Post-treatment or after-treatment of the conductive material

Industry

CPC
H01L21/76883

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76883Post-treatment or after-treatment of the conductive material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure for semiconductor interconnect
- Patent number 11,961,731
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ru-Shang Hsiao
- B08 - CLEANING
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature plasma pre-clean for selective gap fill
- Patent number 11,955,381
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse selective etch stop layer
- Patent number 11,955,382
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction device with minimum stray field
- Patent number 11,944,013
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor structure, and a semiconduc...
- Patent number 11,935,785
- Issue date Mar 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 11,935,787
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,929,327
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Inc.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning method
- Patent number 11,923,202
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,881,433
- Issue date Jan 23, 2024
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
- Patent number 11,881,520
- Issue date Jan 23, 2024
- Intel Corporation
- Curtis Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with core and peri...
- Patent number 11,864,373
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for high pressure anneal
- Patent number 11,854,800
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 11,854,879
- Issue date Dec 26, 2023
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for manufacturing the same
- Patent number 11,854,880
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tao Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for recessing a fill material within openings formed on a pa...
- Patent number 11,848,236
- Issue date Dec 19, 2023
- Tokyo Electron Limited
- Anton deVilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 11,837,501
- Issue date Dec 5, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,837,544
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,830,770
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,823,952
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Woojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive powder formation method and device for forming conductiv...
- Patent number 11,819,923
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...
- Publication number 20240145303
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sunhye HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20240145299
- Publication date May 2, 2024
- TESSERA LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED TH...
- Publication number 20240105500
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kenichi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...
- Publication number 20240096692
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240087956
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Woojin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
- Publication number 20240071822
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Less Jumper Structure for Line-to-Line Connections
- Publication number 20240071920
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240071924
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
- Publication number 20240060205
- Publication date Feb 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yu Bao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240047540
- Publication date Feb 8, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FABRICATION METHOD FOR SEMICONDUCTOR STRUC...
- Publication number 20240006319
- Publication date Jan 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240006306
- Publication date Jan 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chengfeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POWER VIA
- Publication number 20230420359
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20230420545
- Publication date Dec 28, 2023
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230411210
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...
- Publication number 20230402366
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230403839
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Sung Hun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR FORMING CONDUCTIVE POWDER
- Publication number 20230381862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20230386911
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURE WITH CONTROLLED AIR GAPS
- Publication number 20230386904
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
- Publication number 20230386832
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner-Free Conductive Structures With Anchor Points
- Publication number 20230387017
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20230387227
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20230386821
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...
- Publication number 20230378064
- Publication date Nov 23, 2023
- Changxin Memory Technologies, Inc.
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS

Post-treatment or after-treatment of the conductive material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Selective cobalt deposition on copper surfaces

Method and structure for semiconductor interconnect

Dual metal gate structure having portions of metal gate layers in c...

Semiconductor device including a porous dielectric layer, and metho...

Heterogeneous metal line compositions for advanced integrated circu...

Low-temperature plasma pre-clean for selective gap fill

Reverse selective etch stop layer

Trench contact structures for advanced integrated circuit structure...

Magnetic tunnel junction device with minimum stray field

Method of manufacturing a semiconductor structure, and a semiconduc...

Semiconductor device and a method for fabricating the same

Liner-free conductive structures with anchor points

Via connection to a partially filled trench

Double patterning method

Flat metal features for microelectronics applications

Advanced copper interconnects with hybrid microstructure

Fin patterning for advanced integrated circuit structure fabrication

Method for manufacturing semiconductor structure with core and peri...

Cobalt based interconnects and methods of fabrication thereof

Device and method for high pressure anneal

Cu3Sn via metallization in electrical devices for low-temperature 3...

Memory device and method for manufacturing the same

Metal contact structure and method of forming the same in a semicon...

Method for recessing a fill material within openings formed on a pa...

Selective recessing to form a fully aligned via

Liner-free conductive structures with anchor points

Self-aligned scheme for semiconductor device and method of forming...

Semiconductor device and method of manufacturing the same

Conductive powder formation method and device for forming conductiv...

Patents Applicationslast 30 patents

SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED TH...

HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Metal Contact Structure and Method of Forming the Same in a Semicon...

LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...

Barrier-Less Jumper Structure for Line-to-Line Connections

INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE

Method for Improving Copper Alloy Electroplating Filling Process

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE, FABRICATION METHOD FOR SEMICONDUCTOR STRUC...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH POWER VIA

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

DEVICE FOR FORMING CONDUCTIVE POWDER

IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

FINFET STRUCTURE WITH CONTROLLED AIR GAPS

DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL

Semiconductor Device Having Backside Interconnect Structure on Thr...

Liner-Free Conductive Structures With Anchor Points

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...