Plural internal layers

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H01L2224/05075

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05075Plural internal layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package including embedded conductive elements
- Patent number 11,282,817
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on a back side illuminated image sensor
- Patent number 11,011,566
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
- Patent number 10,916,516
- Issue date Feb 9, 2021
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms of forming connectors for package on package
- Patent number 10,553,561
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 10,192,755
- Issue date Jan 29, 2019
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,972,505
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,748,191
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,508,630
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,287
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,286
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 9,035,459
- Issue date May 19, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Robust joint structure for flip-chip bonding
- Patent number 8,847,387
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 8,803,317
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,785,318
- Issue date Jul 22, 2014
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,552,552
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,552,555
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Dummy pattern in wafer backside routing
- Patent number 8,174,124
- Issue date May 8, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH
- Publication number 20180358313
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20180197753
- Publication date Jul 12, 2018
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
MECHANISMS OF FORMING CONNECTORS FOR PACKAGE ON PACKAGE
- Publication number 20160343691
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Pad on a Back Side Illuminated Image Sensor
- Publication number 20160148967
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20160126264
- Publication date May 5, 2016
- RENESAS ELECTRONICS CORPORATION
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20160126203
- Publication date May 5, 2016
- RENESAS ELECTRONICS CORPORATION
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140312493
- Publication date Oct 23, 2014
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
BONDING PAD ON A BACK SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20140225215
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- VOLUME CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130344693
- Publication date Dec 26, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130020701
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...
- Publication number 20120187558
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Dummy Pattern in Wafer Backside Routing
- Publication number 20110248404
- Publication date Oct 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust Joint Structure for Flip-Chip Bonding
- Publication number 20110101519
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...
- Publication number 20100258335
- Publication date Oct 14, 2010
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20090121349
- Publication date May 14, 2009
- RENESAS TECHNOLOGY CORP.
- Shinya Suzuki
- G02 - OPTICS

Plural internal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package including embedded conductive elements

Semiconductor device and a method of manufacturing the same

Semiconductor packages with an intermetallic layer

Bonding pad on a back side illuminated image sensor

High bandwidth memory (HBM) bandwidth aggregation switch

Semiconductor device and a method of manufacturing the same

Mechanisms of forming connectors for package on package

Semiconductor device and a method of manufacturing the same

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Semiconductor device and a method of manufacturing the same

Methods of forming semiconductor packages with an intermetallic lay...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Structures for improving current carrying capability of interconnec...

Robust joint structure for flip-chip bonding

Structures for improving current carrying capability of interconnec...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Dummy pattern in wafer backside routing

Patents Applicationslast 30 patents

HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

MECHANISMS OF FORMING CONNECTORS FOR PACKAGE ON PACKAGE

Bonding Pad on a Back Side Illuminated Image Sensor

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

BONDING PAD ON A BACK SIDE ILLUMINATED IMAGE SENSOR

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...

Dummy Pattern in Wafer Backside Routing

Robust Joint Structure for Flip-Chip Bonding

STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME