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  • H01L2224/43125
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/43125Plating
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,929,343
    • Issue date Mar 12, 2024
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solder joints on nickel surface finishes without gold plating
    • Patent number 11,676,926
    • Issue date Jun 13, 2023
    • Schlumberger Technology Corporation
    • Mark Alex Kostinovsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coated wire
    • Patent number 10,960,498
    • Issue date Mar 30, 2021
    • Heraeus Materials Singapore Pte., Ltd.
    • Il Tae Kang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,840,208
    • Issue date Nov 17, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,737,356
    • Issue date Aug 11, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Light-emitting device
    • Patent number 10,622,531
    • Issue date Apr 14, 2020
    • Nichia Corporation
    • Yasuo Kato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,610,976
    • Issue date Apr 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,525,555
    • Issue date Jan 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,468,370
    • Issue date Nov 5, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,414,002
    • Issue date Sep 17, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,137,534
    • Issue date Nov 27, 2018
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,121,758
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Method for forming ball in bonding wire
    • Patent number 10,121,764
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Noritoshi Araki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Metal post bonding using pre-fabricated metal posts
    • Patent number 10,034,390
    • Issue date Jul 24, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yi-Li Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Aluminum coated copper bond wire and method of making the same
    • Patent number 9,966,355
    • Issue date May 8, 2018
    • Heraeus Deutschland GmbH & Co. KG
    • Eugen Milke
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,887,172
    • Issue date Feb 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire and method for manufacturing same
    • Patent number 9,434,027
    • Issue date Sep 6, 2016
    • NIPPON MICROMETAL CORPORATION
    • Ryo Togashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing a plurality of metal posts
    • Patent number 9,263,407
    • Issue date Feb 16, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yi-Li Hsiao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Process for manufacturing a conductive wire suitable for use in sem...
    • Patent number 6,711,925
    • Issue date Mar 30, 2004
    • Asep Tec Co., Ltd.
    • Pen-Tien Liao
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents