3258898

Information

• Patent Grant
• 3258898

• References
• Source

• Patent Number

  3,258,898

• Date Filed

  Not available

• Date Issued

  Tuesday, July 5, 1966
  59 years ago

• CPC

  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L49/02 - Thin-film or thick-film devices
  • H01L2224/05624 - Aluminium [Al] as principal constituent
  • H01L2224/45014 - Ribbon connectors
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/48624 - Aluminium (Al) as principal constituent
  • H01L2224/48724 - Aluminium (Al) as principal constituent
  • H01L2224/85201 - Compression bonding
  • H01L2224/85237 - using electron beam
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01024 - Chromium [Cr]
  • H01L2924/01025 - Manganese [Mn]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/0104 - Zirconium [Zr]
  • H01L2924/01073 - Tantalum [Ta]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12042 - LASER
  • H01L2924/15787 - Ceramics
  • H01L2924/19041 - being a capacitor
  • H01L2924/19043 - being a resistor
  • Y10T29/4913 - Assembling to base an electrical component, e.g., capacitor, etc.

• US Classifications

  • 029 - Metal working
  • 216 - Etching a substrate: processes
  • 219 - Electric heating
  • 257 - Active solid-state devices
  • 427 - Coating processes
  • 430 - Radiation imagery chemistry: process, composition, or product thereof
  • 438 - Semiconductor device manufacturing: process