Plating

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CPC
H01L2224/0346

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0346Plating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,059
- Issue date Oct 1, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip structure with conductive structure
- Patent number 12,057,419
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 12,040,294
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,990,432
- Issue date May 21, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...
- Publication number 20240363562
- Publication date Oct 31, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347487
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE LAYER
- Publication number 20240347488
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...
- Publication number 20240321730
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...
- Publication number 20240321653
- Publication date Sep 26, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...
- Publication number 20240304648
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...
- Publication number 20240304575
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- ZZU-CHI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
- Publication number 20240290736
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Shinzo ISHIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR
- Publication number 20240282726
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20240279835
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...
- Publication number 20240258255
- Publication date Aug 1, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240250048
- Publication date Jul 25, 2024
- TDK Corporation
- Kosuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240234351
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222331
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...
- Publication number 20240213191
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Package structure and method of fabrcating the same

Iterative formation of damascene interconnects

Method of fabricating a semiconductor device

Bonding structures of integrated circuit devices and method forming...

Method for fabricating semiconductor device with redistribution plugs

Semiconductor package and manufacturing method thereof

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Bond pad with micro-protrusions for direct metallic bonding

Stacked semiconductor structure and method

Chip package

Method for forming chip structure with conductive structure

Semiconductor devices and semiconductor packages including the same

Chip package, method of forming a chip package and method of formin...

Semiconductor device having a dual material redistribution line

Redistribution layer and integrated circuit including redistributio...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor structure

Structure and method of forming a joint assembly

Multiple plated via arrays of different wire heights on a same subs...

Fingerprint sensor and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Semiconductor packaging method and semiconductor package device

Semiconductor structure and manufacturing method thereof

Method of forming brass-coated metals in flip-chip redistribution l...

Interposer, method for fabricating the same, and semiconductor pack...

Vertical inductor for WLCSP

Via for semiconductor device connection and methods of forming the...

Stacked semiconductor package

Semiconductor structure having polygonal bonding pad

Patents Applicationslast 30 patents

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

CHIP PACKAGE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHIP STRUCTURE WITH CONDUCTIVE LAYER

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...

ALLOY FOR METAL UNDERCUT REDUCTION

MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...

ELECTRONIC COMPONENT

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...