Post-treatment of the connector or wire bonding area

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H01L2224/85909

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85909Post-treatment of the connector or wire bonding area

Industries

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Post-treatment of the connector or wire bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor module and power converter

Packaged semiconductor assemblies and methods for manufacturing suc...

Packaged semiconductor assemblies and methods for manufacturing suc...

Semiconductor device manufacturing method

Packaged semiconductor assemblies and methods for manufacturing suc...

Packaged semiconductor assemblies and methods for manufacturing suc...

Packaged semiconductor assemblies and methods for manufacturing suc...

Semiconductor device and method for manufacturing the same

Semiconductor device with electrode pad having probe mark

Semiconductor chip package having an adhesive tape attached on bond...

Semiconductor device with electrode pad having probe mark

Semiconductor chip package having an adhesive tape attached on bond...

Colored conductive wires for a semiconductor package

Semiconductor chip package having an adhesive tape attached on bond...

Color contacts for a semiconductor package

Semiconductor device

Semiconductor device mounted on board by flip-chip and method for m...

Flip-chip interconnection having enhanced electrical connections

Media compatible microsensor structure and methods of manufacturing...

Fabrication method for chip size semiconductor package

Process of making an integrated circuit chip composite

Method of protecting bond wires during molding and handling

Method of wire bonding an integrated circuit to an ultraflexible su...

Integrated circuit chip composite having a parylene coating

Process of making an integrated circuit chip composite including pa...

Method for forming oxide protective film on bonding pads of semicon...

Wire bonding ultrasonic control system responsive to wire deformation

Electrical connector

Method of making a planarized thin film covered wire bonded semicon...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE AND POWER CONVERTER

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Flip-chip Mounting Structure and Flip-chip Mounting Method

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Semiconductor apparatus and manufacturing method of the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Semiconductor device with electrode pad having probe mark

Semiconductor device with electrode pad having probe mark

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor chip package having an adhesive tape attached on bond...

Semiconductor chip package having an adhesive tape attached on bond...

Colored conductive wires for a semiconductor package

Semiconductor device with electrode pad having probe mark

Semiconductor chip package having an adhesive tape attached on bond...

Solder balls and conductive wires for a semiconductor package, and...