Polychromatic or infrared lamp heating

Industry

CPC
H01L2224/8523

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8523Polychromatic or infrared lamp heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining a micorelectronic chip to a wire element
- Patent number 11,081,466
- Issue date Aug 3, 2021
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
- Patent number 10,660,214
- Issue date May 19, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and processing methods
- Patent number 10,103,123
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor contact structure and method for the production...
- Patent number 10,079,219
- Issue date Sep 18, 2018
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device for electrical power, and...
- Patent number 9,899,345
- Issue date Feb 20, 2018
- MITSUBISHI ELECTRIC COOPERATION
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting inter-layer conductors and components in 3D s...
- Patent number 9,414,501
- Issue date Aug 9, 2016
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connection method
- Patent number 9,352,562
- Issue date May 31, 2016
- Canon Kabushiki Kaisha
- Tomohiro Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-surface welding
- Patent number 4,171,477
- Issue date Oct 16, 1979
- International Business Machines Corporation
- Joseph Funari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3258898
- Patent number 3,258,898
- Issue date Jul 5, 1966
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRAZE BONDED NAIL HEAD LEAD
- Publication number 20200043882
- Publication date Feb 6, 2020
- LUCAS-MILHAUPT, INC.
- Dean W Kick
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180211930
- Publication date Jul 26, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC FINGERPRINT RECOGNITION MODULE AND MANUFACTURING METHOD...
- Publication number 20180005002
- Publication date Jan 4, 2018
- Primax Electronics Ltd.
- CHANG-MING LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SEMICONDUCTOR CONTACT STRUCTURE AND METHOD FOR THE PRODUCTION...
- Publication number 20170317049
- Publication date Nov 2, 2017
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20170236801
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...
- Publication number 20160324009
- Publication date Nov 3, 2016
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE TERMINAL, SEMICONDUCTOR DEVICE FOR ELECTRICAL POWER, AND...
- Publication number 20160293563
- Publication date Oct 6, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems For Connecting Inter-Layer Conductors and Compo...
- Publication number 20140268607
- Publication date Sep 18, 2014
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONNECTION METHOD
- Publication number 20140225957
- Publication date Aug 14, 2014
- Canon Kabushiki Kaisha
- Tomohiro Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Joint Structure Between a Wound Coil and An IC-Chip for a Noncontac...
- Publication number 20100230161
- Publication date Sep 16, 2010
- Katsuji Hoshi
- H01 - BASIC ELECTRIC ELEMENTS

Polychromatic or infrared lamp heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for bonding insulated coating wire, connection structure, me...

Method for joining a micorelectronic chip to a wire element

Methods for connecting inter-layer conductors and components in 3D...

Semiconductor devices and processing methods

Power semiconductor contact structure and method for the production...

Electrode terminal, semiconductor device for electrical power, and...

Method for connecting inter-layer conductors and components in 3D s...

Electric connection method

Micro-surface welding

3258898

Patents Applicationslast 30 patents

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

BRAZE BONDED NAIL HEAD LEAD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ULTRASONIC FINGERPRINT RECOGNITION MODULE AND MANUFACTURING METHOD...

POWER SEMICONDUCTOR CONTACT STRUCTURE AND METHOD FOR THE PRODUCTION...

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...

ELECTRODE TERMINAL, SEMICONDUCTOR DEVICE FOR ELECTRICAL POWER, AND...

Methods and Systems For Connecting Inter-Layer Conductors and Compo...

ELECTRIC CONNECTION METHOD

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontac...