Plasma cleaning

Industry

CPC
H01L2224/81013

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81013Plasma cleaning

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Modified direct bond interconnect for FPAs
- Patent number 11,670,616
- Issue date Jun 6, 2023
- EPIR, INC.
- Sushant Sonde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,004,819
- Issue date May 11, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 10,686,099
- Issue date Jun 16, 2020
- OSRAM OLED GmbH
- Sophia Huppmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 10,134,704
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,735,125
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structures
- Patent number 9,698,113
- Issue date Jul 4, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qifeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode body, wiring substrate, and semiconductor device
- Patent number 9,425,135
- Issue date Aug 23, 2016
- Olympus Corporation
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,287,230
- Issue date Mar 15, 2016
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 8,932,909
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,922,027
- Issue date Dec 30, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,860,232
- Issue date Oct 14, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,846,450
- Issue date Sep 30, 2014
- Ziptronix, Inc.
- Qin-yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface structure for copper-copper peeling integrity
- Patent number 8,592,300
- Issue date Nov 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plasma preparation of metallic contacts to enhance mechan...
- Patent number 8,567,658
- Issue date Oct 29, 2013
- Ontos Equipment Systems, Inc.
- Eric Frank Schulte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,524,533
- Issue date Sep 3, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS device having chip scale packaging
- Patent number 8,525,278
- Issue date Sep 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrode bonding method and part mounting apparatus
- Patent number 8,449,712
- Issue date May 28, 2013
- Panasonic Corporation
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified Direct Bond Interconnect for FPAs
- Publication number 20220052020
- Publication date Feb 17, 2022
- Sushant Sonde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210210454
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210098404
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006620
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006621
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20190326251
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20180366634
- Publication date Dec 20, 2018
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20170309586
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20140131855
- Publication date May 15, 2014
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLASMA PREPARATION OF METALLIC CONTACTS TO ENHANCE MECHAN...
- Publication number 20140102594
- Publication date Apr 17, 2014
- Ontos Equipment Systems, Inc.
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...
- Publication number 20130270329
- Publication date Oct 17, 2013
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20130256880
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface Structure for Copper-Copper Peeling Integrity
- Publication number 20130149856
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE HAVING CHIP SCALE PACKAGING
- Publication number 20130043547
- Publication date Feb 21, 2013
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. ("TSMC")
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Plasma cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modified direct bond interconnect for FPAs

Prevention of bridging between solder joints

Bonding with pre-deoxide process and apparatus for performing the same

Superconducting bump bonds

3D packaging with low-force thermocompression bonding of oxidizable...

Superconducting bump bonds

Prevention of bridging between solder joints

Optoelectronic component and method for producing an optoelectronic...

Superconducting bump bonds

Superconducting bump bonds

Room temperature metal direct bonding

Thermocompression for semiconductor chip assembly

Method of manufacturing an electronic device, and electronic device...

Thermocompression for semiconductor chip assembly

Chip packaging structures

Electrode body, wiring substrate, and semiconductor device

Room temperature metal direct bonding

Thermocompression for semiconductor chip assembly

Chip-on-wafer bonding method and bonding device, and structure comp...

Thermocompression for semiconductor chip assembly

Electronic device having electrodes bonded with each other

Package structure and substrate bonding method

Electronic device having electrodes bonded with each other

Room temperature metal direct bonding

Joining method and device produced by this method and joining unit

Interface structure for copper-copper peeling integrity

Method of plasma preparation of metallic contacts to enhance mechan...

Room temperature metal direct bonding

MEMS device having chip scale packaging

Electrode bonding method and part mounting apparatus

Patents Applicationslast 30 patents

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

Modified Direct Bond Interconnect for FPAs

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

SUPERCONDUCTING BUMP BONDS

SUPERCONDUCTING BUMP BONDS

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

ROOM TEMPERATURE METAL DIRECT BONDING

SUPERCONDUCTING BUMP BONDS

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

METHOD OF PLASMA PREPARATION OF METALLIC CONTACTS TO ENHANCE MECHAN...

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

Package Structure and Substrate Bonding Method

3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...

ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

Interface Structure for Copper-Copper Peeling Integrity

MEMS DEVICE HAVING CHIP SCALE PACKAGING