Permanent masks, i.e. masks left in the finished device

Industry

CPC
H01L2224/1148

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1148Permanent masks, i.e. masks left in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,081,475
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,872,870
- Issue date Dec 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having tapered edge walls
- Patent number 10,825,761
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing semiconductor devices
- Patent number 10,825,762
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,714,442
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads with surrounding fill lines
- Patent number 10,566,300
- Issue date Feb 18, 2020
- GLOBALFOUNDRIES Inc.
- Scott Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,566,302
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a semiconductor device and interconnection...
- Patent number 10,388,619
- Issue date Aug 20, 2019
- Amkor Technology, Inc.
- Sung Woong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,325,872
- Issue date Jun 18, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,262,964
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electronic package
- Patent number 10,224,243
- Issue date Mar 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Open-passivation ball grid array pads
- Patent number 10,103,116
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided vertical semiconductor device with thinned substrate
- Patent number 10,079,230
- Issue date Sep 18, 2018
- QUALCOMM Incorporated
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist cleaning composition used in photolithography and a met...
- Patent number 10,072,237
- Issue date Sep 11, 2018
- VERSUM MATERIALS US, LLC
- Randy Li-Kai Chang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,037,958
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,953,948
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 9,935,070
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder in cavity interconnection technology
- Patent number 9,848,490
- Issue date Dec 19, 2017
- Intel Corporation
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE
- Publication number 20240006371
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20210351173
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20190259723
- Publication date Aug 22, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20190244920
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS WITH SURROUNDING FILL LINES
- Publication number 20190229079
- Publication date Jul 25, 2019
- GLOBALFOUNDRIES INC.
- Scott Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20180374751
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180337091
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR T...
- Publication number 20180331062
- Publication date Nov 15, 2018
- Alexander SCHMAJEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180315655
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180269173
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20180226373
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180108630
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING ELECTRONIC PACKAGE
- Publication number 20180068896
- Publication date Mar 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20170309585
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN-PASSIVATION BALL GRID ARRAY PADS
- Publication number 20170221846
- Publication date Aug 3, 2017
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20170170161
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160190080
- Publication date Jun 30, 2016
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20160155667
- Publication date Jun 2, 2016
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20160118359
- Publication date Apr 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES, METHODS OF MANUFAC...
- Publication number 20150279798
- Publication date Oct 1, 2015
- SK HYNIX INC.
- Wan Choon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF
- Publication number 20140362550
- Publication date Dec 11, 2014
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20140361432
- Publication date Dec 11, 2014
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Fabricating Fine-Pitch Micro-Bumps
- Publication number 20140342545
- Publication date Nov 20, 2014
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Bump Bonding
- Publication number 20140264796
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF WIRING STRUCTURE FOR IMPROVING CROWN-LIKE DEFECT
- Publication number 20140251946
- Publication date Sep 11, 2014
- XINTEC INC.
- Yi-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20140252601
- Publication date Sep 11, 2014
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Permanent masks, i.e. masks left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit structure and method for reducing polymer layer...

Semiconductor chip with patterned underbump metallization and polym...

Integrated circuit structure and method for reducing polymer layer...

Interconnect structures and methods of forming same

Fabrication method of semiconductor structure

Electronic devices having tapered edge walls

Methods of processing semiconductor devices

Semiconductor devices, methods of manufacture thereof, and semicond...

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

Fabrication of solder balls with injection molded solder

Interconnect structures and methods of forming same

3D integration method using SOI substrates and structures produced...

Bond pads with surrounding fill lines

Fabrication of solder balls with injection molded solder

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Method of manufacturing a semiconductor device and interconnection...

Fabrication method of semiconductor structure

Interconnect structures and methods of forming same

Method of fabricating electronic package

Chip mounting structure

Open-passivation ball grid array pads

Double-sided vertical semiconductor device with thinned substrate

Photoresist cleaning composition used in photolithography and a met...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Fabrication of solder balls with injection molded solder

Pillar design for conductive bump

Interconnect structures and methods of forming same

Chip mounting structure

Solder in cavity interconnection technology

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE

Integrated Circuit Structure and Method for Reducing Polymer Layer...

Interconnect Structures and Methods of Forming Same

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

Interconnect Structures and Methods of Forming Same

BOND PADS WITH SURROUNDING FILL LINES

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR T...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

Interconnect Structures and Methods of Forming Same

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

CHIP MOUNTING STRUCTURE

METHOD OF FABRICATING ELECTRONIC PACKAGE

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

OPEN-PASSIVATION BALL GRID ARRAY PADS

Integrated Circuit Structure and Method for Reducing Polymer Layer...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

Interconnect Structures and Methods of Forming Same

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES, METHODS OF MANUFAC...

SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF

Pillar Design for Conductive Bump

Techniques for Fabricating Fine-Pitch Micro-Bumps

Insulated Bump Bonding

FABRICATION METHOD OF WIRING STRUCTURE FOR IMPROVING CROWN-LIKE DEFECT

Interconnect Structures and Methods of Forming Same