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Pivoting mechanism

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  • CPC
  • H01L2224/78823
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78823Pivoting mechanism
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTIPLE ACTUATOR WIRE BONDING APPARATUS
    • Publication number 20190304947
    • Publication date Oct 3, 2019
    • ASM Technology Singapore Pte Ltd
    • Keng Yew SONG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS
    • Publication number 20110315743
    • Publication date Dec 29, 2011
    • SHINKAWA LTD.
    • Yusuke MARUYA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING METHOD, BONDING APPARATUS, AND MANUFACTURING METHOD OF SEMI...
    • Publication number 20110226838
    • Publication date Sep 22, 2011
    • SHINKAWA LTD.
    • Nobuyuki Aoyagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS AND BONDING STAGE HEIGHT ADJUSTMENT METHOD FOR TH...
    • Publication number 20100301101
    • Publication date Dec 2, 2010
    • SHINKAWA LTD.
    • Kohei Seyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Horn-holder pivot type bonding apparatus
    • Publication number 20090272498
    • Publication date Nov 5, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL INSULATION FOR A BONDING TOOL
    • Publication number 20080272179
    • Publication date Nov 6, 2008
    • Ka Shing Kenny Kwan
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Horn attachment arm
    • Publication number 20080203136
    • Publication date Aug 28, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Horn-holder pivot type bonding apparatus
    • Publication number 20070205252
    • Publication date Sep 6, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Actuator and bonding apparatus
    • Publication number 20070040455
    • Publication date Feb 22, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Manabu Haraguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bondhead for wire bonding apparatus
    • Publication number 20050279805
    • Publication date Dec 22, 2005
    • ASM Technology Singapore Pte Ltd
    • Yam Mo Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20050211746
    • Publication date Sep 29, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding arm swinging type bonding apparatus
    • Publication number 20050184127
    • Publication date Aug 25, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Actuator and bonding apparatus
    • Publication number 20050184600
    • Publication date Aug 25, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Manabu Haraguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and method for making the same
    • Publication number 20050153480
    • Publication date Jul 14, 2005
    • ROHM CO., LTD.
    • Hiroshi Oka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus
    • Publication number 20030218048
    • Publication date Nov 27, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Tooru Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device and method for making the same
    • Publication number 20020109237
    • Publication date Aug 15, 2002
    • ROHM CO., LTD.
    • Hiroshi Oka
    • H01 - BASIC ELECTRIC ELEMENTS