Plasma cleaning

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CPC
H01L2224/85013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85013Plasma cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,024,599
- Issue date Jun 1, 2021
- Renesas Electronics Corporation
- Ryo Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,672,689
- Issue date Jun 2, 2020
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,388,594
- Issue date Aug 20, 2019
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,381,318
- Issue date Aug 13, 2019
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,304,767
- Issue date May 28, 2019
- Renesas Electronics Corporation
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reduction of fluorine contamination of bond pads of semiconductor d...
- Patent number 9,059,110
- Issue date Jun 16, 2015
- X-Fab Semiconductor Foundries AG.
- Hyung Sun Yook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of light-emitting device
- Patent number 8,987,021
- Issue date Mar 24, 2015
- Toyoda Gosei Co., Ltd.
- Mineo Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stacking method to reduce voids between stacked chips
- Patent number 8,815,645
- Issue date Aug 26, 2014
- Walton Advanced Engineering, Inc.
- Kuo-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making chip-on-lead package
- Patent number 8,642,395
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large panel leadframe
- Patent number 8,535,988
- Issue date Sep 17, 2013
- Carsem (M) Sdn. Bhd.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,299,600
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Yukihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire cleaning guide
- Patent number 8,283,593
- Issue date Oct 9, 2012
- Kabushiki Kaisha Shinkawa
- Masayuki Horino
- B08 - CLEANING
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,183,088
- Issue date May 22, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solid state imaging device and manufacturing method thereof
- Patent number 8,034,652
- Issue date Oct 11, 2011
- FUJIFILM Corporation
- Kazuhiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond over post passivation thick metal
- Patent number 8,030,775
- Issue date Oct 4, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and wire bonding method
- Patent number 7,975,901
- Issue date Jul 12, 2011
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method for cleaning tip of a bonding tool
- Patent number 7,893,383
- Issue date Feb 22, 2011
- Kabushiki Kaisha Shinkawa
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic flame-off electrode with ball-shaped tip
- Patent number 7,795,557
- Issue date Sep 14, 2010
- Kulicke and Soffa Industries, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 7,772,681
- Issue date Aug 10, 2010
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro universal serial bus (USB) memory package
- Patent number 7,709,946
- Issue date May 4, 2010
- Hana Micron Co., Ltd.
- Ki Tae Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and method
- Patent number 7,576,297
- Issue date Aug 18, 2009
- Kabushiki Kaisha Shinkawa
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,416,970
- Issue date Aug 26, 2008
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic flame-off electrode with ball-shaped tip
- Patent number 7,411,157
- Issue date Aug 12, 2008
- Kulicke and Soffa Industries, Inc.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor stacked package assembly having exposed substrate sur...
- Patent number 7,372,141
- Issue date May 13, 2008
- Stats Chippac Ltd.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer bumping for enabling a stitch wire bond in the abse...
- Patent number 7,232,747
- Issue date Jun 19, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,226,815
- Issue date Jun 5, 2007
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20200185353
- Publication date Jun 11, 2020
- RENESAS ELECTRONICS CORPORATION
- Ryo Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...
- Publication number 20190326201
- Publication date Oct 24, 2019
- STMICROELECTRONICS, INC.
- Frederick Ray GOMEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20190206828
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180315691
- Publication date Nov 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Tatsuya KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140332583
- Publication date Nov 13, 2014
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE
- Publication number 20130330852
- Publication date Dec 12, 2013
- Mineo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE PANEL LEADFRAME
- Publication number 20130109137
- Publication date May 2, 2013
- CARSEM (M) SDN. BHD.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20120306031
- Publication date Dec 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
REDUCTION OF FLUORINE CONTAMINATION OF BOND PADS OF SEMICONDUCTOR D...
- Publication number 20120241914
- Publication date Sep 27, 2012
- X-FAB SEMICONDUCTOR FOUNDRIES AG.
- Hyung Sun Yook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS
- Publication number 20120115277
- Publication date May 10, 2012
- WALTON ADVANCED ENGINEERING INC.
- Kuo-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RESISTANT MASKING TAPE AND USAGE THEREOF
- Publication number 20110045638
- Publication date Feb 24, 2011
- Yorinobu Takamatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100258925
- Publication date Oct 14, 2010
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING CHIP-ON-LEAD PACKAGE
- Publication number 20100248426
- Publication date Sep 30, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100123240
- Publication date May 20, 2010
- RENESAS TECHNOLOGY CORP.
- Yukihiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Semiconductor Chip Package
- Publication number 20100102457
- Publication date Apr 29, 2010
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PAD FOR COPPER WIRE BONDING
- Publication number 20100052174
- Publication date Mar 4, 2010
- Agere Systems Inc.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND OVER POST PASSIVATION THICK METAL
- Publication number 20090206486
- Publication date Aug 20, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVOIDING ELECTRICAL SHORTS IN PACKAGING
- Publication number 20090165815
- Publication date Jul 2, 2009
- United Test & Assembly Center Ltd.
- Debbie Tuerca ALCALA
- B08 - CLEANING
Information Patent Application
METHOD AND DEVICE FOR WIRE BONDING
- Publication number 20090140029
- Publication date Jun 4, 2009
- Ernst WANDKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090134494
- Publication date May 28, 2009
- PANASONIC CORPORATION
- Masashi Funakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE
- Publication number 20090053850
- Publication date Feb 26, 2009
- FUJIFILM Corporation
- Kazuhiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid state imaging device and manufacturing method thereof
- Publication number 20090046183
- Publication date Feb 19, 2009
- FUJIFILM Corporation
- Kazuhiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME
- Publication number 20090039141
- Publication date Feb 12, 2009
- KULICKE AND SOFFA INDUSTRIES, INC.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP
- Publication number 20080264907
- Publication date Oct 30, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Cleaning Guide
- Publication number 20080197168
- Publication date Aug 21, 2008
- KABUSHIKI KAISHA SHINKAWA
- Masayuki Horino
- B08 - CLEANING

Plasma cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packaging

Semiconductor device and method of manufacturing thereof

Protection from ESD during the manufacturing process of semiconduct...

Integrated circuit packaging

Protection from ESD during the manufacturing process of semiconduct...

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor die package and method for making the same

Reduction of fluorine contamination of bond pads of semiconductor d...

Manufacturing method of light-emitting device

Multi-chip stacking method to reduce voids between stacked chips

Semiconductor die package and method for making the same

Method of making chip-on-lead package

Large panel leadframe

Semiconductor device and manufacturing method thereof

Wire cleaning guide

Semiconductor die package and method for making the same

Solid state imaging device and manufacturing method thereof

Wirebond over post passivation thick metal

Bonding apparatus and wire bonding method

Bonding apparatus and method for cleaning tip of a bonding tool

Electronic flame-off electrode with ball-shaped tip

Semiconductor die package and method for making the same

Micro universal serial bus (USB) memory package

Bonding apparatus and method

Method for manufacturing semiconductor device

Electronic flame-off electrode with ball-shaped tip

Semiconductor stacked package assembly having exposed substrate sur...

Method of wafer bumping for enabling a stitch wire bond in the abse...

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...

INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE

WIRE BONDING APPARATUS

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE

LARGE PANEL LEADFRAME

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

REDUCTION OF FLUORINE CONTAMINATION OF BOND PADS OF SEMICONDUCTOR D...

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS

HEAT RESISTANT MASKING TAPE AND USAGE THEREOF

BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

METHOD OF MAKING CHIP-ON-LEAD PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Hybrid Semiconductor Chip Package

COPPER PAD FOR COPPER WIRE BONDING

WIREBOND OVER POST PASSIVATION THICK METAL

AVOIDING ELECTRICAL SHORTS IN PACKAGING

METHOD AND DEVICE FOR WIRE BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE

Solid state imaging device and manufacturing method thereof

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP

Wire Cleaning Guide