Post-treatment or after-treatment not introducing additional chemical elements into the layer

Industry

CPC
H01L21/76861

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76861Post-treatment or after-treatment not introducing additional chemical elements into the layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 12,131,994
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase control in contact formation
- Patent number 12,002,712
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 11,901,227
- Issue date Feb 13, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive feature and semiconductor device
- Patent number 11,842,925
- Issue date Dec 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 11,791,263
- Issue date Oct 17, 2023
- GLOBALFOUNDRIES U.S. INC.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 11,735,477
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal process chamber lid with backside pumping
- Patent number 11,715,667
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Anqing Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with low-galvanic corrosion structures, and me...
- Patent number 11,615,985
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,545,391
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase control in contact formation
- Patent number 11,410,880
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal titanium nitride-based thin films and methods of forming...
- Patent number 11,361,992
- Issue date Jun 14, 2022
- Eugenus, Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nucleation-free gap fill ALD process
- Patent number 11,289,374
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 11,233,006
- Issue date Jan 25, 2022
- GLOBALFOUNDRIES U.S. INC.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 11,168,407
- Issue date Nov 9, 2021
- Lam Research Comporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting pretreatment for enhanced damascene metal filling
- Patent number 10,840,101
- Issue date Nov 17, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silicon carbide semiconductor device having a metal adhesion and ba...
- Patent number 10,777,506
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 10,741,443
- Issue date Aug 11, 2020
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,672,656
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation resistant barrier metal process for semiconductor devices
- Patent number 10,665,543
- Issue date May 26, 2020
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 10,648,097
- Issue date May 12, 2020
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 10,580,695
- Issue date Mar 3, 2020
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having a metal adhesion and barrier structure...
- Patent number 10,475,743
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high-K gate dielectric layer and fabricat...
- Patent number 10,431,501
- Issue date Oct 1, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten film forming method and storage medium
- Patent number 10,400,330
- Issue date Sep 3, 2019
- Tokyo Electron Limited
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 10,325,805
- Issue date Jun 18, 2019
- Kabushiki Kaisha Toshiba
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 10,301,738
- Issue date May 28, 2019
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wet etch removal of Ru selective to other metals
- Patent number 10,242,909
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for forming low resistivity metal contacts and...
- Patent number 10,229,826
- Issue date Mar 12, 2019
- Lam Research Corporation
- Raihan Tarafdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,170,417
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN LAYERS BY SELECTIVE PASSIVATION
- Publication number 20240321633
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Forming the Same
- Publication number 20240282569
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CONTROL IN CONTACT FORMATION
- Publication number 20240282626
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY FORMING LAYER USING ATOMIC LAYER DEPOSITION A...
- Publication number 20240203788
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Eunhyoung CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...
- Publication number 20230369111
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING
- Publication number 20230335434
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Anqing Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THRO...
- Publication number 20230260837
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Hyungjun Hur
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND ME...
- Publication number 20230253249
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. MORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CONDUCTIVE FEATURE AND SEMICONDUCTOR DEVICE
- Publication number 20230230879
- Publication date Jul 20, 2023
- NANYA TECHNOLOGY CORPORATION
- CHE-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230207388
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Younghoon Goo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION
- Publication number 20230197508
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA PROCESS WITH DAMASCENE METAL
- Publication number 20230094757
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20230058288
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...
- Publication number 20220415709
- Publication date Dec 29, 2022
- EUGENUS, INC.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phase Control in Contact Formation
- Publication number 20220352020
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING
- Publication number 20220246471
- Publication date Aug 4, 2022
- Applied Materials, Inc.
- Anqing Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND ME...
- Publication number 20220216102
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. MORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nucleation-Free Gap Fill ALD Process
- Publication number 20220172989
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Yihong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20220102208
- Publication date Mar 31, 2022
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...
- Publication number 20210104433
- Publication date Apr 8, 2021
- EUGENUS, INC.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phase Control in Contact Formation
- Publication number 20200343135
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20200255964
- Publication date Aug 13, 2020
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20200185273
- Publication date Jun 11, 2020
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...
- Publication number 20200013722
- Publication date Jan 9, 2020
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH-K GATE DIELECTRIC LAYER
- Publication number 20190378766
- Publication date Dec 12, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nucleation-Free Gap Fill ALD Process
- Publication number 20190371662
- Publication date Dec 5, 2019
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20190301040
- Publication date Oct 3, 2019
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PROTECTING COBALT PLUGS
- Publication number 20190259650
- Publication date Aug 22, 2019
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190259659
- Publication date Aug 22, 2019
- Kabushiki Kaisha Toshiba
- Masayuki KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Post-treatment or after-treatment not introducing additional chemical elements into the layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metallization lines on integrated circuit products

Phase control in contact formation

Feature fill with nucleation inhibition

Top via process with damascene metal

Method for fabricating conductive feature and semiconductor device

Metallization lines on integrated circuit products

Method of semiconductor integrated circuit fabrication

Thermal process chamber lid with backside pumping

Semiconductor device with low-galvanic corrosion structures, and me...

Conductive interconnects and methods of forming conductive intercon...

Phase control in contact formation

Conformal titanium nitride-based thin films and methods of forming...

Nucleation-free gap fill ALD process

Metallization lines on integrated circuit products

Copper electrodeposition on cobalt lined features

Wetting pretreatment for enhanced damascene metal filling

Silicon carbide semiconductor device having a metal adhesion and ba...

Method for manufacturing a semiconductor device

Method of semiconductor integrated circuit fabrication

Oxidation resistant barrier metal process for semiconductor devices

Copper electrodeposition on cobalt lined features

Feature fill with nucleation inhibition

Semiconductor device having a metal adhesion and barrier structure...

Semiconductor device with high-K gate dielectric layer and fabricat...

Tungsten film forming method and storage medium

Method for manufacturing a semiconductor device

Methods and apparatus for wetting pretreatment for through resist m...

Wet etch removal of Ru selective to other metals

Systems and methods for forming low resistivity metal contacts and...

Semiconductor structure

Patents Applicationslast 30 patents

ULTRA-THIN LAYERS BY SELECTIVE PASSIVATION

Semiconductor Device and Methods of Forming the Same

PHASE CONTROL IN CONTACT FORMATION

METHOD OF SELECTIVELY FORMING LAYER USING ATOMIC LAYER DEPOSITION A...

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...

THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING

METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THRO...

SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND ME...

METHOD FOR FABRICATING CONDUCTIVE FEATURE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION

TOP VIA PROCESS WITH DAMASCENE METAL

Conductive Interconnects and Methods of Forming Conductive Intercon...

CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...

Phase Control in Contact Formation

THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING

SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND ME...

Nucleation-Free Gap Fill ALD Process

FEATURE FILL WITH NUCLEATION INHIBITION

CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...

Phase Control in Contact Formation

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

FEATURE FILL WITH NUCLEATION INHIBITION

Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...

SEMICONDUCTOR DEVICE WITH HIGH-K GATE DIELECTRIC LAYER

Nucleation-Free Gap Fill ALD Process

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

METHOD FOR PROTECTING COBALT PLUGS

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE