Plated through-holes specially for multilayer circuits

Industry

CPC
H05K3/429

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/429Plated through-holes specially for multilayer circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass core multilayer wiring board and method of producing the same
- Patent number 11,877,394
- Issue date Jan 16, 2024
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Feature casting for manufacture observation
- Patent number 11,872,729
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Sarah K. Czaplewski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, system and device for manufacturing printed circuit board,...
- Patent number 11,770,905
- Issue date Sep 26, 2023
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Dong Zhou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,765,827
- Issue date Sep 19, 2023
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion device
- Patent number 11,711,897
- Issue date Jul 25, 2023
- Mitsubishi Electric Corporation
- Toshikazu Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board with high light reflectivity
- Patent number 11,696,393
- Issue date Jul 4, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Jin-Cheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intermediate substrate and fabrication method thereof
- Patent number 11,658,104
- Issue date May 23, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wired circuit board and imaging device
- Patent number 11,627,661
- Issue date Apr 11, 2023
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a closed cavity printed circuit board with pattern...
- Patent number 11,622,453
- Issue date Apr 4, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting printed circuit board related systems, methods, and...
- Patent number 11,617,272
- Issue date Mar 28, 2023
- D-Wave Systems Inc.
- Richard D. Neufeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with a solid body protecting a component carrier...
- Patent number 11,612,064
- Issue date Mar 21, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency (RF) system with RF isolation chambers and method o...
- Patent number 11,612,051
- Issue date Mar 21, 2023
- Lockheed Martin Corporation
- Andrew E. White
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-current PCB traces
- Patent number 11,564,309
- Issue date Jan 24, 2023
- Schweitzer Engineering Laboratories, Inc.
- Travis C. Mallett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240155776
- Publication date May 9, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE
- Publication number 20240074056
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Shinri SAEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240015884
- Publication date Jan 11, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240006748
- Publication date Jan 4, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
- Publication number 20240008186
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Yanyan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD VIA STRUCTURES WITH REDUCED INSERTION LOSS DI...
- Publication number 20240008180
- Publication date Jan 4, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422408
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422406
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Takuya INISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230413451
- Publication date Dec 21, 2023
- Sumitomo Electric Industries, Ltd.
- Shingo NAGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403790
- Publication date Dec 14, 2023
- LG Innotek Co., Ltd.
- Jung Eun HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
- Publication number 20230395395
- Publication date Dec 7, 2023
- TOPPAN INC.
- Takashi KIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS
- Publication number 20230397331
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
- Publication number 20230397333
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395467
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20230389172
- Publication date Nov 30, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIDEWALL PLATING OF CIRCUIT BOARDS FOR LAYER TRANSITION CONNECTIONS
- Publication number 20230371177
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230363082
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Byeongkeol KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Through Package Vertical Interconnect and Method of Making Same
- Publication number 20230343687
- Publication date Oct 26, 2023
- Chipletz, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...
- Publication number 20230345643
- Publication date Oct 26, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR IN A SUBSTRATE VIA
- Publication number 20230319997
- Publication date Oct 5, 2023
- Intel Corporation
- Aslam HASWAREY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier with Stack-Stack Connection for Connecting Compon...
- Publication number 20230300982
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS

Plated through-holes specially for multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method to manufacture conductive anodic filament-resistant microvias

Mating backplane for high speed, high density electrical connector

Circuit board preparation method

Package component and forming method thereof

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed circuit board stack structure and manufacturing method thereof

Structure for embedding and packaging multiple devices by layer and...

Glass core multilayer wiring board and method of producing the same

Feature casting for manufacture observation

Packaging structure with embedded electronic components and method...

Method for forming through-hole, and substrate for flexible printed...

Backplane footprint for high speed, high density electrical connectors

Printed circuit boards with plated blind slots for improved vertica...

Circuit board and manufacturing method thereof and electronic device

Component carrier with through hole filled with extra plating struc...

Method, system and device for manufacturing printed circuit board,...

Backplane footprint for high speed, high density electrical connectors

Simultaneous and selective wide gap partitioning of via structures...

Power conversion device

Method for manufacturing circuit board with high light reflectivity

Manufacturing method of circuit carrier board structure

Intermediate substrate and fabrication method thereof

Process for fabrication of a printed circuit board using a semi-add...

Wafer level chip scale packaging intermediate structure apparatus a...

Wired circuit board and imaging device

Method of making a closed cavity printed circuit board with pattern...

Superconducting printed circuit board related systems, methods, and...

Component carrier with a solid body protecting a component carrier...

Radio frequency (RF) system with RF isolation chambers and method o...

High-current PCB traces

Patents Applicationslast 30 patents

Structures for Forming Printed Board Interconnects Using Solder

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY

PRINTED CIRCUIT BOARD VIA STRUCTURES WITH REDUCED INSERTION LOSS DI...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

CIRCUIT BOARD

BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...

METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS

ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

MANUFACTURING METHOD OF CIRCUIT BOARD

SIDEWALL PLATING OF CIRCUIT BOARDS FOR LAYER TRANSITION CONNECTIONS

CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

Multilayer Cores, Variable Width Vias, and Offset Vias

PACKAGE COMPONENT AND FORMING METHOD THEREOF

Through Package Vertical Interconnect and Method of Making Same

PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...

CAPACITOR IN A SUBSTRATE VIA

Component Carrier with Stack-Stack Connection for Connecting Compon...