Post-treatment of the layer connector

Industry

CPC
H01L2224/278

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/278Post-treatment of the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Thermocompression bond tips and related apparatus and methods
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Semiconductor device with connection structure and method for fabri...
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Information Patent Grant
Semiconductor wafer and method of manufacturing the same
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Information Patent Grant
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- Issue date Nov 1, 2022
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Jointing material, fabrication method for semiconductor device usin...
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- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
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Fingerprint sensor and manufacturing method thereof
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Semiconductor device with connection structure and method for fabri...
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Information Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
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Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
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Information Patent Grant
Semiconductor device that uses bonding layer to join semiconductor...
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Information Patent Grant
Manufacturing method of device chip
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- Issue date Jun 1, 2021
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ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
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SINTERING FILM FRAMES AND RELATED METHODS
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- Publication date Sep 12, 2024
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Post-treatment of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding member, method for producing bonding member and method for...

Bonding structures of integrated circuit devices and method forming...

Die on die bonding structure

Atomic layer deposition bonding layer for joining two semiconductor...

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Fingerprint sensor and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Joint connection of corner non-critical to function (NCTF) ball for...

Integrated circuit package and method of forming same

Semiconductor structure having silver-indium transient liquid phase...

Seal ring structures and methods of forming same

Semiconductor device comprising a can housing a semiconductor die w...

Manufacturing method for semiconductor apparatus and semiconductor...

Connection structure

Wafer on wafer bonding structure

Thermocompression bond tips and related apparatus and methods

Semiconductor device with connection structure and method for fabri...

Semiconductor wafer and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Back side metallization

Jointing material, fabrication method for semiconductor device usin...

Sintering materials and attachment methods using same

Fingerprint sensor and manufacturing method thereof

Semiconductor device with connection structure and method for fabri...

Silver-indium transient liquid phase method of bonding semiconducto...

Seal ring structures and methods of forming same

Wafer level integration including design/co-design, structure proce...

Connection structure

Semiconductor device that uses bonding layer to join semiconductor...

Manufacturing method of device chip

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

DIE ON DIE BONDING STRUCTURE

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

SINTERING FILM FRAMES AND RELATED METHODS

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

OPTICAL SENSOR PACKAGE

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Device and Manufacturing Method for Semiconductor Device

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Semiconductor Device and Manufacturing Method for Semiconductor Device

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATIO...

ELECTRONIC DEVICE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER