Platinum [Pt] as principal constituent

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H01L2224/13169

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13169Platinum [Pt] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution layers
- Patent number 11,393,797
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor systems and methods for providing sensor systems
- Patent number 11,289,444
- Issue date Mar 29, 2022
- General Electric Company
- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,018,101
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 10,985,114
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 10,943,880
- Issue date Mar 9, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution layers
- Patent number 10,867,967
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack and method for manufacturing semiconductor...
- Patent number 10,861,813
- Issue date Dec 8, 2020
- SHARP KABUSHIKI KAISHA
- Toshiya Ishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods for semiconductor devices comprising forming tren...
- Patent number 10,832,999
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,804,218
- Issue date Oct 13, 2020
- Samsung Electronics Co., Ltd.
- Young-Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibration device, electronic apparatus, and vehicle
- Patent number 10,784,835
- Issue date Sep 22, 2020
- Seiko Epson Corporation
- Ryuta Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 10,748,871
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seong Hwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming superconducting structures
- Patent number 10,651,233
- Issue date May 12, 2020
- Northrop Grumman Systems Corporation
- Jeffrey David Hartman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a reinforcing member
- Patent number 10,573,852
- Issue date Feb 25, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20240297086
- Publication date Sep 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145418
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240145367
- Publication date May 2, 2024
- MEDIATEK SINGAPORE PTE LTD
- Jubao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Platinum-Based Solder Body Contacts for Integration of a First Subs...
- Publication number 20240128213
- Publication date Apr 18, 2024
- Newport Fab. LLC dba Tower Semiconductor Newport Beach
- Zhirong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096819
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Bong Ken YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006362
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING
- Publication number 20230369270
- Publication date Nov 16, 2023
- Northrop Grumman Systems Corporation
- JUSTIN C. HACKLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317532
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Il Geun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
- Publication number 20230207573
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- JI WOONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111343
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Choong Bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230049315
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230025936
- Publication date Jan 26, 2023
- National Yang Ming Chiao Tung University
- Han-Wen HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
- Publication number 20230005878
- Publication date Jan 5, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple plated via arrays of different wire heights on a same subs...

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor device and package assembly including the same

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor chip with reduced pitch conductive pillars

Bonding element and method for manufacturing the same

Chip package with redistribution layers

Film scheme for bumping

Sensor systems and methods for providing sensor systems

Wafer level integration including design/co-design, structure proce...

Film scheme for bumping

Semiconductor devices, semiconductor packages, and methods of manuf...

Scheme for connector site spacing and resulting structures

Interconnection structure including a metal post encapsulated by a...

Semiconductor chip with reduced pitch conductive pillars

Lead free solder columns and methods for making same

Mechanisms for forming hybrid bonding structures with elongated bumps

Chip package with redistribution layers

Semiconductor chip stack and method for manufacturing semiconductor...

Packaging methods for semiconductor devices comprising forming tren...

Semiconductor package

Elongated bump structures in package structure

Vibration device, electronic apparatus, and vehicle

Semiconductor chip and semiconductor package including the same

Film scheme for bumping

Method for forming superconducting structures

Multiple plated via arrays of different wire heights on same substrate

Semiconductor package

Display device including a reinforcing member

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Coating of Nanowires

INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

REVERSABLE ATTACHMENT SYSTEM

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

Platinum-Based Solder Body Contacts for Integration of a First Subs...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

METAL PILLAR FOR CONDUCTIVE CONNECTION

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

SEMICONDUCTOR PACKAGE

BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING

SEMICONDUCTOR DEVICE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

DISPLAY PANEL

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF