Pressing the bump connector against the bonding areas by means of another connector

Industry

CPC
H01L2224/81901

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81901Pressing the bump connector against the bonding areas by means of another connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer stamp
- Patent number 11,318,663
- Issue date May 3, 2022
- X Display Company Technology Limited
- Tanya Yvette Moore
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...
- Patent number 11,179,748
- Issue date Nov 23, 2021
- Seiko Epson Corporation
- Koji Ohashi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Multi-layer stamp
- Patent number 10,899,067
- Issue date Jan 26, 2021
- X Display Company Technology Limited
- Tanya Yvette Moore
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stamp with structured posts
- Patent number 9,704,821
- Issue date Jul 11, 2017
- X-Celeprint Limited
- Matthew Meitl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor socket with direct selective metalization
- Patent number 9,536,815
- Issue date Jan 3, 2017
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 9,397,021
- Issue date Jul 19, 2016
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multi-chip module with multi-level interposer
- Patent number 9,281,268
- Issue date Mar 8, 2016
- Oracle International Corporation
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,980,692
- Issue date Mar 17, 2015
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,664,775
- Issue date Mar 4, 2014
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-spring chip attachment using ribbon bonds
- Patent number 8,614,514
- Issue date Dec 24, 2013
- Palo Alto Research Center Incorporated
- Vernon Powers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module with multi-level interposer
- Patent number 8,218,334
- Issue date Jul 10, 2012
- Oracle America, Inc.
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semi-conductor chip with compressible contact structure and electro...
- Patent number 8,198,739
- Issue date Jun 12, 2012
- Endicott Interconnect Technologies, Inc.
- How Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit integrated circuit package involving compressed spring co...
- Patent number 7,884,489
- Issue date Feb 8, 2011
- IXYS CH GmbH
- Thomas Stortini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for interconnecting a ball grid array to a pr...
- Patent number 7,790,987
- Issue date Sep 7, 2010
- Sony Computer Entertainment Inc.
- Eiji Kasahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit integrated circuit package involving compressed spring co...
- Patent number 7,683,494
- Issue date Mar 23, 2010
- Zilog, Inc.
- Thomas Stortini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chips mounted on mounting b...
- Patent number 7,633,148
- Issue date Dec 15, 2009
- Fujitsu Limited
- Yuji Awano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on a board
- Patent number 7,426,117
- Issue date Sep 16, 2008
- Xerox Corporation
- Koenraad F. Van Schuylenbergh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 7,059,047
- Issue date Jun 13, 2006
- FormFactor, Inc.
- Thomas H. Dozier, II
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered microelectronic contact and method for fabricating same
- Patent number 7,005,751
- Issue date Feb 28, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture, circuit board with fixture, and electronic-component mount...
- Patent number 6,888,072
- Issue date May 3, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clip chip carrier
- Patent number 6,730,999
- Issue date May 4, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor chip carrier
- Patent number 6,656,754
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 6,642,625
- Issue date Nov 4, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder-free PCB assembly
- Patent number 6,580,613
- Issue date Jun 17, 2003
- Infineon Technologies AG
- Gerd Frankowsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 6,534,856
- Issue date Mar 18, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for electrically mounting an electronic device to a subst...
- Patent number 6,441,485
- Issue date Aug 27, 2002
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-insert permanent connection and method of forming
- Patent number 6,404,063
- Issue date Jun 11, 2002
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-insert permanent connection and method of forming
- Patent number 6,387,714
- Issue date May 14, 2002
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER STAMP
- Publication number 20210101329
- Publication date Apr 8, 2021
- X Display Company Technology Limited
- Tanya Yvette Moore
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STAMP WITH STRUCTURED POSTS
- Publication number 20170047306
- Publication date Feb 16, 2017
- X-Celeprint Limited
- Matthew Meitl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140187000
- Publication date Jul 3, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130032942
- Publication date Feb 7, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20120266464
- Publication date Oct 25, 2012
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRO...
- Publication number 20120038046
- Publication date Feb 16, 2012
- How Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20110223778
- Publication date Sep 15, 2011
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chips mounted on mounting b...
- Publication number 20070267735
- Publication date Nov 22, 2007
- FUJITSU LIMITED
- Yuji Awano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...
- Publication number 20070228110
- Publication date Oct 4, 2007
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip on a board
- Publication number 20070139899
- Publication date Jun 21, 2007
- Palo Alto Research Center Incorporated
- Koenraad F. Van Schuylenbergh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ELEMENT CONDUCTING STRUCTURE
- Publication number 20060289978
- Publication date Dec 28, 2006
- Optinum Care International Tech. Inc
- Shih-Hsiung Lien
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for interconnecting a ball grid array to a pr...
- Publication number 20060243480
- Publication date Nov 2, 2006
- Eiji Kasahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
- Publication number 20060223345
- Publication date Oct 5, 2006
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layered microelectronic contact and method for fabricating same
- Publication number 20060138677
- Publication date Jun 29, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layered microelectronic contact and method for fabricating same
- Publication number 20040201074
- Publication date Oct 14, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sockets for "springed" semiconductor device
- Publication number 20040064941
- Publication date Apr 8, 2004
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sockets for "springed" semiconductor devices
- Publication number 20030067080
- Publication date Apr 10, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
Solder-free PCB assembly
- Publication number 20030016503
- Publication date Jan 23, 2003
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip chip carrier
- Publication number 20020053453
- Publication date May 9, 2002
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device
- Publication number 20020050635
- Publication date May 2, 2002
- ROHM CO., LTD.
- Katsuya Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-to-insert permanent connection and method of forming
- Publication number 20010045642
- Publication date Nov 29, 2001
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixture, circuit board with fixture, and electronic-component mount...
- Publication number 20010027876
- Publication date Oct 11, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS

Pressing the bump connector against the bonding areas by means of another connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer stamp

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...

Multi-layer stamp

Semiconductor device and corresponding method

Stamp with structured posts

Electrode connection structure and electrode connection method

Semiconductor socket with direct selective metalization

Electrical connector

Method for fabricating multi-chip module with multi-level interposer

Semiconductor device manufacturing method

Semiconductor device

Micro-spring chip attachment using ribbon bonds

Multi-chip module with multi-level interposer

Semi-conductor chip with compressible contact structure and electro...

Press-fit integrated circuit package involving compressed spring co...

Methods and apparatus for interconnecting a ball grid array to a pr...

Press-fit integrated circuit package involving compressed spring co...

Semiconductor device with semiconductor chips mounted on mounting b...

Chip on a board

Sockets for “springed” semiconductor devices

Layered microelectronic contact and method for fabricating same

Fixture, circuit board with fixture, and electronic-component mount...

Clip chip carrier

Method of forming a semiconductor chip carrier

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Solder-free PCB assembly

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Apparatus for electrically mounting an electronic device to a subst...

Die-to-insert permanent connection and method of forming

Die-to-insert permanent connection and method of forming

Patents Applicationslast 30 patents

MULTI-LAYER STAMP

STAMP WITH STRUCTURED POSTS

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRO...

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

Semiconductor device with semiconductor chips mounted on mounting b...

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...

Chip on a board

MEMORY ELEMENT CONDUCTING STRUCTURE

Methods and apparatus for interconnecting a ball grid array to a pr...

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Layered microelectronic contact and method for fabricating same

Layered microelectronic contact and method for fabricating same

Sockets for "springed" semiconductor device

Sockets for "springed" semiconductor devices

Solder-free PCB assembly

Clip chip carrier

Integrated circuit device

Die-to-insert permanent connection and method of forming

Fixture, circuit board with fixture, and electronic-component mount...

Sockets for “springed” semiconductor devices

Sockets for “springed” semiconductor devices