Post-treatment of the bonding area

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H01L2224/038

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/038Post-treatment of the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
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- SET North America, LLC
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Information Patent Grant
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Thermocompression bonding with passivated gold contacting metal
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- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
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- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
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Moat coverage with dielectric film for device passivation and singu...
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Thermocompression bonding using metastable gas atoms
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Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
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- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure with conductive feature and method of forming same
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved wafer coating
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- Issue date Jan 14, 2025
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Semiconductor device including a structure for higher integration
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Method of forming a sensor device having moisture sensitive dielect...
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Process flow for fabrication of cap metal over top metal with sinte...
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Semiconductor wafer and method of ball drop on thin wafer with edge...
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
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Information Patent Grant
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- Issue date Nov 12, 2024
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Bonding structures of integrated circuit devices and method forming...
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Information Patent Grant
Die on die bonding structure
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- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
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- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...
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Post-treatment of the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bonding with passivated silver-based contacting m...

Semiconductor device

Thermocompression bonding with passivated gold contacting metal

Thermocompression bonding with passivated tin-based contacting metal

Semiconductor package and method of forming same

Method of forming integrated chip structure having slotted bond pad...

Conductive buffer layers for semiconductor die assemblies and assoc...

Moat coverage with dielectric film for device passivation and singu...

Die bonding pads and methods of forming the same

Methods for forming metal gapfill with low resistivity

Manufacturing method of flip chip package structure

Method for manufacturing an optical unit that comprises an array of...

Bond pads for semiconductor die assemblies and associated methods a...

Method for forming semiconductor structure

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Structure with conductive feature and method of forming same

Method and apparatus for improved wafer coating

Semiconductor device including a structure for higher integration

Contact pad fabrication process for a semiconductor product

Bond pad with enhanced reliability

Method of forming a sensor device having moisture sensitive dielect...

Process flow for fabrication of cap metal over top metal with sinte...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Iterative formation of damascene interconnects

Semiconductor device and method of manufacturing the same

Bonding structures of integrated circuit devices and method forming...

Die on die bonding structure

Method for preparing semiconductor device with wire bond

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE

STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED COMPONENT AND METHOD OF FORM...

SEMICONDUCTOR STRUCTURE HAVING OPTICAL COMPONENT AND MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF AN ELECTRONIC CIRCUIT COMPRISING CONTACT PADS

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

LAMINATE MANUFACTURING METHOD AND LAMINATE

Semiconductor structure and alignment method thereof

CHIP PAD SURFACE LEVELING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME