Polyamide

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CPC
H01L2924/0695

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/0695Polyamide

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 12,113,005
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure
- Patent number 11,791,310
- Issue date Oct 17, 2023
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 11,139,267
- Issue date Oct 5, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 10,998,289
- Issue date May 4, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improvement layer and fabrication method the...
- Patent number 10,910,343
- Issue date Feb 2, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detecting delamination in an integrated circuit package s...
- Patent number 10,699,977
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,566,302
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cured film formed by curing photosensitive resin composition and me...
- Patent number 10,545,406
- Issue date Jan 28, 2020
- Toray Industries, Inc.
- Yu Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling bond layer and power electronics assemblies incorporating t...
- Patent number 10,388,590
- Issue date Aug 20, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and testing method using the same
- Patent number 10,347,548
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,103,118
- Issue date Oct 16, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assembly comprising an element that is capable of transmitting heat...
- Patent number 9,865,530
- Issue date Jan 9, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 9,837,367
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced board level reliability for wafer level packages
- Patent number 9,837,368
- Issue date Dec 5, 2017
- Maxim Integrated Products, Inc.
- Peter R. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 9,607,914
- Issue date Mar 28, 2017
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-to-wafer bonding structure
- Patent number 9,461,007
- Issue date Oct 4, 2016
- Samsung Electronics Co., Ltd.
- Jin-ho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive die attach film for large die semiconductor packages and...
- Patent number 9,449,938
- Issue date Sep 20, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME
- Publication number 20240363512
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240332272
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20230230909
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY
- Publication number 20210391292
- Publication date Dec 16, 2021
- Mitsui Chemicals, Inc.
- Yasuhisa KAYABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20210391300
- Publication date Dec 16, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURES
- Publication number 20210233890
- Publication date Jul 29, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027857
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027858
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200027859
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...
- Publication number 20190333829
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- G01 - MEASURING TESTING
Information Patent Application
COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...
- Publication number 20190237389
- Publication date Aug 1, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURED FILM AND METHOD FOR MANUFACTURING SAME
- Publication number 20180203353
- Publication date Jul 19, 2018
- TORAY INDUSTRIES, INC.
- Yu SHOJI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE AND TESTING METHOD USING THE SAME
- Publication number 20180156865
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180108631
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly comprising an element that is capable of transmitting heat...
- Publication number 20170011991
- Publication date Jan 12, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Rabih KHAZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20160268178
- Publication date Sep 15, 2016
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20160013160
- Publication date Jan 14, 2016
- Samsung Electronics Co., Ltd.
- Jin-ho CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150262917
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Takeshi FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BOARD LEVEL RELIABILITY FOR WAFER LEVEL PACKAGES
- Publication number 20150255413
- Publication date Sep 10, 2015
- Maxim Integrated Products, Inc.
- Peter R. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OBTAINING THREE-DIMENSIONAL ACTIN STRUCTURES AND USES TH...
- Publication number 20150048513
- Publication date Feb 19, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATVIES
- Jean-Christophe Gabriel
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with Si-substrate-free interposer and method forming same

Semiconductor packaging structure

Packaging structure and forming method thereof

Packaging structure and forming method thereof

Package structure with improvement layer and fabrication method the...

Fabrication of solder balls with injection molded solder

Method of detecting delamination in an integrated circuit package s...

Fabrication of solder balls with injection molded solder

Cured film formed by curing photosensitive resin composition and me...

Cooling bond layer and power electronics assemblies incorporating t...

Integrated circuit package structure and testing method using the same

Composition for anisotropic conductive film, anisotropic conductive...

Fabrication of solder balls with injection molded solder

Molded composite enclosure for integrated circuit assembly

Assembly comprising an element that is capable of transmitting heat...

Fabrication of solder balls with injection molded solder

Enhanced board level reliability for wafer level packages

Molded composite enclosure for integrated circuit assembly

Wafer-to-wafer bonding structure

Conductive die attach film for large die semiconductor packages and...

Method for obtaining three-dimensional actin structures and uses th...

Patents Applicationslast 30 patents

PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME

DIE ISOLATION WITH CONFORMAL COATING

ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

Packages with Si-Substrate-Free Interposer and Method Forming Same

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY

SEMICONDUCTOR PACKAGING STRUCTURE

PACKAGING STRUCTURES

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...

COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...

CURED FILM AND METHOD FOR MANUFACTURING SAME

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND TESTING METHOD USING THE SAME

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

Assembly comprising an element that is capable of transmitting heat...

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

WAFER-TO-WAFER BONDING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ENHANCED BOARD LEVEL RELIABILITY FOR WAFER LEVEL PACKAGES

METHOD FOR OBTAINING THREE-DIMENSIONAL ACTIN STRUCTURES AND USES TH...