Polychromatic or infrared lamp heating

Industry

CPC
H01L2224/8123

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8123Polychromatic or infrared lamp heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated pins to couple with solder elements
- Patent number 11,830,846
- Issue date Nov 28, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,798,907
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array to support grid heating
- Patent number 11,545,408
- Issue date Jan 3, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array as standby heater for reliability
- Patent number 11,488,839
- Issue date Nov 1, 2022
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for soldering a plurality of chips using a fla...
- Patent number 10,304,797
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with temperature sensor traces
- Patent number 10,260,961
- Issue date Apr 16, 2019
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 10,147,641
- Issue date Dec 4, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection with reduced current density
- Patent number 10,090,274
- Issue date Oct 2, 2018
- Efficient Power Conversion Corporation
- Robert Strittmatter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,935,044
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip package
- Patent number 9,893,043
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D IC method and device
- Patent number 9,716,033
- Issue date Jul 25, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow process and tool
- Patent number 9,373,603
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220148989
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TRANSFERRING SYSTEM AND CHIP-TRANSFERRING METHOD
- Publication number 20220093557
- Publication date Mar 24, 2022
- Skiileux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-CARRYING STRUCTURE AND CHIP-BONDING METHOD
- Publication number 20220020723
- Publication date Jan 20, 2022
- Skiileux Electricity Inc.
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING...
- Publication number 20210320088
- Publication date Oct 14, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USIN...
- Publication number 20210134695
- Publication date May 6, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERCONNECTION STRUCTURE, CHIP, AND CHIP INTERCONNECTION METHOD
- Publication number 20210050330
- Publication date Feb 18, 2021
- Shenzhen Goodix Technology Co., Ltd.
- Hanjian LENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATED PINS TO COUPLE WITH SOLDER ELEMENTS
- Publication number 20200381388
- Publication date Dec 3, 2020
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structures and Methods
- Publication number 20200035510
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SOLDERING A PLURALITY OF CHIPS USING A FLA...
- Publication number 20190027461
- Publication date Jan 24, 2019
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20180350767
- Publication date Dec 6, 2018
- Intel Corporation
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20170294402
- Publication date Oct 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20170179069
- Publication date Jun 22, 2017
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT
- Publication number 20160099228
- Publication date Apr 7, 2016
- HGST NETHERLANDS B.V.
- Luiz M. FRANCA-NETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...
- Publication number 20140220737
- Publication date Aug 7, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20140187040
- Publication date Jul 3, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Polychromatic or infrared lamp heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Semiconductor bonding structures and methods

Method for transferring electronic device

Apparatus and method for forming a package structure

Heated pins to couple with solder elements

Semiconductor packages

Semiconductor bonding structures and methods

Reflowable grid array to support grid heating

3D IC method and device

Reflowable grid array as standby heater for reliability

Semiconductor package and method for manufacturing the same

System for processing semiconductor devices

3D IC method and device

3D IC method and device

Bonding package components through plating

Method of processing solder bump by vacuum annealing

Semiconductor chip package with resilient conductive paste post and...

Bonding package components through plating

Apparatus and method for soldering a plurality of chips using a fla...

Apparatus and method for contactless transfer and soldering of chip...

Integrated circuit packages with temperature sensor traces

3D IC method and device

Mounted substrate, mounted-substrate production method, and mounted...

Tools and systems for processing semiconductor devices, and methods...

Flip chip interconnection with reduced current density

Semiconductor packaging and manufacturing method thereof

Method of manufacturing a chip package

Ball grid array system

3D IC method and device

Reflow process and tool

Patents Applicationslast 30 patents

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

Tools and Systems for Processing Semiconductor Devices, and Methods...

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGES

CHIP-TRANSFERRING SYSTEM AND CHIP-TRANSFERRING METHOD

CHIP-CARRYING STRUCTURE AND CHIP-BONDING METHOD

LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING...

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USIN...

CHIP INTERCONNECTION STRUCTURE, CHIP, AND CHIP INTERCONNECTION METHOD

HEATED PINS TO COUPLE WITH SOLDER ELEMENTS

Semiconductor Bonding Structures and Methods

Bonding Package Components Through Plating

3D IC METHOD AND DEVICE

APPARATUS AND METHOD FOR SOLDERING A PLURALITY OF CHIPS USING A FLA...

Tools and Systems for Processing Semiconductor Devices, and Methods...

BALL GRID ARRAY SOLDER ATTACHMENT

3D IC METHOD AND DEVICE

Bonding Package Components Through Plating

BALL GRID ARRAY SOLDER ATTACHMENT

METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

Methods for Metal Bump Die Assembly

3D IC METHOD AND DEVICE