Peripheral marks on wafers

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H01L2223/54493

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/54493Peripheral marks on wafers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Aligner apparatus
- Patent number 12,148,646
- Issue date Nov 19, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for annealing die and wafer
- Patent number 12,051,603
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing an epitaxial layer on a front side of a semic...
- Patent number 11,982,015
- Issue date May 14, 2024
- Siltronic AG
- Joerg Haberecht
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor packages
- Patent number 11,955,435
- Issue date Apr 9, 2024
- SK hynix Inc.
- Ki Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Photomask, display device, and manufacturing method thereof
- Patent number 11,923,383
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Dong Hee Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
- Patent number 11,901,171
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer positioning method and apparatus
- Patent number 11,854,853
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer overlay marks, overlay measurement systems, and related methods
- Patent number 11,784,077
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Denzil S. Frost
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer notch leveling device
- Patent number 11,721,570
- Issue date Aug 8, 2023
- Sanwa Engineering Corp.
- Min-Chih Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method for fabricating the same
- Patent number 11,640,943
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Jung-A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier and method
- Patent number 11,535,952
- Issue date Dec 27, 2022
- Infineon Technologies Americas Corp.
- Mihir Tungare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with indications of die-specific information
- Patent number 11,532,490
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Federico Pio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,508,670
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pu-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising vertically-stacked decks
- Patent number 11,410,980
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Susceptor for holding a semiconductor wafer having an orientation n...
- Patent number 11,380,621
- Issue date Jul 5, 2022
- Siltronic AG
- Reinhard Schauer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electromagnetic radiation detector based on wafer bonding
- Patent number 11,367,747
- Issue date Jun 21, 2022
- Hans Von Känel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making aluminum nitride wafer and aluminum nitride wafer...
- Patent number 11,355,448
- Issue date Jun 7, 2022
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- B24 - GRINDING POLISHING
Information Patent Grant
Alignment mark, substrate and manufacturing method therefor, and ex...
- Patent number 11,315,882
- Issue date Apr 26, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Qinglin Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring wafer, method for transferring wafer usi...
- Patent number 11,315,817
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Euijin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method and cutting apparatus
- Patent number 11,217,466
- Issue date Jan 4, 2022
- Disco Corporation
- Yunfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 11,211,338
- Issue date Dec 28, 2021
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 11,177,148
- Issue date Nov 16, 2021
- Disco Corporation
- Tsutomu Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer jig with identification mark
- Patent number 11,177,149
- Issue date Nov 16, 2021
- Disco Corporation
- Zhong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate, laminated substrate, laminated substrate manufactu...
- Patent number 11,133,215
- Issue date Sep 28, 2021
- AGC Inc.
- Yu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer method and substrate transfer apparatus
- Patent number 11,127,614
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Atsushi Kawabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for arranging two substrates
- Patent number 11,121,091
- Issue date Sep 14, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selectively forming identification mark on semiconducto...
- Patent number 11,121,093
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yue-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...
- Publication number 20240347355
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER
- Publication number 20240274431
- Publication date Aug 15, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE...
- Publication number 20240231234
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Yasuhiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTOMASK, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240170504
- Publication date May 23, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dong Hee SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Positioning Method and Apparatus
- Publication number 20240096677
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR DYNAMICALLY PROVISIONING CYBER TRAINING ENVIRONMENTS
- Publication number 20230335425
- Publication date Oct 19, 2023
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230253439
- Publication date Aug 10, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Liliang GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230187221
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Takane YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION
- Publication number 20230121141
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- Federico Pio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Carrier and Method
- Publication number 20230093855
- Publication date Mar 30, 2023
- Infineon Technologies Americas Corp.
- Mihir Tungare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230048228
- Publication date Feb 16, 2023
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WAFER
- Publication number 20230051546
- Publication date Feb 16, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takeshi HISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNER APPARATUS
- Publication number 20220415690
- Publication date Dec 29, 2022
- KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Haruhiko TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Vertically-Stacked Decks
- Publication number 20220344320
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRINTING LASER MARK AND METHOD OF PRODUCING LASER-MARKED...
- Publication number 20220331906
- Publication date Oct 20, 2022
- SUMCO CORPORATION
- Yoichiro HIRAKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Positioning Method and Apparatus
- Publication number 20220293448
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR DEPOSITING AN EPITAXIAL LAYER ON A FRONT SIDE OF A SEMIC...
- Publication number 20220267926
- Publication date Aug 25, 2022
- Siltronic AG
- Joerg HABERECHT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER TRANSFER APPARATUS
- Publication number 20220208588
- Publication date Jun 30, 2022
- Disco Corporation
- Yoshinori KAKINUMA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHID...
- Publication number 20220189883
- Publication date Jun 16, 2022
- JX NIPPON MINING & METALS CORPORATION
- Kenya ITANI
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING THE SAME
- Publication number 20220139841
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Jung-A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Notch Leveling Device
- Publication number 20220028717
- Publication date Jan 27, 2022
- Sanwa Engineering Corp.
- Min-Chih Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE, LAMINATED SUBSTRATE, LAMINATED SUBSTRATE MANUFACTU...
- Publication number 20210366760
- Publication date Nov 25, 2021
- AGC Inc.
- Yu Hanawa
- B32 - LAYERED PRODUCTS
Information Patent Application
PHOTOMASK, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20210305287
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Dong Hee SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20210301416
- Publication date Sep 30, 2021
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ALUMINUM NITRIDE WAFER AND ALUMINUM NITRIDE WAFER...
- Publication number 20210287996
- Publication date Sep 16, 2021
- Hong Chuang Applied Technology Co., Ltd
- Yan-Kai ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ANNEALING DIE AND WAFER
- Publication number 20210257230
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING WAFER, METHOD FOR TRANSFERRING WAFER USI...
- Publication number 20210098274
- Publication date Apr 1, 2021
- Samsung Electronics Co., Ltd.
- Euijin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TRANSFER APPARATUS
- Publication number 20210050244
- Publication date Feb 18, 2021
- Disco Corporation
- Yoshinori KAKINUMA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Integrated Assemblies Comprising Vertically-Stacked Decks
- Publication number 20210050338
- Publication date Feb 18, 2021
- Micron Technology, Inc.
- Werner Juengling
- G11 - INFORMATION STORAGE

Peripheral marks on wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Aligner apparatus

Apparatus for stacking substrates and method for the same

Method of printing laser mark and method of producing laser-marked...

System and method for annealing die and wafer

Method for depositing an epitaxial layer on a front side of a semic...

Semiconductor packages

Electroplating apparatus and electroplating method

Photomask, display device, and manufacturing method thereof

Integrated aligned stealth laser with blade and grinding apparatus...

Wafer positioning method and apparatus

Wafer overlay marks, overlay measurement systems, and related methods

Wafer notch leveling device

Semiconductor wafer and method for fabricating the same

Wafer carrier and method

Semiconductor packages with indications of die-specific information

Semiconductor structure and method for manufacturing the same

Integrated assemblies comprising vertically-stacked decks

Susceptor for holding a semiconductor wafer having an orientation n...

Electromagnetic radiation detector based on wafer bonding

Method for making aluminum nitride wafer and aluminum nitride wafer...

Alignment mark, substrate and manufacturing method therefor, and ex...

Apparatus for transferring wafer, method for transferring wafer usi...

Wafer processing method and cutting apparatus

Apparatus for stacking substrates and method for the same

Laser processing apparatus

Wafer jig with identification mark

Glass substrate, laminated substrate, laminated substrate manufactu...

Substrate transfer method and substrate transfer apparatus

Method for arranging two substrates

Methods for selectively forming identification mark on semiconducto...

Patents Applicationslast 30 patents

METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...

WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

PHOTOMASK, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF

Wafer Positioning Method and Apparatus

SYSTEM FOR DYNAMICALLY PROVISIONING CYBER TRAINING ENVIRONMENTS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION

Wafer Carrier and Method

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND WAFER

ALIGNER APPARATUS

Integrated Assemblies Comprising Vertically-Stacked Decks

METHOD OF PRINTING LASER MARK AND METHOD OF PRODUCING LASER-MARKED...

Wafer Positioning Method and Apparatus

METHOD FOR DEPOSITING AN EPITAXIAL LAYER ON A FRONT SIDE OF A SEMIC...

WAFER TRANSFER APPARATUS

INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHID...

SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING THE SAME

Wafer Notch Leveling Device

GLASS SUBSTRATE, LAMINATED SUBSTRATE, LAMINATED SUBSTRATE MANUFACTU...

PHOTOMASK, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHOD FOR MAKING ALUMINUM NITRIDE WAFER AND ALUMINUM NITRIDE WAFER...

SYSTEM AND METHOD FOR ANNEALING DIE AND WAFER

APPARATUS FOR TRANSFERRING WAFER, METHOD FOR TRANSFERRING WAFER USI...

WAFER TRANSFER APPARATUS

Integrated Assemblies Comprising Vertically-Stacked Decks