Pressing the bump connector against the bonding areas by means of another connector

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H01L2224/81901

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81901Pressing the bump connector against the bonding areas by means of another connector

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer stamp
- Patent number 11,318,663
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Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...
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Multi-layer stamp
- Patent number 10,899,067
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- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Semiconductor device and corresponding method
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Stamp with structured posts
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- Issue date Jul 11, 2017
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- Matthew Meitl
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Electrode connection structure and electrode connection method
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- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
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Semiconductor socket with direct selective metalization
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Electrical connector
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Method for fabricating multi-chip module with multi-level interposer
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- Issue date Mar 8, 2016
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Micro-spring chip attachment using ribbon bonds
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Multi-chip module with multi-level interposer
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Methods and apparatus for interconnecting a ball grid array to a pr...
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Press-fit integrated circuit package involving compressed spring co...
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Semiconductor device with semiconductor chips mounted on mounting b...
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- Issue date Dec 15, 2009
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Chip on a board
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- Issue date Sep 16, 2008
- Xerox Corporation
- Koenraad F. Van Schuylenbergh
- H01 - BASIC ELECTRIC ELEMENTS
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Sockets for “springed” semiconductor devices
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- Issue date Jun 13, 2006
- FormFactor, Inc.
- Thomas H. Dozier, II
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Layered microelectronic contact and method for fabricating same
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Fixture, circuit board with fixture, and electronic-component mount...
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Clip chip carrier
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Method of forming a semiconductor chip carrier
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- Warren M. Farnworth
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Sockets for “springed” semiconductor devices
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- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder-free PCB assembly
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- Issue date Jun 17, 2003
- Infineon Technologies AG
- Gerd Frankowsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Sockets for “springed” semiconductor devices
- Patent number 6,534,856
- Issue date Mar 18, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for electrically mounting an electronic device to a subst...
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- Thomas P. Glenn
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Die-to-insert permanent connection and method of forming
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- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-insert permanent connection and method of forming
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- Issue date May 14, 2002
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER STAMP
- Publication number 20210101329
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STAMP WITH STRUCTURED POSTS
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- X-Celeprint Limited
- Matthew Meitl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
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- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
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- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130032942
- Publication date Feb 7, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
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MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
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- ORACLE INTERNATIONAL CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRO...
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MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
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- ORACLE INTERNATIONAL CORPORATION
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Semiconductor device with semiconductor chips mounted on mounting b...
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- FUJITSU LIMITED
- Yuji Awano
- H01 - BASIC ELECTRIC ELEMENTS
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Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...
- Publication number 20070228110
- Publication date Oct 4, 2007
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip on a board
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- Palo Alto Research Center Incorporated
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- H01 - BASIC ELECTRIC ELEMENTS
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MEMORY ELEMENT CONDUCTING STRUCTURE
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Information Patent Application
Methods and apparatus for interconnecting a ball grid array to a pr...
- Publication number 20060243480
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- Eiji Kasahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
- Publication number 20060223345
- Publication date Oct 5, 2006
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layered microelectronic contact and method for fabricating same
- Publication number 20060138677
- Publication date Jun 29, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Sockets for "springed" semiconductor device
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- Publication date Apr 8, 2004
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sockets for "springed" semiconductor devices
- Publication number 20030067080
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- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
Solder-free PCB assembly
- Publication number 20030016503
- Publication date Jan 23, 2003
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip chip carrier
- Publication number 20020053453
- Publication date May 9, 2002
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device
- Publication number 20020050635
- Publication date May 2, 2002
- ROHM CO., LTD.
- Katsuya Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-to-insert permanent connection and method of forming
- Publication number 20010045642
- Publication date Nov 29, 2001
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixture, circuit board with fixture, and electronic-component mount...
- Publication number 20010027876
- Publication date Oct 11, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
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- H01 - BASIC ELECTRIC ELEMENTS

Pressing the bump connector against the bonding areas by means of another connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer stamp

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...

Multi-layer stamp

Semiconductor device and corresponding method

Stamp with structured posts

Electrode connection structure and electrode connection method

Semiconductor socket with direct selective metalization

Electrical connector

Method for fabricating multi-chip module with multi-level interposer

Semiconductor device manufacturing method

Semiconductor device

Micro-spring chip attachment using ribbon bonds

Multi-chip module with multi-level interposer

Semi-conductor chip with compressible contact structure and electro...

Press-fit integrated circuit package involving compressed spring co...

Methods and apparatus for interconnecting a ball grid array to a pr...

Press-fit integrated circuit package involving compressed spring co...

Semiconductor device with semiconductor chips mounted on mounting b...

Chip on a board

Sockets for “springed” semiconductor devices

Layered microelectronic contact and method for fabricating same

Fixture, circuit board with fixture, and electronic-component mount...

Clip chip carrier

Method of forming a semiconductor chip carrier

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Solder-free PCB assembly

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Apparatus for electrically mounting an electronic device to a subst...

Die-to-insert permanent connection and method of forming

Die-to-insert permanent connection and method of forming

Patents Applicationslast 30 patents

MULTI-LAYER STAMP

STAMP WITH STRUCTURED POSTS

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRO...

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

Semiconductor device with semiconductor chips mounted on mounting b...

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...

Chip on a board

MEMORY ELEMENT CONDUCTING STRUCTURE

Methods and apparatus for interconnecting a ball grid array to a pr...

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Layered microelectronic contact and method for fabricating same

Layered microelectronic contact and method for fabricating same

Sockets for "springed" semiconductor device

Sockets for "springed" semiconductor devices

Solder-free PCB assembly

Clip chip carrier

Integrated circuit device

Die-to-insert permanent connection and method of forming

Fixture, circuit board with fixture, and electronic-component mount...

Sockets for “springed” semiconductor devices

Sockets for “springed” semiconductor devices