Physical vapour deposition [PVD]

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H01L2224/27826

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27826Physical vapour deposition [PVD]

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Patents Grantslast 30 patents

Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 9,132,496
- Issue date Sep 15, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 8,844,793
- Issue date Sep 30, 2014
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Formation Of Oxide On Solder
- Publication number 20120111925
- Publication date May 10, 2012
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR