Platinum [Pt] as principal constituent

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H01L2224/29169

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29169Platinum [Pt] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material with two different size nickel particles
- Patent number 11,552,042
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fastening a semiconductor chip on a substrate, and elect...
- Patent number 11,315,898
- Issue date Apr 26, 2022
- OSRAM OLED GmbH
- Klaus Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor apparatus
- Patent number 10,847,699
- Issue date Nov 24, 2020
- Nikkiso Co., Ltd.
- Shoichi Niizeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Optical package structure, optical module, and method for manufactu...
- Patent number 10,720,751
- Issue date Jul 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,700,036
- Issue date Jun 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joining
- Patent number 10,504,868
- Issue date Dec 10, 2019
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for producing a device
- Patent number 10,431,715
- Issue date Oct 1, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature high reliability alloy for solder hierarchy
- Patent number 10,322,471
- Issue date Jun 18, 2019
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-adhesive die
- Patent number 10,312,212
- Issue date Jun 4, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor light emitting device including cap structure and met...
- Patent number 10,205,075
- Issue date Feb 12, 2019
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for producing a device
- Patent number 10,204,880
- Issue date Feb 12, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanomicrocrystallite paste for pressureless sintering
- Patent number 9,875,983
- Issue date Jan 23, 2018
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC with solderable sidewalls
- Patent number 9,780,060
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with support structure
- Patent number 9,263,364
- Issue date Feb 16, 2016
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,099,425
- Issue date Aug 4, 2015
- Kabushiki Kaisha Toshiba
- Keiichi Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame semiconductor packages and methods of formation thereof
- Patent number 8,951,841
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Melissa Mei Ching Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240266310
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi TANIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fastening a Semiconductor Chip on a Substrate, and Elect...
- Publication number 20220208715
- Publication date Jun 30, 2022
- OSRAM OLED GmbH
- Klaus Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20220028821
- Publication date Jan 27, 2022
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20210057370
- Publication date Feb 25, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200286849
- Publication date Sep 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fastening a Semiconductor Chip on a Substrate, and Elect...
- Publication number 20200211997
- Publication date Jul 2, 2020
- OSRAM OLED GmbH
- Klaus Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200126946
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for Producing a Device
- Publication number 20180261564
- Publication date Sep 13, 2018
- Osram Opto Semiconductors GmbH
- Barbara Behr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND MET...
- Publication number 20180159005
- Publication date Jun 7, 2018
- GLO AB
- Anusha POKHRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170200693
- Publication date Jul 13, 2017
- Hamamatsu Photonics K.K.
- Yoshimaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
- Publication number 20150179603
- Publication date Jun 25, 2015
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20140273318
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Yung Ho RYU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact and die attach metallization for silicon carbide based devi...

Layer structure with an intermetallic phase layer and a chip packag...

Electronic device with multi-layer contact and system

Solder material with two different size nickel particles

Method for fastening a semiconductor chip on a substrate, and elect...

Contact and die attach metallization for silicon carbide based devi...

Bonded structure and method of manufacturing the same

Method and apparatus for creating a bond between objects based on f...

Encapsulated stress mitigation layer and power electronic assemblie...

Optical semiconductor apparatus

Copper paste for joining, method for manufacturing joined body, and...

Optical package structure, optical module, and method for manufactu...

Encapsulated stress mitigation layer and power electronic assemblie...

Solder joining

Method for producing electronic device with multi-layer contact

Method for applying a bonding layer

Device and method for producing a device

Low temperature high reliability alloy for solder hierarchy

Self-adhesive die

Semiconductor light emitting device including cap structure and met...

Device and method for producing a device

Electronic device and method for producing an electronic device

Method for producing composite structure with metal/metal bonding

Nanomicrocrystallite paste for pressureless sintering

Packaged IC with solderable sidewalls

Method for applying a bonding layer

Joint material, and jointed body

Thermal interface material with support structure

Semiconductor device and method for manufacturing the same

Clip frame semiconductor packages and methods of formation thereof

Patents Applicationslast 30 patents

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

ELECTRONIC DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

DISPLAY PANEL

Method for Fastening a Semiconductor Chip on a Substrate, and Elect...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

Method for Fastening a Semiconductor Chip on a Substrate, and Elect...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

Device and Method for Producing a Device

SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND MET...

Packaged IC With Solderable Sidewalls

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

Electronic Device and Method for Producing an Electronic Device

ELECTRONIC COMPONENT

Packaged IC with Solderable Sidewalls

Electronic Device with Multi-Layer Contact

METHOD FOR APPLYING A BONDING LAYER

METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING

Joint Material, and Jointed Body

METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...

Semiconductor Modules and Methods of Formation Thereof