Plural external layers

Industry

CPC
H01L2224/05575

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05575Plural external layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step method of rapid curing a semiconductor polymer layer
- Patent number 10,204,803
- Issue date Feb 12, 2019
- Deca Technologies Inc.
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package having a multi-layer m...
- Patent number 10,177,117
- Issue date Jan 8, 2019
- Amkor Technology Inc.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,761,510
- Issue date Sep 12, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bonded heat sinks
- Patent number 9,721,866
- Issue date Aug 1, 2017
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having multiple hea...
- Patent number 9,224,711
- Issue date Dec 29, 2015
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensating for warpage of a flip chip package by varying heights...
- Patent number 9,165,850
- Issue date Oct 20, 2015
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensating for warpage of a flip chip package by varying heights...
- Patent number 9,059,106
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating last level copper-to-C4 connection with inte...
- Patent number 7,863,183
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140197533
- Publication date Jul 17, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...
- Publication number 20140117535
- Publication date May 1, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
- Publication number 20110266670
- Publication date Nov 3, 2011
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTE...
- Publication number 20070166992
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Plural external layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming conductive layer, and conductive structure and f...

Semiconductor product with interlocking metal-to-metal bonds and me...

Additive manufacturing of a frontside or backside interconnect of a...

Semiconductor product with interlocking metal-to-metal bonds and me...

Two step method of rapid curing a semiconductor polymer layer

Method for fabricating semiconductor package having a multi-layer m...

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Chip package and method for forming the same

Semiconductor device having multiple bonded heat sinks

Method for manufacturing a semiconductor device having multiple hea...

Compensating for warpage of a flip chip package by varying heights...

Compensating for warpage of a flip chip package by varying heights...

Method for fabricating last level copper-to-C4 connection with inte...

Patents Applicationslast 30 patents

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...

WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE

METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTE...