Pressing leads, bumps or a die through an insulating layer

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CPC
H05K2203/1189

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1189Pressing leads, bumps or a die through an insulating layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and chip-on-film structure thereof
- Patent number 11,515,243
- Issue date Nov 29, 2022
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jing Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat curable resin composition, and circuit board with electronic c...
- Patent number 10,870,725
- Issue date Dec 22, 2020
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component with pre-connected pillar in component carrier
- Patent number 10,765,005
- Issue date Sep 1, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a module connected to a PCB and electr...
- Patent number 10,681,816
- Issue date Jun 9, 2020
- SAFRAN ELECTRONICS & DEFENSE
- François Guillot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and chip-on-film structure thereof
- Patent number 10,672,700
- Issue date Jun 2, 2020
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jing Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacting arrangement and method for forming the contacting arrang...
- Patent number 10,667,409
- Issue date May 26, 2020
- Robert Bosch GmbH
- Heiner Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a printed circuit board assembly based on...
- Patent number 10,257,935
- Issue date Apr 9, 2019
- SIGNIFY HOLDING B.V.
- Adrianus Johannes Stephanus Maria De Vaan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric component mounting method
- Patent number 10,034,389
- Issue date Jul 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
- Patent number 10,032,646
- Issue date Jul 24, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for fabricating flat panel display
- Patent number 9,997,324
- Issue date Jun 12, 2018
- LG Display Co., Ltd.
- Yong Bum Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic apparatus and manufacturing method of electronic apparatus
- Patent number 9,743,531
- Issue date Aug 22, 2017
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a device comprising at least two distinct compo...
- Patent number 9,699,913
- Issue date Jul 4, 2017
- Gemalto SA
- Frederick Seban
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic wave shielding film and method for producing a circ...
- Patent number 9,609,792
- Issue date Mar 28, 2017
- GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a circuit board structure having an embedded...
- Patent number 9,433,108
- Issue date Aug 30, 2016
- Unimicron Technology Corporation
- Yung-Ching Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitched components of an active implantable medical device
- Patent number 9,089,714
- Issue date Jul 28, 2015
- Saluda Medical Pty Limited
- David Robinson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,439
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Hiroshi Segawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multi-layer printed circuit board
- Patent number 9,060,458
- Issue date Jun 16, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting film, and joined structure and method for producing the...
- Patent number 9,023,464
- Issue date May 5, 2015
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, joined structure and method for produc...
- Patent number 8,980,043
- Issue date Mar 17, 2015
- Dexerials Corporation
- Tomoyuki Ishimatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding sheet, electronic circuit device and its manufacturing method
- Patent number 8,822,836
- Issue date Sep 2, 2014
- NEC Corporation
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate
- Patent number 8,794,499
- Issue date Aug 5, 2014
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film, connecting method, and joined structure
- Patent number 8,796,557
- Issue date Aug 5, 2014
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring board with a built-in component and method for manufacturing...
- Patent number 8,737,085
- Issue date May 27, 2014
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for fabricating the same
- Patent number 8,720,049
- Issue date May 13, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film
- Patent number 8,715,833
- Issue date May 6, 2014
- Sony Chemical & Information Device Corporation
- Yasunobu Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ferroelectric component and manufacturing the same
- Patent number 8,704,106
- Issue date Apr 22, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board encapsulated by adhesive laminate comprising a...
- Patent number 8,663,804
- Issue date Mar 4, 2014
- E I du Pont de Nemours and Company
- George Elias Zahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, method of manufacturing printed wiring board,...
- Patent number 8,604,354
- Issue date Dec 10, 2013
- Fujikura Ltd.
- Shoji Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connecting film, and joined structure and method for producing the...
- Patent number 8,524,032
- Issue date Sep 3, 2013
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING A MODULE CONNECTED TO A PCB AND ELECTR...
- Publication number 20200045822
- Publication date Feb 6, 2020
- SAFRAN ELECTRONICS & DEFENSE
- François GUILLOT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373742
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND CHIP-ON-FILM STRUCTURE THEREOF
- Publication number 20190244881
- Publication date Aug 8, 2019
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jing LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANG...
- Publication number 20190215969
- Publication date Jul 11, 2019
- ROBERT BOSCH GmbH
- Heiner Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170064825
- Publication date Mar 2, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM LAMINATE, DISPLAY DEVICE HAVING THE SAM...
- Publication number 20140355226
- Publication date Dec 4, 2014
- SAMSUNG DISPLAY CO., LTD.
- Joon-Sam KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABR...
- Publication number 20140201992
- Publication date Jul 24, 2014
- Unimicron Technology Corporation
- Yung-Ching Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRIC-TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METH...
- Publication number 20130319730
- Publication date Dec 5, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Ki SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAV...
- Publication number 20130175074
- Publication date Jul 11, 2013
- Omron Corporation
- Wakahiro Kawai
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE FOR FIXING AND/OR EMBEDDING AN ELECTRONIC COMPONENT AND ME...
- Publication number 20130126091
- Publication date May 23, 2013
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Wolfgang Schrittwieser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130014982
- Publication date Jan 17, 2013
- IBIDEN CO., LTD.
- Hiroshi SEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting Film, and Joined Structure and Method for Producing the...
- Publication number 20130000113
- Publication date Jan 3, 2013
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A...
- Publication number 20120325535
- Publication date Dec 27, 2012
- E.I. du Pont de Nemours and Company
- GEORGE ELIAS ZAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20120298728
- Publication date Nov 29, 2012
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUC...
- Publication number 20120285603
- Publication date Nov 15, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Tomoyuki ISHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTING DEVICE AND METHOD FOR CONTACTING A LIGHTING DEVICE
- Publication number 20120235206
- Publication date Sep 20, 2012
- OSRAM AG
- Andreas Kampfrath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...
- Publication number 20120214010
- Publication date Aug 23, 2012
- Tomohiro Kagimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METH...
- Publication number 20120160550
- Publication date Jun 28, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Sung JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...
- Publication number 20120153506
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120118939
- Publication date May 17, 2012
- SUMITOMO BAKELITE CO., LTD.
- Keiyo KUSANAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Method For Fabricating The Same
- Publication number 20120097438
- Publication date Apr 26, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Kyun BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH BUILT-IN COMPONENT AND ITS MANUFACTURING...
- Publication number 20120080221
- Publication date Apr 5, 2012
- YAMAICHI ELECTRONICS CO. LTD.
- Noriaki SEKINE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120055706
- Publication date Mar 8, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jee Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20120030938
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multi-layer printed circuit board
- Publication number 20120030942
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120018195
- Publication date Jan 26, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120012379
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USI...
- Publication number 20110311790
- Publication date Dec 22, 2011
- SUMITOMO BAKELITE CO., LTD.
- Wataru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD
- Publication number 20110265948
- Publication date Nov 3, 2011
- Murata Manufacturing Co., Ltd.
- Kazuhiro ISEBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pressing leads, bumps or a die through an insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and chip-on-film structure thereof

Printed wiring board and method for manufacturing the same

Heat curable resin composition, and circuit board with electronic c...

Embedding component with pre-connected pillar in component carrier

Electronic device comprising a module connected to a PCB and electr...

Display device and chip-on-film structure thereof

Contacting arrangement and method for forming the contacting arrang...

Method for manufacturing a printed circuit board assembly based on...

Electric component mounting method

Robust multi-layer wiring elements and assemblies with embedded mic...

Apparatus for fabricating flat panel display

Electronic apparatus and manufacturing method of electronic apparatus

Method of producing a device comprising at least two distinct compo...

Electromagnetic wave shielding film and method for producing a circ...

Method of fabricating a circuit board structure having an embedded...

Stitched components of an active implantable medical device

Wiring board and method for manufacturing the same

Method for manufacturing multi-layer printed circuit board

Connecting film, and joined structure and method for producing the...

Anisotropic conductive film, joined structure and method for produc...

Bonding sheet, electronic circuit device and its manufacturing method

Method for manufacturing substrate

Adhesive film, connecting method, and joined structure

Wiring board with a built-in component and method for manufacturing...

Printed circuit board and method for fabricating the same

Anisotropic conductive film

Ferroelectric component and manufacturing the same

Printed wiring board encapsulated by adhesive laminate comprising a...

Printed wiring board, method of manufacturing printed wiring board,...

Connecting film, and joined structure and method for producing the...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING A MODULE CONNECTED TO A PCB AND ELECTR...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE AND CHIP-ON-FILM STRUCTURE THEREOF

CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANG...

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ANISOTROPIC CONDUCTIVE FILM LAMINATE, DISPLAY DEVICE HAVING THE SAM...

CIRCUIT BOARD STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABR...

FABRIC-TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METH...

METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAV...

ADHESIVE FOR FIXING AND/OR EMBEDDING AN ELECTRONIC COMPONENT AND ME...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Connecting Film, and Joined Structure and Method for Producing the...

PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A...

METHOD FOR MANUFACTURING SUBSTRATE

ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUC...

LIGHTING DEVICE AND METHOD FOR CONTACTING A LIGHTING DEVICE

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METH...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

Printed Circuit Board and Method For Fabricating The Same

PRINTED WIRING BOARD WITH BUILT-IN COMPONENT AND ITS MANUFACTURING...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing printed circuit board

Method for manufacturing multi-layer printed circuit board

Printed circuit board

Printed circuit board

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USI...

VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD