Plural coating layers

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CPC
H01L2224/13575

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13575Plural coating layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal core solder ball interconnector fan-out wafer level package
- Patent number 10,679,930
- Issue date Jun 9, 2020
- Hana Micron Inc.
- Hyun Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 9,524,945
- Issue date Dec 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High strength solder joint formation method for wafer level package...
- Patent number 7,629,246
- Issue date Dec 8, 2009
- National Semiconductor Corporation
- Viraj Patwardhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230282604
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP INTERCONNECTION WITH REDUCED CURRENT DENSITY
- Publication number 20150270241
- Publication date Sep 24, 2015
- Efficient Power Conversion Corporation
- ROBERT STRITTMATTER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Publication number 20120205797
- Publication date Aug 16, 2012
- Hynix Semiconductor Inc.
- Jin Ho BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110285011
- Publication date Nov 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling Solder Bump Profiles by Increasing Heights of Solder Re...
- Publication number 20110285013
- Publication date Nov 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High strength solder joint formation method for wafer level package...
- Publication number 20090057897
- Publication date Mar 5, 2009
- National Semiconductor Corporation
- Viraj Patwardhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Plural coating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with solder on pillar

Metal core solder ball interconnector fan-out wafer level package

Cu pillar bump with L-shaped non-metal sidewall protection structure

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Cu pillar bump with L-shaped non-metal sidewall protection structure

High strength solder joint formation method for wafer level package...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

Harvested Reconstitution Bumping

FLIP CHIP INTERCONNECTION WITH REDUCED CURRENT DENSITY

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE

Controlling Solder Bump Profiles by Increasing Heights of Solder Re...

High strength solder joint formation method for wafer level package...