Polychromatic or infrared lamp heating

Industry

CPC
H01L2224/8323

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8323Polychromatic or infrared lamp heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for an optoelectronic component, method of producing a carr...
- Patent number 10,991,853
- Issue date Apr 27, 2021
- OSRAM OLED GmbH
- Christoph Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED transferring method, micro LED display panel and micro LE...
- Patent number 10,741,739
- Issue date Aug 11, 2020
- Zeshang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 10,180,288
- Issue date Jan 15, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Slotted configuration for optimized placement of micro-components u...
- Patent number 10,175,448
- Issue date Jan 8, 2019
- Cisco Technology, Inc.
- Mary Nadeau
- G02 - OPTICS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Methods for preparing layered semiconductor structures
- Patent number 10,068,795
- Issue date Sep 4, 2018
- GlobalWafers Co., Ltd.
- Michael J. Ries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure of semiconductor device
- Patent number 9,997,430
- Issue date Jun 12, 2018
- Omron Corporation
- Eiichi Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 9,818,718
- Issue date Nov 14, 2017
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 9,666,573
- Issue date May 30, 2017
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 9,601,452
- Issue date Mar 21, 2017
- Northrup Grumman Systems Corporation
- John A. Starkovich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of RFID chip as assembly facilitator
- Patent number 9,373,070
- Issue date Jun 21, 2016
- Avery Dennison Corporation
- Ian James Forster
- B32 - LAYERED PRODUCTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for producing a power semicon...
- Patent number 9,111,900
- Issue date Aug 18, 2015
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of bonding components for fabricating electronic assemblies...
- Patent number 8,967,453
- Issue date Mar 3, 2015
- GM Global Technology Operations LLC
- Khiet Le
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted configuration for optimized placement of micro-components u...
- Patent number 8,836,100
- Issue date Sep 16, 2014
- Cisco Technology, Inc.
- Mary Nadeau
- G02 - OPTICS
Information Patent Grant
Method of Manufacturing a semiconductor module and device for the same
- Patent number 8,791,564
- Issue date Jul 29, 2014
- Toyota Jidosha Kabushiki Kaisha
- Hiroki Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TRANSFERRING A DIE FROM A CARRIER TO A RECEIVE SUBSTRATE...
- Publication number 20230107245
- Publication date Apr 6, 2023
- KULICKE & SOFFA NETHERLANDS B.V.
- Val R. Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINT DEVICE AND CONTROL METHOD FOR JOINT DEVICE
- Publication number 20200176414
- Publication date Jun 4, 2020
- JTEKT Corporation
- Koichiro MATSUHISA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157241
- Publication date May 23, 2019
- Toyota Jidosha Kabushiki Kaisha
- Satoru TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED TRANSFERRING METHOD, MICRO LED DISPLAY PANEL AND MICRO LE...
- Publication number 20190148611
- Publication date May 16, 2019
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Zeshang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20170301602
- Publication date Oct 19, 2017
- Omron Corporation
- Eiichi Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20170141075
- Publication date May 18, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ken Osawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS
- Publication number 20160372438
- Publication date Dec 22, 2016
- Northrop Grumman Systems Corporation
- John A. Starkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20150060898
- Publication date Mar 5, 2015
- Reactive NanoTechnologies, Inc
- David Van Heerden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor device and method for producing a power semicon...
- Publication number 20150061112
- Publication date Mar 5, 2015
- SEMIKRON Elektronik GmbH & Co., KG
- Ingo BOGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS U...
- Publication number 20140362457
- Publication date Dec 11, 2014
- Mary NADEAU
- G02 - OPTICS
Information Patent Application
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
- Publication number 20130341804
- Publication date Dec 26, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING COMPONENTS FOR FABRICATING ELECTRONIC ASSEMBLIES...
- Publication number 20130250538
- Publication date Sep 26, 2013
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- KHIET LE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...
- Publication number 20120319253
- Publication date Dec 20, 2012
- Toyota Jidosha Kabushiki Kaisha
- Hiroki Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
- Publication number 20120279653
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Polychromatic or infrared lamp heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective micro device transfer to receiver substrate

Selective transfer of micro devices

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Carrier for an optoelectronic component, method of producing a carr...

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Micro LED transferring method, micro LED display panel and micro LE...

Curing a heat-curable material in an embedded curing zone

Conductive paste and die bonding method

High-conductivity bonding of metal nanowire arrays

Slotted configuration for optimized placement of micro-components u...

Mounted substrate, mounted-substrate production method, and mounted...

Methods for preparing layered semiconductor structures

Heat dissipation structure of semiconductor device

Conductive paste and die bonding method

Methods of forming integrated circuitry

High-conductivity bonding of metal nanowire arrays

Light emitting diodes and a method of packaging the same

Use of RFID chip as assembly facilitator

Light emitting diodes and a method of packaging the same

Chip-on-wafer bonding method and bonding device, and structure comp...

Power semiconductor device and method for producing a power semicon...

Methods of bonding components for fabricating electronic assemblies...

Slotted configuration for optimized placement of micro-components u...

Method of Manufacturing a semiconductor module and device for the same

Patents Applicationslast 30 patents

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

METHODS OF TRANSFERRING A DIE FROM A CARRIER TO A RECEIVE SUBSTRATE...

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

DIE BONDING APPARATUS AND DIE BONDING METHOD

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

JOINT DEVICE AND CONTROL METHOD FOR JOINT DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MICRO LED TRANSFERRING METHOD, MICRO LED DISPLAY PANEL AND MICRO LE...

HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

PROCESS OF FORMING SEMICONDUCTOR DEVICE

HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

Power semiconductor device and method for producing a power semicon...

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS U...

SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

METHODS OF BONDING COMPONENTS FOR FABRICATING ELECTRONIC ASSEMBLIES...

SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...

HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD