Physical vapour deposition [PVD]

Industry

CPC
H01L2224/11826

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11826Physical vapour deposition [PVD]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,893,026
- Issue date Feb 13, 2018
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,601,406
- Issue date Mar 21, 2017
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,559,028
- Issue date Jan 31, 2017
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,368,390
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image pickup device and method for producing the same
- Patent number 9,240,429
- Issue date Jan 19, 2016
- Sumitomo Electric Industries, Ltd.
- Hiroki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing semiconductor die having hydrophobic coatings, an...
- Patent number 9,220,183
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Daniel J. Buvid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 8,952,550
- Issue date Feb 10, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,378,486
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including a metal alloy between a first con...
- Patent number 8,378,490
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure, electronic device, and method for fabricating a structure
- Patent number 8,350,160
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic contact structure
- Patent number 8,033,838
- Issue date Oct 11, 2011
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 7,872,332
- Issue date Jan 18, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 7,250,678
- Issue date Jul 31, 2007
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 7,196,001
- Issue date Mar 27, 2007
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor devices
- Patent number 7,186,637
- Issue date Mar 6, 2007
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 6,853,076
- Issue date Feb 8, 2005
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Post-Passivation Interconnect Structure
- Publication number 20190326241
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Post-Passivation Interconnect Structure
- Publication number 20170200687
- Publication date Jul 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...
- Publication number 20160005705
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...
- Publication number 20150132940
- Publication date May 14, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME
- Publication number 20140327101
- Publication date Nov 6, 2014
- Hiroki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)
- Publication number 20140246770
- Publication date Sep 4, 2014
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20130130496
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120235301
- Publication date Sep 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120018880
- Publication date Jan 26, 2012
- Kun-Tai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
- Publication number 20110226841
- Publication date Sep 22, 2011
- Jun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE
- Publication number 20110147177
- Publication date Jun 23, 2011
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20110095420
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20100117229
- Publication date May 13, 2010
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC CONTACT STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20100093229
- Publication date Apr 15, 2010
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20100059897
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20060148233
- Publication date Jul 6, 2006
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding semiconductor devices
- Publication number 20050025942
- Publication date Feb 3, 2005
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20040159947
- Publication date Aug 19, 2004
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20040159944
- Publication date Aug 19, 2004
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20030057551
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS

Physical vapour deposition [PVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Mechanisms for forming post-passivation interconnect structure

Interconnect structures for preventing solder bridging, and associa...

Interconnect structures for preventing solder bridging, and associa...

Mechanisms for forming post-passivation interconnect structure

Reducing solder pad topology differences by planarization

Systems, methods and devices for inter-substrate coupling

Copper nanorod-based thermal interface material (TIM)

Semiconductor device

Bump package and methods of formation thereof

Semiconductor apparatus

Image pickup device and method for producing the same

Devices employing semiconductor die having hydrophobic coatings, an...

Interconnect structures for stacked dies, including penetrating str...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Interconnect structures for stacked dies, including penetrating str...

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor apparatus including a metal alloy between a first con...

Structure, electronic device, and method for fabricating a structure

Microelectronic contact structure

Interconnect structures for stacked dies, including penetrating str...

Method and apparatus for electrostatic discharge protection using a...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Method of bonding semiconductor devices

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

Mechanisms for Forming Post-Passivation Interconnect Structure

Mechanisms for Forming Post-Passivation Interconnect Structure

Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...

COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...

IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME

COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Bump Package and Methods of Formation Thereof

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Semiconductor device and method of manufacturing semiconductor device

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

MICROELECTRONIC CONTACT STRUCTURE AND METHOD OF MAKING SAME

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Method of bonding semiconductor devices

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...