Plating

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H01L2224/43125

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/43125Plating

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Patents Grantslast 30 patents

Information Patent Grant
Interposer, manufacturing method therefor, and circuit board assembly
- Patent number 12,308,252
- Issue date May 20, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device
- Patent number 10,622,531
- Issue date Apr 14, 2020
- Nichia Corporation
- Yasuo Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire and method for manufacturing same
- Patent number 9,434,027
- Issue date Sep 6, 2016
- NIPPON MICROMETAL CORPORATION
- Ryo Togashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a plurality of metal posts
- Patent number 9,263,407
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a conductive wire suitable for use in sem...
- Patent number 6,711,925
- Issue date Mar 30, 2004
- Asep Tec Co., Ltd.
- Pen-Tien Liao
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY
- Publication number 20220336230
- Publication date Oct 20, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE
- Publication number 20180345421
- Publication date Dec 6, 2018
- HERAEUS MATERIALS SINGAPORE PTE., LTD.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170194280
- Publication date Jul 6, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140329106
- Publication date Nov 6, 2014
- NIPPON MICROMETAL CORPORATION
- Ryo TOGASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for manufacturing a conductive wire suitable for use in sem...
- Publication number 20030113574
- Publication date Jun 19, 2003
- Asep Tec Co., Ltd.
- Pen-Tien Liao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer, manufacturing method therefor, and circuit board assembly

Bonding wire for semiconductor devices

Solder joints on nickel surface finishes without gold plating

Coated wire

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Light-emitting device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Method for forming ball in bonding wire

Metal post bonding using pre-fabricated metal posts

Aluminum coated copper bond wire and method of making the same

Bonding wire for semiconductor device

Bonding wire and method for manufacturing same

Method for manufacturing a plurality of metal posts

Process for manufacturing a conductive wire suitable for use in sem...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

COAXIAL WIRE

COATED WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

METHOD FOR FORMING BALL IN BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COATED WIRE FOR BONDING APPLICATIONS

BONDING WIRE AND METHOD FOR MANUFACTURING SAME

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

Metal Post Bonding Using Pre-Fabricated Metal Posts

Process for manufacturing a conductive wire suitable for use in sem...