Praseodymium [Pr]

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CPC
H01L2924/01059

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01059Praseodymium [Pr]

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, MOS type solid-state image pickup device, cam...
- Patent number 10,586,822
- Issue date Mar 10, 2020
- Sony Corporation
- Keiji Mabuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 10,366,969
- Issue date Jul 30, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
3D IC method and device
- Patent number 10,147,641
- Issue date Dec 4, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 9,951,382
- Issue date Apr 24, 2018
- Life Technologies Corporation
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Method for fabricating electronic device package
- Patent number 9,771,259
- Issue date Sep 26, 2017
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D IC method and device
- Patent number 9,716,033
- Issue date Jul 25, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,659,926
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Contact pad
- Patent number 9,607,955
- Issue date Mar 28, 2017
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 9,530,743
- Issue date Dec 27, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bumps and process for making same
- Patent number 9,449,931
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package systems having interposers
- Patent number 9,425,067
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,391,066
- Issue date Jul 12, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device with first and second semiconductor substrates
- Patent number 9,202,752
- Issue date Dec 1, 2015
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 9,181,084
- Issue date Nov 10, 2015
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D IC method and device
- Patent number 9,171,756
- Issue date Oct 27, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming package systems having interposers
- Patent number 9,171,815
- Issue date Oct 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 9,134,269
- Issue date Sep 15, 2015
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
3D IC method and device
- Patent number 9,130,021
- Issue date Sep 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method capable of scribing chips w...
- Patent number 9,105,706
- Issue date Aug 11, 2015
- Fujitsu Semiconductor Limited
- Satoshi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,082,708
- Issue date Jul 14, 2015
- Sumitomo Bakelite Co., Ltd.
- Shinichi Zenbutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 9,076,883
- Issue date Jul 7, 2015
- STMicroelectronics S.R.L.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density sensor array without wells
- Patent number 9,023,189
- Issue date May 5, 2015
- Life Technologies Corporation
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Patents Applicationslast 30 patents

Information Patent Application
AL BONDING WIRE
- Publication number 20230146315
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAM...
- Publication number 20180122847
- Publication date May 3, 2018
- SONY CORPORATION
- Keiji Mabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20180040591
- Publication date Feb 8, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20140187040
- Publication date Jul 3, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAM...
- Publication number 20140104471
- Publication date Apr 17, 2014
- SONY CORPORATION
- Keiji Mabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20140070345
- Publication date Mar 13, 2014
- STMicroelectronics S.r. I.
- Alberto PAGANI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140008793
- Publication date Jan 9, 2014
- RENESAS ELECTRONICS CORPORATION
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130338046
- Publication date Dec 19, 2013
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAM...
- Publication number 20130300905
- Publication date Nov 14, 2013
- SONY CORPORATION
- Keiji Mabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD CAPABLE OF SCRIBING CHIPS WITH HIGH...
- Publication number 20130280889
- Publication date Oct 24, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Satoshi OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL
- Publication number 20130244908
- Publication date Sep 19, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
HIGH DENSITY SENSOR ARRAY WITHOUT WELLS
- Publication number 20130217587
- Publication date Aug 22, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130210641
- Publication date Aug 15, 2013
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20130178062
- Publication date Jul 11, 2013
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130106388
- Publication date May 2, 2013
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...
- Publication number 20130078807
- Publication date Mar 28, 2013
- SK HYNIX INC.
- Chang Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130017959
- Publication date Jan 17, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130015505
- Publication date Jan 17, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Praseodymium [Pr]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D IC method and device

3D IC method and device

3D IC method and device

Semiconductor module, MOS type solid-state image pickup device, cam...

Semiconductor device

Integrated electronic device with transceiving antenna and magnetic...

3D IC method and device

Solder paste, joining method using the same and joined structure

Methods and apparatus for measuring analytes using large scale FET...

Method for fabricating electronic device package

3D IC method and device

Semiconductor device

Integrated circuit chip using top post-passivation technology and b...

Contact pad

Integrated electronic device with transceiving antenna and magnetic...

Pillar bumps and process for making same

Method for forming package systems having interposers

Semiconductor device

Semiconductor device with first and second semiconductor substrates

Electronic device package and fabrication method thereof

3D IC method and device

Method of sealing and contacting substrates using laser light and e...

Method of forming package systems having interposers

Methods and apparatus for measuring analytes using large scale FET...

3D IC method and device

Semiconductor device fabrication method capable of scribing chips w...

Semiconductor device

Integrated electronic device with transceiving antenna and magnetic...

Solder paste, joining method using the same and joined structure

High density sensor array without wells

Patents Applicationslast 30 patents

AL BONDING WIRE

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

SEMICONDUCTOR DEVICE

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAM...

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

3D IC METHOD AND DEVICE

Pillar Bumps and Process for Making Same

3D IC METHOD AND DEVICE

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAM...

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAM...

SEMICONDUCTOR DEVICE AND METHOD CAPABLE OF SCRIBING CHIPS WITH HIGH...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL

HIGH DENSITY SENSOR ARRAY WITHOUT WELLS

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

3D IC METHOD AND DEVICE

SEMICONDUCTOR DEVICE

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...