Principal constituent of the connecting portion of the wire connector being Gold (Au)

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H01L2224/48599

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48599Principal constituent of the connecting portion of the wire connector being Gold (Au)

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
Electronic package
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- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
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- Issue date Aug 30, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure
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- Issue date May 17, 2022
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- Miwa Muto
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- Issue date Dec 28, 2021
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Information Patent Grant
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- Issue date May 4, 2021
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- Tadatoshi Danno
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Information Patent Grant
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- Issue date Feb 9, 2021
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- Yeong-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with radiation shield
- Patent number 10,916,508
- Issue date Feb 9, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuo Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,249,595
- Issue date Apr 2, 2019
- Renesas Electronics Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
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- David J. Corisis
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Information Patent Grant
Semiconductor device
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Information Patent Grant
Remapped packaged extracted die
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- Issue date Oct 23, 2018
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Package substrate having a plurality of chips electrically connecte...
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- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,966,517
- Issue date May 8, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealant layer including carbon direct...
- Patent number 9,953,952
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 9,911,696
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,887,331
- Issue date Feb 6, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,842,792
- Issue date Dec 12, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Danny Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,806,035
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with inductive bond wires
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- Issue date May 9, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Justin P. Bandholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,672
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting copper wire bonds on aluminum pads of a semic...
- Patent number 9,508,622
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of sensing current in a power semiconductor device
- Patent number 9,500,678
- Issue date Nov 22, 2016
- ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
- Richard K. Williams
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230082767
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Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
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STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE
- Publication number 20210375783
- Publication date Dec 2, 2021
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MODULE
- Publication number 20210167005
- Publication date Jun 3, 2021
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Structure
- Publication number 20200395331
- Publication date Dec 17, 2020
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL IMAGE CAPTURING MODULE
- Publication number 20200096737
- Publication date Mar 26, 2020
- ABILITY OPTO-ELECTRONICS TECHNOLOGY CO., LTD.
- YEONG-MING CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
- Publication number 20190287922
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190198477
- Publication date Jun 27, 2019
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...
- Publication number 20190115292
- Publication date Apr 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20180158778
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- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE SUBSTRATE AND ITS FABRICATION METHOD
- Publication number 20180130771
- Publication date May 10, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180047677
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die
- Publication number 20180047685
- Publication date Feb 15, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150061160
- Publication date Mar 5, 2015
- Renesas Electronics Corporation
- Norihiro Asamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
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MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND AS...
- Publication number 20140326488
- Publication date Nov 6, 2014
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF SENSING CURRENT IN A POWER SEMICONDUCTOR DEVICE
- Publication number 20140285178
- Publication date Sep 25, 2014
- ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
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- G01 - MEASURING TESTING
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20140239513
- Publication date Aug 28, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140193954
- Publication date Jul 10, 2014
- RENESAS ELECTRONICS CORPORATION
- Naoto Taoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20140124960
- Publication date May 8, 2014
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117544
- Publication date May 1, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS

Principal constituent of the connecting portion of the wire connector being Gold (Au)

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Impedance controlled electrical interconnection employing meta-mate...

Electronic package

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor module

Wire bonding structure

Semiconductor package with terminal pattern for increased channel d...

Method of manufacturing a semiconductor device

Optical image capturing module

Semiconductor device package with radiation shield

Packaged semiconductor assemblies and methods for manufacturing suc...

Semiconductor device

Impedance controlled electrical interconnection employing meta-mate...

Method of manufacturing a semiconductor device

Microelectronic devices, stacked microelectronic devices, and metho...

Semiconductor device

Remapped packaged extracted die

Package substrate having a plurality of chips electrically connecte...

Semiconductor device

Semiconductor device having a protective material with a first pH f...

LED leadframe or LED substrate, semiconductor device, and method fo...

Semiconductor device having a sealant layer including carbon direct...

Packaged semiconductor assemblies and methods for manufacturing suc...

LED leadframe or LED substrate, semiconductor device, and method fo...

Method of producing a semiconductor package

Semiconductor device

Microelectronic devices, stacked microelectronic devices, and metho...

Integrated circuit with inductive bond wires

Semiconductor device

Method for protecting copper wire bonds on aluminum pads of a semic...

System and method of sensing current in a power semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

STRENGTHENED WIRE-BOND

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

ELECTRONIC PACKAGE

SEMICONDUCTOR MODULE

Wire Bonding Structure

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

OPTICAL IMAGE CAPTURING MODULE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...

SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGE SUBSTRATE AND ITS FABRICATION METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Remapped Packaged Extracted Die

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MOISTURE BARRIER FOR A WIRE BOND

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND AS...

SYSTEM AND METHOD OF SENSING CURRENT IN A POWER SEMICONDUCTOR DEVICE

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF