Pivoting mechanism

Industry

CPC
H01L2224/75843

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75843Pivoting mechanism

Industries

Patents Grantslast 30 patents

Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for multi-direct transfer of semiconductors
- Patent number 10,373,937
- Issue date Aug 6, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 10,361,176
- Issue date Jul 23, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on string circuit and method of making the same
- Patent number 10,325,885
- Issue date Jun 18, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for improved direct transfer of semiconductor die
- Patent number 10,290,615
- Issue date May 14, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro device transfer system with pivot mount
- Patent number 10,043,776
- Issue date Aug 7, 2018
- Apple Inc.
- Dariusz Golda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method and device for performing the same
- Patent number 9,842,817
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional mounting method and three-dimensional mounting de...
- Patent number 9,673,166
- Issue date Jun 6, 2017
- Toray Engineering Co., Ltd.
- Koji Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for aligning a bonding tool of a die bonder
- Patent number 8,387,851
- Issue date Mar 5, 2013
- ASM Technology Singapore Pte. Ltd.
- Chung Sheung Yung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using a simultaneously tilting and moving bonding apparatus
- Patent number 7,712,649
- Issue date May 11, 2010
- Shinko Electric Industries Co., Ltd.
- Toshiyuki Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION
- Publication number 20210225800
- Publication date Jul 22, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20200006099
- Publication date Jan 2, 2020
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE MOUNTING APPARATUS AND DEVICE MOUNTING METHOD
- Publication number 20170068056
- Publication date Mar 9, 2017
- FUJITSU COMPONENT LIMITED
- Rie Gappa
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DE...
- Publication number 20170005068
- Publication date Jan 5, 2017
- TORAY ENGINEERING CO., LTD.
- Koji NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT
- Publication number 20160293566
- Publication date Oct 6, 2016
- Apple Inc.
- Dariusz Golda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD OF MANUFACTURING EL...
- Publication number 20090001133
- Publication date Jan 1, 2009
- Shinko Electric Industries Co., Ltd.
- Toshiyuki Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS

Pivoting mechanism

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component mounting system

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Method for improved transfer of semiconductor die

Bonding apparatus incorporating variable force distribution

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices

Apparatus for multi-direct transfer of semiconductors

Substrate with array of LEDs for backlighting a display device

Semiconductor device on string circuit and method of making the same

Method and apparatus for improved direct transfer of semiconductor die

Solder bump stretching method

Micro device transfer system with pivot mount

Solder bump stretching method and device for performing the same

Three-dimensional mounting method and three-dimensional mounting de...

Apparatus for aligning a bonding tool of a die bonder

Using a simultaneously tilting and moving bonding apparatus

Patents Applicationslast 30 patents

Actuator for a Bonding Head

BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

Apparatus and Method for Direct Transfer of Semiconductor Devices

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

SOLDER BUMP STRETCHING METHOD

DEVICE MOUNTING APPARATUS AND DEVICE MOUNTING METHOD

THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DE...

MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT

ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD OF MANUFACTURING EL...