Plated through-holes or blind vias without lands

Industry

CPC
H05K2201/09545

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09545Plated through-holes or blind vias without lands

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 12,200,859
- Issue date Jan 14, 2025
- TOPPAN INC.
- Jun Onohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device including circuit board includi...
- Patent number 12,200,864
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,185,467
- Issue date Dec 31, 2024
- Denso Corporation
- Keitaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display apparatus and electronic device
- Patent number 12,127,345
- Issue date Oct 22, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xiaoxia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlayer connective structure of wiring board and method of manuf...
- Patent number 11,895,772
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Chi-Min Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise suppression structure for differential pair
- Patent number 11,877,385
- Issue date Jan 16, 2024
- First Hi-tec Enterprise Co., Ltd.
- Ching-Shan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,864,316
- Issue date Jan 2, 2024
- Fujikura Ltd.
- Naoki Oyaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component carrier board and a wiring method for the same
- Patent number 11,751,339
- Issue date Sep 5, 2023
- GLOBAL MASTER TECH. CO., LTD.
- Yao-Hua Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 11,683,886
- Issue date Jun 20, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiki Shirotori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit for bridging and display panel
- Patent number 11,647,585
- Issue date May 9, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xiaolong Zhu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,546,983
- Issue date Jan 3, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for maximizing signal integrity on circuit boards
- Patent number 11,510,317
- Issue date Nov 22, 2022
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,510,316
- Issue date Nov 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive device packaging structure embedded in glass medium and met...
- Patent number 11,503,712
- Issue date Nov 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed traceless interconnect
- Patent number 11,482,802
- Issue date Oct 25, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,457,525
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit card assembly with preformed undulations for surve...
- Patent number 11,425,814
- Issue date Aug 23, 2022
- Rosemount Aerospace Inc.
- Kirantu Madhava
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Substrate having through via and method of fabricating the same
- Patent number 11,406,022
- Issue date Aug 2, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with an etching neck connecting back drill hole w...
- Patent number 11,399,432
- Issue date Jul 26, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Kastelic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device including circuit board
- Patent number 11,357,107
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 11,330,713
- Issue date May 10, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250016909
- Publication date Jan 9, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240334601
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangho Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER VIA RESONANCE SUPPRESSION
- Publication number 20240098898
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Kent Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240040686
- Publication date Feb 1, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Maria BØE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR
- Publication number 20240023227
- Publication date Jan 18, 2024
- FIRST HI-TEC ENTERPRISE Co., Ltd.
- Ching-Shan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20240008177
- Publication date Jan 4, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD
- Publication number 20230345634
- Publication date Oct 26, 2023
- Dell Products L.P.
- Chang-Kai Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20230319978
- Publication date Oct 5, 2023
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230309229
- Publication date Sep 28, 2023
- TDK Corporation
- Takeshi OOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSOR AND ELECTRONIC DEVICE
- Publication number 20230184604
- Publication date Jun 15, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Wei CHEN
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS
- Publication number 20230180397
- Publication date Jun 8, 2023
- R&D Circuits
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Component Carrier With a Via Containing a Hardened Filling Material
- Publication number 20230156912
- Publication date May 18, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Shuying YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...
- Publication number 20230121285
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Sangwon HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module and Method for Producing an Electronic Module
- Publication number 20230094926
- Publication date Mar 30, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITORS IN THROUGH GLASS VIAS
- Publication number 20230091666
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS AND ELECTRONIC DEVICE
- Publication number 20230008693
- Publication date Jan 12, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiaoxia HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Plated through-holes or blind vias without lands

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Circuit board and electronic device including circuit board includi...

Electronic device

Hermetic metallized via with improved reliability

Display apparatus and electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Method and process for creating high-performance coax sockets

Electronic module and method for producing an electronic module

Assembly structure for vehicle camera module using solder-jet

Mating backplane for high speed, high density electrical connector

Multilayer wiring board and method of producing the same

Interlayer connective structure of wiring board and method of manuf...

Noise suppression structure for differential pair

Wiring substrate

Electronic-component carrier board and a wiring method for the same

Interconnect structure having conductor extending along dielectric...

Wiring substrate and method of manufacturing the wiring substrate

Flexible printed circuit for bridging and display panel

Mating backplane for high speed, high density electrical connector

Systems and methods for maximizing signal integrity on circuit boards

Overhang-compensating annular plating layer in through hole of comp...

Passive device packaging structure embedded in glass medium and met...

High speed traceless interconnect

Interconnect structure having conductor extending along dielectric...

Flexible circuit card assembly with preformed undulations for surve...

Substrate having through via and method of fabricating the same

Component carrier with an etching neck connecting back drill hole w...

Circuit board and electronic device including circuit board

Printed wiring board

Hermetic metallized via with improved reliability

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

POWER VIA RESONANCE SUPPRESSION

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

ELECTRONIC COMPONENT

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

PRESSURE SENSOR AND ELECTRONIC DEVICE

METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS

Component Carrier With a Via Containing a Hardened Filling Material

PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

Electronic Module and Method for Producing an Electronic Module

CAPACITORS IN THROUGH GLASS VIAS

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

DISPLAY APPARATUS AND ELECTRONIC DEVICE