Plated through-holes specially for multilayer circuits

Industry

CPC
H05K3/429

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/429Plated through-holes specially for multilayer circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 12,150,254
- Issue date Nov 19, 2024
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,133,329
- Issue date Oct 29, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Min Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission device
- Patent number 12,080,933
- Issue date Sep 3, 2024
- Hitachi Astemo, Ltd.
- Yutaka Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,041,729
- Issue date Jul 16, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,028,988
- Issue date Jul 2, 2024
- Ibiden Co., Ltd.
- Takuya Inishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass core multilayer wiring board and method of producing the same
- Patent number 11,877,394
- Issue date Jan 16, 2024
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Feature casting for manufacture observation
- Patent number 11,872,729
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Sarah K. Czaplewski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240381530
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...
- Publication number 20240334597
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240334601
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangho Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321711
- Publication date Sep 26, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
- Publication number 20240188217
- Publication date Jun 6, 2024
- TTM TECHNOLOGIES INC.
- Matthew Douglas Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240179850
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Chunghyo JUNG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240155776
- Publication date May 9, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE
- Publication number 20240074056
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Shinri SAEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240015884
- Publication date Jan 11, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240006748
- Publication date Jan 4, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
- Publication number 20240008186
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Yanyan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD VIA STRUCTURES WITH REDUCED INSERTION LOSS DI...
- Publication number 20240008180
- Publication date Jan 4, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422408
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422406
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Takuya INISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230413451
- Publication date Dec 21, 2023
- Sumitomo Electric Industries, Ltd.
- Shingo NAGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403790
- Publication date Dec 14, 2023
- LG Innotek Co., Ltd.
- Jung Eun HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Plated through-holes specially for multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a laminate structure having a plated through-hole...

Method for detecting and adjusting poor back drills in printed circ...

Printed circuit board and method for manufacturing the same

Printed circuit board

Component carrier with stack-stack connection for connecting compon...

Signal transmission device

Electromagnetic wave transmission board comprising an inner board w...

Manufacturing sequences for high density interconnect printed circu...

Circuit board having laminated build-up layers

Devices and methods related to metallization of ceramic substrates...

Manufacturing method of circuit board

Wafer level chip scale packaging intermediate structure apparatus a...

Printed wiring board

Resin multilayer substrate and method for manufacturing resin multi...

Electronic module and method for producing an electronic module

Printed wiring board

Method to manufacture conductive anodic filament-resistant microvias

Mating backplane for high speed, high density electrical connector

Circuit board preparation method

Package component and forming method thereof

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed circuit board stack structure and manufacturing method thereof

Structure for embedding and packaging multiple devices by layer and...

Glass core multilayer wiring board and method of producing the same

Feature casting for manufacture observation

Packaging structure with embedded electronic components and method...

Method for forming through-hole, and substrate for flexible printed...

Backplane footprint for high speed, high density electrical connectors

Printed circuit boards with plated blind slots for improved vertica...

Circuit board and manufacturing method thereof and electronic device

Patents Applicationslast 30 patents

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

PRINTED WIRING BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD

PACKAGE COMPONENT

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

Structures for Forming Printed Board Interconnects Using Solder

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY

PRINTED CIRCUIT BOARD VIA STRUCTURES WITH REDUCED INSERTION LOSS DI...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

CIRCUIT BOARD