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H01L2224/03825

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03825Plating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 12,062,630
- Issue date Aug 13, 2024
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 11,824,024
- Issue date Nov 21, 2023
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
- Patent number 11,817,461
- Issue date Nov 14, 2023
- TCL China Star Optoelectronics Technology Co., Ltd.
- Maoxia Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,476,211
- Issue date Oct 18, 2022
- Nepes Co., Ltd.
- Jun Kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 11,424,203
- Issue date Aug 23, 2022
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 11,114,315
- Issue date Sep 7, 2021
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,004,814
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip wire bondless power device
- Patent number 10,720,380
- Issue date Jul 21, 2020
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 10,461,052
- Issue date Oct 29, 2019
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an optical inspection feature
- Patent number 10,431,560
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing the same
- Patent number 9,825,209
- Issue date Nov 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuma Mima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing molded semiconductor packages having an opt...
- Patent number 9,806,043
- Issue date Oct 31, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 9,754,909
- Issue date Sep 5, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,432
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing same
- Patent number 9,595,651
- Issue date Mar 14, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihisa Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,515,051
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die substrate assembly and method
- Patent number 9,324,674
- Issue date Apr 26, 2016
- Ampleon Netherlands B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge contacts for semiconductor devices
- Patent number 9,190,347
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240014156
- Publication date Jan 11, 2024
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING PANEL, METHOD MANUFACTURING THE SAME, AND DISPLAY DE...
- Publication number 20220320143
- Publication date Oct 6, 2022
- TCL China Star Optoelectronics Technology Co., Ltd.
- Maoxia Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20220285301
- Publication date Sep 8, 2022
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181279
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20210398822
- Publication date Dec 23, 2021
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233879
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210193602
- Publication date Jun 24, 2021
- NEPES CO., LTD.
- Jun Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
- Publication number 20200402950
- Publication date Dec 24, 2020
- IMEC vzw
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20200365538
- Publication date Nov 19, 2020
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200203187
- Publication date Jun 25, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package
- Publication number 20200006267
- Publication date Jan 2, 2020
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190385964
- Publication date Dec 19, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package Having an Optical Inspection Feature
- Publication number 20180033752
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20170330853
- Publication date Nov 16, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Molded Semiconductor Packages Having an Opt...
- Publication number 20170256509
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20170040276
- Publication date Feb 9, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140191418
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Edge Contacts for Semiconductor Devices
- Publication number 20130328215
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Constructions and Methods of Planarizing Across a Plu...
- Publication number 20130309861
- Publication date Nov 21, 2013
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCTIONS
- Publication number 20130234319
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120193793
- Publication date Aug 2, 2012
- Kabushiki Kaisha Toshiba
- Teppei TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Edge Contacts for Semiconductor Devices
- Publication number 20120056328
- Publication date Mar 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging method and package structure

Semiconductor module and method of manufacturing semiconductor module

Semiconductor device with metal film on surface between passivation...

Conductive barrier direct hybrid bonding

Semiconductor module and method of manufacturing semiconductor module

Light-emitting panel, method manufacturing the same, and display de...

Semiconductor device

Semiconductor package and manufacturing method thereof

Method of manufacturing semiconductor device

Semiconductor module and method of manufacturing semiconductor module

Method for the electrical bonding of semiconductor components

Conductive barrier direct hybrid bonding

Chip packaging method and package structure

Semiconductor device

Flip-chip wire bondless power device

Copper structures with intermetallic coating for integrated circuit...

Molded semiconductor package having an optical inspection feature

Electronic component package and method for manufacturing the same

Method of manufacturing molded semiconductor packages having an opt...

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Copper structures with intermetallic coating for integrated circuit...

Interconnect structure comprising fine pitch backside metal redistr...

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Electronic component package and method for manufacturing same

Metal to metal bonding for stacked (3D) integrated circuits

Die substrate assembly and method

Die edge contacts for semiconductor devices

Patents Applicationslast 30 patents

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

LIGHT-EMITTING PANEL, METHOD MANUFACTURING THE SAME, AND DISPLAY DE...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

Molded Semiconductor Package

SEMICONDUCTOR DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Molded Semiconductor Package Having an Optical Inspection Feature

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...

Method of Manufacturing Molded Semiconductor Packages Having an Opt...

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Die Edge Contacts for Semiconductor Devices

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

Semiconductor Constructions and Methods of Planarizing Across a Plu...

SEMICONDUCTOR CONSTRUCTIONS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Die Edge Contacts for Semiconductor Devices