Peripheral circuit region

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H01L27/11573

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11573Peripheral circuit region

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices and related methods of forming microelectro...
- Patent number 11,690,234
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,683,934
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Young-Jin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory using SOI structures and methods
- Patent number 11,678,491
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,678,488
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active protection circuits for semiconductor devices
- Patent number 11,676,917
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including separated epitaxial layers
- Patent number 11,672,121
- Issue date Jun 6, 2023
- Renesas Electronics Corporation
- Tadashi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense line structures in capacitive sense NAND memory
- Patent number 11,670,379
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,672,114
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for manufacturing same
- Patent number 11,672,117
- Issue date Jun 6, 2023
- Kioxia Corporation
- Kotaro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage CMOS with co-planar upper gate surfaces for embedded n...
- Patent number 11,672,124
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,665,904
- Issue date May 30, 2023
- SK hynix Inc.
- Jung Ryul Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory
- Patent number 11,665,907
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Kyung-Hwa Yun
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices
- Patent number 11,664,362
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory device having an insulator layer for improved yield
- Patent number 11,665,906
- Issue date May 30, 2023
- Kioxia Corporation
- Tomoya Inden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and photomask
- Patent number 11,665,898
- Issue date May 30, 2023
- Kioxia Corporation
- Daisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a contact structure that contacts a...
- Patent number 11,659,713
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Joo Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors for high voltage applications
- Patent number 11,658,208
- Issue date May 23, 2023
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 11,658,132
- Issue date May 23, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including staircase structures
- Patent number 11,653,499
- Issue date May 16, 2023
- Micron Technology, Inc.
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with multiple tiers, and methods
- Patent number 11,653,497
- Issue date May 16, 2023
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical memory devices with bending prevention layers
- Patent number 11,652,068
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Sunil Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,647,630
- Issue date May 9, 2023
- Kioxia Corporation
- Yumi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device, measuring method, and semiconductor storage device
- Patent number 11,646,211
- Issue date May 9, 2023
- Kioxia Corporation
- Hiroyuki Tanizaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,646,265
- Issue date May 9, 2023
- SK hynix Inc.
- Dong Hyuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-fill layers, methods of forming the same, and semiconductor dev...
- Patent number 11,640,922
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Miso Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded sonos with a high-K metal gate and manufacturing methods o...
- Patent number 11,641,745
- Issue date May 2, 2023
- LONGITUDE FLASH MEMORY SOLUTIONS LTD.
- Krishnaswamy Ramkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,641,738
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Woosung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having selection line stud connected to string...
- Patent number 11,637,117
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Hyojoon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including trench-isolated memory pl...
- Patent number 11,631,690
- Issue date Apr 18, 2023
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234528
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Hitoshi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240170393
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY, AND ME...
- Publication number 20240164095
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yonggang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136419
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Hitoshi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITORS WITH 3D NON-VOLATILE ARRAY
- Publication number 20240114685
- Publication date Apr 4, 2024
- Western Digital Technologies, Inc.
- Liang Li
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105622
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105623
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NAND WITH BACKSIDE STACKING
- Publication number 20240099011
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240098989
- Publication date Mar 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhengliang Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...
- Publication number 20240090217
- Publication date Mar 14, 2024
- SANDISK TECHNOLOGIES LLC
- Kyohei NABESAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071816
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...
- Publication number 20240074171
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE TRANSISTOR DEVICE AND METHOD
- Publication number 20240064987
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Toshihiko Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAGE BUFFER FOR MEMORY DEVICES
- Publication number 20240064988
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Md Zahid Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240055353
- Publication date Feb 15, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES, SYSTEMS, AND METHODS FOR FORMING...
- Publication number 20240040789
- Publication date Feb 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wenshan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STACKS FOR CMOS SCALING
- Publication number 20240040790
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DIE HAVING A UNIQUE STORAGE CAPACITY
- Publication number 20240029789
- Publication date Jan 25, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023329
- Publication date Jan 18, 2024
- SK HYNIX INC.
- Jae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20240021521
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Collin Howder
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240021247
- Publication date Jan 18, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yujun Huang
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20240021219
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...
- Publication number 20230411306
- Publication date Dec 21, 2023
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLASH MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230413552
- Publication date Dec 21, 2023
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYS...
- Publication number 20230395509
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20230387056
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Yunsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELE...
- Publication number 20230387023
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE
- Publication number 20230389316
- Publication date Nov 30, 2023
- SK HYNIX INC.
- Byung In LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230389310
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Keunnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230380162
- Publication date Nov 23, 2023
- SK HYNIX INC.
- Yeon Seob IM
- H01 - BASIC ELECTRIC ELEMENTS

Peripheral circuit region

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices and related methods of forming microelectro...

Nonvolatile memory device and method for fabricating the same

Embedded memory using SOI structures and methods

Semiconductor device

Three-dimensional semiconductor memory device

Active protection circuits for semiconductor devices

Semiconductor memory device including separated epitaxial layers

Sense line structures in capacitive sense NAND memory

Memory arrays and methods used in forming a memory array comprising...

Semiconductor memory device and method for manufacturing same

High voltage CMOS with co-planar upper gate surfaces for embedded n...

Semiconductor device and manufacturing method of the same

Non-volatile memory

Semiconductor devices

Vertical memory device having an insulator layer for improved yield

Semiconductor device and photomask

Semiconductor devices including a contact structure that contacts a...

Thin film transistors for high voltage applications

Integrated assemblies

Semiconductor devices including staircase structures

Semiconductor apparatus with multiple tiers, and methods

Vertical memory devices with bending prevention layers

Semiconductor memory device

Measuring device, measuring method, and semiconductor storage device

Semiconductor device

Gap-fill layers, methods of forming the same, and semiconductor dev...

Embedded sonos with a high-K metal gate and manufacturing methods o...

Three-dimensional semiconductor memory device

Semiconductor device having selection line stud connected to string...

Three-dimensional memory device including trench-isolated memory pl...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY, AND ME...

SEMICONDUCTOR DEVICE

CONFIGURABLE CAPACITORS WITH 3D NON-VOLATILE ARRAY

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

VERTICAL NAND WITH BACKSIDE STACKING

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...

STAIRCASE FORMATION IN A MEMORY ARRAY

BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...

SILICIDE TRANSISTOR DEVICE AND METHOD

PAGE BUFFER FOR MEMORY DEVICES

CONTACT STRUCTURE AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES, SYSTEMS, AND METHODS FOR FORMING...

METAL GATE STACKS FOR CMOS SCALING

MEMORY DIE HAVING A UNIQUE STORAGE CAPACITY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...

3D FLASH MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYS...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELE...

MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR MEMORY DEVICE