 17, 2011
- DAI NIPPON PRINTING, CO., LTD.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Deposition
- Publication number 20100044079
- Publication date Feb 25, 2010
- Lex Kosowsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Deposition
- Publication number 20100044080
- Publication date Feb 25, 2010
- Lex Kosowsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic Method For Filling Holes and Cavities With Metals
- Publication number 20090301889
- Publication date Dec 10, 2009
- Atotech Deutschland GmbH
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for inhibiting electromigration-induced phase segregation in...
- Publication number 20090294409
- Publication date Dec 3, 2009
- Yuan-Ze University
- Cheng-En Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Galvanic process for filling through-holes with metals, in particul...
- Publication number 20090236230
- Publication date Sep 24, 2009
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIQUID CLEANING APPARATUS FOR CLEANING PRINTED CIRCUIT BOARDS
- Publication number 20090178695
- Publication date Jul 16, 2009
- Illinois Tool Works Inc.
- Eric Becker
- B08 - CLEANING
Information Patent Application
Method and Device for a Forced Wet-Chemical Treatment of Surfaces
- Publication number 20090179006
- Publication date Jul 16, 2009
- LP VERMARKTUNGS GMBH & CO KG
- Marcus Lang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20090145652
- Publication date Jun 11, 2009
- IBIDEN CO., LTD.
- Honchin En
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HOLE IN PAD THERMAL MANAGEMENT
- Publication number 20090090540
- Publication date Apr 9, 2009
- Honeywell International Inc.
- Lee H. Tullidge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION
- Publication number 20080271995
- Publication date Nov 6, 2008
- Sergey Savastiouk
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic plating method
- Publication number 20080023218
- Publication date Jan 31, 2008
- Keisuke Nishu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20070266886
- Publication date Nov 22, 2007
- IBIDEN CO., LTD.
- Honchin En
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed circuit board using bump and method for manufacturing thereof
- Publication number 20070235220
- Publication date Oct 11, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive polymers for the electroplating
- Publication number 20070190794
- Publication date Aug 16, 2007
- Virgin Islands Microsystems, Inc.
- Jonathan Gorrell
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN AND TIN ALLOY ELECTROPLATING METHOD WITH CONTROLLED INTERNAL ST...
- Publication number 20070158204
- Publication date Jul 12, 2007
- FARADAY TECHNOLOGY, INC.
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrostatic methods and apparatus for mounting and demounting par...
- Publication number 20070145103
- Publication date Jun 28, 2007
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrochemical etching of circuitry for high density interconnect...
- Publication number 20060207888
- Publication date Sep 21, 2006
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of electroplating a workpiece having high-aspect ratio holes
- Publication number 20060151328
- Publication date Jul 13, 2006
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Periodical treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing sequences for high density interconnect printed circu...

Single step electrolytic method of filling through holes in printed...

Method for plating printed circuit board and printed circuit board...

Pulsed-mode direct-write laser metallization

Filling through-holes

Method for manufacturing multilayer wiring substrate

Method for forming thin film conductors on a substrate

Galvanic process for filling through-holes with metals, in particul...

Galvanic process for filling through-holes with metals, in particul...

Printed wiring board

Method for manufacturing printed wiring board

Method of etching metal layer

Electrolytic method for filling holes and cavities with metals

Method for manufacturing a through hole electrode substrate

Tin and tin alloy electroplating method with controlled internal st...

Hole in pad thermal management

Printed circuit board using bump and method for manufacturing thereof

Solder feeder, printer, and printing method

Through hole electrode substrate with different area weighted avera...

Method for inhibiting electromigration-induced phase segregation in...

Method for providing an efficient thermal transfer through a printe...

Printed wiring board and its manufacturing method

Liquid cleaning apparatus for cleaning printed circuit boards

Electroplating process of electroplating an elecrically conductive...

Printed wiring board and its manufacturing method

Printed wiring board and its manufacturing method

Electrostatic methods and apparatus for mounting and demounting par...

Electrostatic methods and apparatus for mounting and demounting par...

Screen printing method including variable speed plate separating op...

Sequential electrodeposition of metals using modulated electric fie...

Patents Applicationslast 30 patents

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...

PULSED-MODE DIRECT-WRITE LASER METALLIZATION

METHOD OF ETCHING METAL LAYER

METHOD FOR FORMING THIN FILM CONDUCTORS ON A SUBSTRATE

METHOD FOR MANUFACTURING A THROUGH HOLE ELECTRODE SUBSTRATE

HOLE IN PAD THERMAL MANAGEMENT

SOLDER FEEDER, PRINTER, AND PRINTING METHOD

Method for Manufacturing Circuit Board and Method for Manufacturing...

THROUGH HOLE ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING THE THRO...

Metal Deposition

Metal Deposition

Electrolytic Method For Filling Holes and Cavities With Metals

Method for inhibiting electromigration-induced phase segregation in...

Galvanic process for filling through-holes with metals, in particul...

LIQUID CLEANING APPARATUS FOR CLEANING PRINTED CIRCUIT BOARDS

Method and Device for a Forced Wet-Chemical Treatment of Surfaces

PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

HOLE IN PAD THERMAL MANAGEMENT

AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION

Electrolytic plating method

PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

Printed circuit board using bump and method for manufacturing thereof

Conductive polymers for the electroplating

TIN AND TIN ALLOY ELECTROPLATING METHOD WITH CONTROLLED INTERNAL ST...

Electrostatic methods and apparatus for mounting and demounting par...

Electrochemical etching of circuitry for high density interconnect...

Method of electroplating a workpiece having high-aspect ratio holes