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H01L2224/0362
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/0362
Photolithography
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package structure, electronic substrate and method of ma...
Patent number
11,978,706
Issue date
May 7, 2024
Advanced Semiconductor Engineering, Inc.
Shun-Tsat Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate and method for manufacturing the same, and display...
Patent number
11,901,375
Issue date
Feb 13, 2024
ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
Yongbo Ju
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die including stress-resistant bonding structures and...
Patent number
11,887,955
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate, method for fabricating same, and display device
Patent number
11,869,904
Issue date
Jan 9, 2024
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Xiaobo Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polyimide profile control
Patent number
11,855,015
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Chi Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with air gap
Patent number
11,830,837
Issue date
Nov 28, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor devices and methods of forming same
Patent number
11,823,912
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
Patent number
11,817,461
Issue date
Nov 14, 2023
TCL China Star Optoelectronics Technology Co., Ltd.
Maoxia Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating integrated circuit device
Patent number
11,804,458
Issue date
Oct 31, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Qiong Zhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display backboard and manufacturing method thereof and display device
Patent number
11,764,343
Issue date
Sep 19, 2023
BOE Technology Group Co., Ltd.
Zhiwei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
11,742,305
Issue date
Aug 29, 2023
Lapis Semiconductor Co., Ltd.
Masanori Shindo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
Patent number
11,742,309
Issue date
Aug 29, 2023
Micron Technology, Inc.
Ko Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
Patent number
11,728,297
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for semiconductor packaging
Patent number
11,705,414
Issue date
Jul 18, 2023
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) device including a force mitigation system...
Patent number
11,682,642
Issue date
Jun 20, 2023
Microchip Technology Incorporated
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
Patent number
11,670,510
Issue date
Jun 6, 2023
TESSERA LLC
Sean D. Burns
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,652,072
Issue date
May 16, 2023
Renesas Electronics Corporation
Takashi Tonegawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
Patent number
11,640,948
Issue date
May 2, 2023
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-resist island forming via method and apparatus
Patent number
11,640,947
Issue date
May 2, 2023
NXP B.V.
Kuan-Hsiang Mao
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Semiconductor device packages including an inductor and a capacitor
Patent number
11,637,172
Issue date
Apr 25, 2023
Advanced Semiconductor Engineering, Inc.
Chien-Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure of a semiconductor chip and semiconductor...
Patent number
11,626,370
Issue date
Apr 11, 2023
Samsung Electronics Co., Ltd.
Keumhee Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and power amplifier module
Patent number
11,621,678
Issue date
Apr 4, 2023
Murata Manufacturing Co., Ltd.
Isao Obu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumped pad structure
Patent number
11,557,555
Issue date
Jan 17, 2023
Western Digital Technologies, Inc.
Hsiao Jung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having counductive bump with tapered portio...
Patent number
11,495,556
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
Patent number
11,488,882
Issue date
Nov 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure with a barrier layer
Patent number
11,469,203
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bonding using dummy bonding contacts
Patent number
11,462,503
Issue date
Oct 4, 2022
Yangtze Memory Technologies Co., Ltd.
Tao Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
Publication number
20240128211
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
Publication number
20240128219
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240120304
Publication date
Apr 11, 2024
Innolux Corporation
Tzu-Sheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
Publication number
20240113055
Publication date
Apr 4, 2024
International Business Machines Corporation
Nicholas Alexander Polomoff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
Publication number
20240079358
Publication date
Mar 7, 2024
Micron Technology, Inc.
Siva Sai Kishore Palli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE
Publication number
20240047510
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240021550
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240021551
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION
Publication number
20240006353
Publication date
Jan 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Anton Johann BAYERSTADLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
Publication number
20230402418
Publication date
Dec 14, 2023
Micron Technology, Inc.
Ko Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYIMIDE PROFILE CONTROL
Publication number
20230387050
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Chi HUANG
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
Publication number
20230386864
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
Publication number
20230387051
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
Publication number
20230378414
Publication date
Nov 23, 2023
BOE TECHNOLOGY GROUP CO., LTD.
Zhiwei LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
Publication number
20230378106
Publication date
Nov 23, 2023
NXP USA, Inc.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH A POROUS STRUCTURE
Publication number
20230369243
Publication date
Nov 16, 2023
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20230361062
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
Publication number
20230360946
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
Publication number
20230352351
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing company Ltd.
PEI-LUM MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
Publication number
20230352428
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...
Publication number
20230314735
Publication date
Oct 5, 2023
Intel Corporation
Santosh SHAW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS
Publication number
20230317647
Publication date
Oct 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Tzu-Yang LIN
C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20230299023
Publication date
Sep 21, 2023
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
Publication number
20230299026
Publication date
Sep 21, 2023
Magnachip Semiconductor, Ltd.
Myungho PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
Publication number
20230299027
Publication date
Sep 21, 2023
TEXAS INSTRUMENTS INCORPORATED
Sreenivasan K. KODURI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20230260941
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230253412
Publication date
Aug 10, 2023
SAMSUNG DISPLAY CO., LTD.
Jeong Su PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...
Publication number
20230253336
Publication date
Aug 10, 2023
Keumhee Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
Publication number
20230245987
Publication date
Aug 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
Publication number
20230238341
Publication date
Jul 27, 2023
STMicroelectronics Pte Ltd
Churn Weng YIM
H01 - BASIC ELECTRIC ELEMENTS