Power and ground in the same plane Power planes for two voltages in one plane

Industry

CPC
H05K2201/09345

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09345Power and ground in the same plane Power planes for two voltages in one plane

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 11,363,710
- Issue date Jun 14, 2022
- Samsung SDI Co., Ltd.
- Seokryun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-overlapping power/ground planes for localized power distributio...
- Patent number 11,330,699
- Issue date May 10, 2022
- San Diego State University Research Foundation
- Arif Ege Engin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic determination of power plane shape in printed circuit board
- Patent number 10,785,867
- Issue date Sep 22, 2020
- International Business Machines Corporation
- John S. Werner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit assembly with increased mounting area
- Patent number 10,652,994
- Issue date May 12, 2020
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing-over-void-T-line-compensation
- Patent number 10,484,231
- Issue date Nov 19, 2019
- Intel Corporation
- Khang Choong Yong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board and card reader
- Patent number 10,360,413
- Issue date Jul 23, 2019
- NIDEC SANKYO CORPORATION
- Kazuhiro Gomi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 10,257,920
- Issue date Apr 9, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Mitsumasa Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for embedding a discrete electrical device in a printed circ...
- Patent number 10,149,388
- Issue date Dec 4, 2018
- International Business Machines, Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding a discrete electrical device in a printed circuit board
- Patent number 9,839,131
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and semiconductor package with thermally conducti...
- Patent number 9,674,940
- Issue date Jun 6, 2017
- Samsung Electronics Co., Ltd.
- Eung-chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical characteristics of package substrates and semiconductor...
- Patent number 9,609,742
- Issue date Mar 28, 2017
- SK hynix Inc.
- Eul Chul Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct current capacitor module
- Patent number 9,236,189
- Issue date Jan 12, 2016
- Samhwa Capacitor Co., Ltd.
- Young Joo Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor module including the same
- Patent number 8,743,560
- Issue date Jun 3, 2014
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuously referencing signals over multiple layers in laminate p...
- Patent number 8,716,851
- Issue date May 6, 2014
- International Business Machines Corporation
- Francesco Preda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-incorporated substrate and component-incorporated wiring...
- Patent number 8,654,539
- Issue date Feb 18, 2014
- NGK Spark Plug Co., Ltd.
- Naoya Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film capacitor, multilayer wiring board and semiconductor device
- Patent number 8,497,567
- Issue date Jul 30, 2013
- Sony Corporation
- Shinji Rokuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having piercing linear conductors and semiconductor de...
- Patent number 8,242,612
- Issue date Aug 14, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 8,237,055
- Issue date Aug 7, 2012
- Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
- Wang-Jia Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuously referencing signals over multiple layers in laminate p...
- Patent number 8,158,461
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Francesco Preda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit for suppressing electromagnetic interference, implementatio...
- Patent number 8,085,548
- Issue date Dec 27, 2011
- Hitachi, Ltd.
- Hiroki Funato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for power domain optimization
- Patent number 7,844,925
- Issue date Nov 30, 2010
- International Business Machines Corporation
- Tingdong Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for decreasing impedance of a powe...
- Patent number 7,797,824
- Issue date Sep 21, 2010
- NVIDIA Corporation
- Thonas Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to reduce module inductance
- Patent number 7,676,911
- Issue date Mar 16, 2010
- Continental Automotive Systems US, Inc.
- Fred Flett
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer substrate for digital tuner and multilayer substrate
- Patent number 7,528,479
- Issue date May 5, 2009
- Funai Electric Co., Ltd.
- Yasuhisa Yamanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board able to suppress simultaneous switching noise
- Patent number 7,530,043
- Issue date May 5, 2009
- Hon Hai Precision Industry Co., Ltd.
- Shou-Kuo Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system utilizing circuitized substrate with sp...
- Patent number 7,491,896
- Issue date Feb 17, 2009
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane with power plane having a digital ground structure in sig...
- Patent number 7,405,947
- Issue date Jul 29, 2008
- Force 10 Networks, Inc.
- Joel R. Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control apparatus
- Patent number 7,385,792
- Issue date Jun 10, 2008
- DENSO CORPORATION
- Mitsuhiro Kanayama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of making circuitized substrate with split conductive layer...
- Patent number 7,377,033
- Issue date May 27, 2008
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane with power plane having a digital ground structure in sig...
- Patent number 7,239,527
- Issue date Jul 3, 2007
- Force 10 Networks, Inc.
- Joel R. Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD
- Publication number 20240074034
- Publication date Feb 29, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...
- Publication number 20210153341
- Publication date May 20, 2021
- San Diego State University Research Foundation
- Arif Ege ENGIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20200375023
- Publication date Nov 26, 2020
- Samsung SDI Co., Ltd.
- Seokryun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180153032
- Publication date May 31, 2018
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Mitsumasa Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE
- Publication number 20160135291
- Publication date May 12, 2016
- ASMedia Technology Inc.
- Hsin-Ting Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20160105955
- Publication date Apr 14, 2016
- FUJITSU LIMITED
- Taiga Fukumori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD
- Publication number 20150084167
- Publication date Mar 26, 2015
- KABUSHIKI KAISHA TOSHIBA
- Tadahiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CHARACTERISTICS OF PACKAGE SUBSTRATES AND SEMICONDUCTOR...
- Publication number 20140175680
- Publication date Jun 26, 2014
- SK HYNIX INC.
- Eul Chul JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20140133115
- Publication date May 15, 2014
- Daisuke IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CURRENT CAPACITOR MODULE
- Publication number 20140085772
- Publication date Mar 27, 2014
- SAMHWA CAPACITOR CO., LTD.
- Young Joo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lighting system and method of manufacture
- Publication number 20130294075
- Publication date Nov 7, 2013
- Koninklijke Phillips Electronics N.V.
- Hugo Johan Cornelissen
- F21 - LIGHTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130170167
- Publication date Jul 4, 2013
- Canon Kabushiki Kaisha
- Toyohide Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer Printed Circuit Board With Power Plane Islands To Isola...
- Publication number 20130021739
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Tae Hong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR, MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20120326272
- Publication date Dec 27, 2012
- SONY CORPORATION
- Shinji ROKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR-INCORPORATED SUBSTRATE AND COMPONENT-INCORPORATED WIRING...
- Publication number 20120241906
- Publication date Sep 27, 2012
- NGK Spark Plug Co., Ltd.
- Naoya Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20120174047
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20120063108
- Publication date Mar 15, 2012
- Yonghoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110297427
- Publication date Dec 8, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING SUBSTRATE
- Publication number 20110088928
- Publication date Apr 21, 2011
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board, semiconductor device including the same, memory modu...
- Publication number 20110051351
- Publication date Mar 3, 2011
- Elpida Memory, Inc.
- Shiro Harashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20110018144
- Publication date Jan 27, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20100307795
- Publication date Dec 9, 2010
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- WANG-JIA CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100101841
- Publication date Apr 29, 2010
- HONG FU JIN PRECISION INDUSTRY(ShenZheng) CO., LTD.
- FA-PING FAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20090256253
- Publication date Oct 15, 2009
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and Method for Power Domain Optimization
- Publication number 20080295041
- Publication date Nov 27, 2008
- Tingdong Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20080165514
- Publication date Jul 10, 2008
- Samsung Electronics Co., Ltd.
- Yong-won HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Information handling system utilizing circuitized substrate with sp...
- Publication number 20080117583
- Publication date May 22, 2008
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Continuously Referencing Signals over Multiple Layers in Laminate P...
- Publication number 20080093726
- Publication date Apr 24, 2008
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT FOR SUPPRESSING ELECTROMAGNETIC INTERFERENCE, IMPLEMENTATIO...
- Publication number 20080074857
- Publication date Mar 27, 2008
- HIROKI FUNATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Power and ground in the same plane Power planes for two voltages in one plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Non-overlapping power/ground planes for localized power distributio...

Automatic determination of power plane shape in printed circuit board

Circuit assembly with increased mounting area

Routing-over-void-T-line-compensation

Printed circuit board and card reader

Semiconductor device

Method for embedding a discrete electrical device in a printed circ...

Embedding a discrete electrical device in a printed circuit board

Electronic device and semiconductor package with thermally conducti...

Electrical characteristics of package substrates and semiconductor...

Direct current capacitor module

Circuit board and semiconductor module including the same

Continuously referencing signals over multiple layers in laminate p...

Capacitor-incorporated substrate and component-incorporated wiring...

Thin-film capacitor, multilayer wiring board and semiconductor device

Wiring board having piercing linear conductors and semiconductor de...

Circuit board

Continuously referencing signals over multiple layers in laminate p...

Circuit for suppressing electromagnetic interference, implementatio...

System and method for power domain optimization

Printed circuit board and method for decreasing impedance of a powe...

Method to reduce module inductance

Multilayer substrate for digital tuner and multilayer substrate

Printed circuit board able to suppress simultaneous switching noise

Information handling system utilizing circuitized substrate with sp...

Backplane with power plane having a digital ground structure in sig...

Electronic control apparatus

Method of making circuitized substrate with split conductive layer...

Backplane with power plane having a digital ground structure in sig...

Patents Applicationslast 30 patents

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD

NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...

CIRCUIT BOARD

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD STRUCTURE

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD

ELECTRICAL CHARACTERISTICS OF PACKAGE SUBSTRATES AND SEMICONDUCTOR...

MULTILAYER WIRING BOARD

DIRECT CURRENT CAPACITOR MODULE

Lighting system and method of manufacture

PRINTED CIRCUIT BOARD

Multi-layer Printed Circuit Board With Power Plane Islands To Isola...

THIN-FILM CAPACITOR, MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE

CAPACITOR-INCORPORATED SUBSTRATE AND COMPONENT-INCORPORATED WIRING...

Continuously Referencing Signals Over Multiple Layers in Laminate P...

CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME

PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATING SUBSTRATE

Circuit board, semiconductor device including the same, memory modu...

WIRING BOARD AND SEMICONDUCTOR DEVICE

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

Continuously Referencing Signals Over Multiple Layers in Laminate P...

System and Method for Power Domain Optimization

PRINTED CIRCUIT BOARD

Information handling system utilizing circuitized substrate with sp...

Continuously Referencing Signals over Multiple Layers in Laminate P...

CIRCUIT FOR SUPPRESSING ELECTROMAGNETIC INTERFERENCE, IMPLEMENTATIO...