Printed circuits or mounted components having integral heating means

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H05K1/0212

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0212Printed circuits or mounted components having integral heating means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for shaping flexible circuits to improve routin...
- Patent number 12,156,342
- Issue date Nov 26, 2024
- Aptiv Technologies AG
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heater having flexible printed wiring board and method for manufact...
- Patent number 12,144,068
- Issue date Nov 12, 2024
- Nippon Mektron, Ltd.
- Garo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Storage device unit
- Patent number 12,069,796
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigehito Morita
- G11 - INFORMATION STORAGE
Information Patent Grant
Cost effective, mass producible temperature controlled thermal imag...
- Patent number 12,055,446
- Issue date Aug 6, 2024
- SEEK THERMAL, INC.
- William J. Parrish
- G01 - MEASURING TESTING
Information Patent Grant
Heater for apparatus for detecting molecule(s)
- Patent number 12,048,930
- Issue date Jul 30, 2024
- Ubiquitome Limited
- Graeme Colin Fuller
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Lens heater assembly for camera
- Patent number 11,994,789
- Issue date May 28, 2024
- Lineage Logistics, LLC
- Christopher Frank Eckman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic equipment including a sound-proof acoustic duct
- Patent number 11,997,453
- Issue date May 28, 2024
- Sagemcom Broadband SAS
- Arnaud Ferreira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board, circuit board, and fixture
- Patent number 11,956,887
- Issue date Apr 9, 2024
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and circuit board module thereof
- Patent number 11,917,747
- Issue date Feb 27, 2024
- Chicony Electronics Co., Ltd.
- Chien-Yueh Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power converter
- Patent number 11,915,995
- Issue date Feb 27, 2024
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test element support
- Patent number 11,911,768
- Issue date Feb 27, 2024
- Roche Diagnostics Operations, Inc.
- Reiner Stein
- G01 - MEASURING TESTING
Information Patent Grant
Electric wiring member and liquid ejection head
- Patent number 11,917,748
- Issue date Feb 27, 2024
- Canon Kabushiki Kaisha
- Takamitsu Tokuda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Optical device with heating element
- Patent number 11,892,702
- Issue date Feb 6, 2024
- Aptiv Technologies Limited
- Arkadiusz Rafalowski
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermal substrate with high-resistance magnification and positive t...
- Patent number 11,859,094
- Issue date Jan 2, 2024
- LMS Consulting Group, LLC
- Shuyong Xiao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board and a storage system including the same
- Patent number 11,832,382
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Jae Beom Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal insulation and temperature control of components
- Patent number 11,785,705
- Issue date Oct 10, 2023
- Xerox Corporation
- Yunda Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Lens heater assembly for camera
- Patent number 11,720,003
- Issue date Aug 8, 2023
- Lineage Logistics, LLC
- Christopher Frank Eckman
- G02 - OPTICS
Information Patent Grant
Heater apparatus-integrated peripheral component interconnect card...
- Patent number 11,687,130
- Issue date Jun 27, 2023
- Dell Products L.P.
- Eric Michael Tunks
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite part with integral electronic instrumentation circuit and...
- Patent number 11,639,916
- Issue date May 2, 2023
- SAFRAN
- Sabri Janfaoui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Apparatus, system and method of providing a fluid bag heater
- Patent number 11,633,549
- Issue date Apr 25, 2023
- Jabil Inc.
- Mary Alice Gill
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Embedded electronic heater controller
- Patent number 11,638,344
- Issue date Apr 25, 2023
- Rockwell Collins, Inc.
- Amos Veltkamp
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Relay arrangement with improved heat dissipation and converter devi...
- Patent number 11,570,884
- Issue date Jan 31, 2023
- SMA Solar Technology AG
- Frank Papenfuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit-including film
- Patent number 11,541,640
- Issue date Jan 3, 2023
- Kuraray Europe GmbH
- Yuhi Shimazumi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Microfluidic delivery system with a die on a rigid substrate
- Patent number 11,523,500
- Issue date Dec 6, 2022
- STMICROELECTRONICS INTERNATIONAL N.V.
- Simon Dodd
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Lens heater assembly for camera
- Patent number 11,474,417
- Issue date Oct 18, 2022
- Lineage Logistics, LLC
- Christopher Frank Eckman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring structure, fuser device, and image forming apparatus
- Patent number 11,442,384
- Issue date Sep 13, 2022
- Kabushiki Kaisha Toshiba
- Shanying Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for detecting metal migration in two-phase immers...
- Patent number 11,435,410
- Issue date Sep 6, 2022
- Dell Products L.P.
- Jon Taylor Fitch
- G01 - MEASURING TESTING
Information Patent Grant
Electric device
- Patent number 11,388,842
- Issue date Jul 12, 2022
- SHARP KABUSHIKI KAISHA
- Akira Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS
- Publication number 20240397607
- Publication date Nov 28, 2024
- International Business Machines Corporation
- DUSTIN DEMETRIOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COST EFFECTIVE, MASS PRODUCIBLE TEMPERATURE CONTROLLED THERMAL IMAG...
- Publication number 20240361191
- Publication date Oct 31, 2024
- Seek Thermal, Inc.
- William J. Parrish
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Cooling Configurations
- Publication number 20240314917
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
- Publication number 20240237190
- Publication date Jul 11, 2024
- Dell Products L.P.
- JOHN R. STUEWE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE
- Publication number 20240214654
- Publication date Jun 27, 2024
- POWER LOGICS CO., LTD.
- Mean-Seok GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...
- Publication number 20240164015
- Publication date May 16, 2024
- HS Elektronik Systeme GmbH
- Josef MAIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
- Publication number 20240138054
- Publication date Apr 25, 2024
- Dell Products L.P.
- JOHN R. STUEWE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...
- Publication number 20240101851
- Publication date Mar 28, 2024
- LMS Consulting Group, LLC
- Shuyong Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Substrate
- Publication number 20240107658
- Publication date Mar 28, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY EMBEDDED THERMAL MANAGEMENT SYSTEM U...
- Publication number 20240080966
- Publication date Mar 7, 2024
- Honeywell International Inc.
- Karthikeyan Paramanandam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...
- Publication number 20240064908
- Publication date Feb 22, 2024
- Aptiv Technologies Limited
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20240032210
- Publication date Jan 25, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Taiji YANAGIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20240012458
- Publication date Jan 11, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION SUBSTRATE
- Publication number 20230403826
- Publication date Dec 14, 2023
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LENS HEATER ASSEMBLY FOR CAMERA
- Publication number 20230333454
- Publication date Oct 19, 2023
- Lineage Logistics, LLC
- Christopher Frank Eckman
- G02 - OPTICS
Information Patent Application
HEATERS FOR MEDICAL DEVICES
- Publication number 20230262872
- Publication date Aug 17, 2023
- Sense Biodetection Limited
- Ralph LAMBLE
- G01 - MEASURING TESTING
Information Patent Application
HEATER APPARATUS FOR A COMPUTING DEVICE
- Publication number 20230232525
- Publication date Jul 20, 2023
- Dell Products L.P.
- Eric Michael Tunks
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATER APPARATUS-INTEGRATED PERIPHERAL COMPONENT INTERCONNECT CARD...
- Publication number 20230229206
- Publication date Jul 20, 2023
- Eric Michael Tunks
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HUMIDITY-ADJUSTED POWER SUPPLY
- Publication number 20230209699
- Publication date Jun 29, 2023
- Xerox Corporation
- Hendrikus Adrianus Anthonius Verheijen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT
- Publication number 20230164905
- Publication date May 25, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND CIRCUIT BOARD MODULE THEREOF
- Publication number 20230132928
- Publication date May 4, 2023
- CHICONY ELECTRONICS CO., LTD.
- Chien-Yueh Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD, CIRCUIT BOARD CONNECTION STRUCTURE, AND METHOD OF MA...
- Publication number 20230043114
- Publication date Feb 9, 2023
- Murata Manufacturing Co., Ltd.
- Kentarou KAWABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS HEATER ASSEMBLY FOR CAMERA
- Publication number 20230013296
- Publication date Jan 19, 2023
- Lineage Logistics, LLC
- Christopher Frank Eckman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CIRCUIT BOARD, PROBE CARD SUBSTRATE, AND PROBE CARD
- Publication number 20220413015
- Publication date Dec 29, 2022
- KYOCERA CORPORATION
- Hitoshi TEGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FLUID HEATER
- Publication number 20220377877
- Publication date Nov 24, 2022
- DBK DAVID + BAADER GMBH
- Sebastian SCHÖNEICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD, CIRCUIT BOARD, AND FIXTURE
- Publication number 20220377876
- Publication date Nov 24, 2022
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC INTERFACE HOUSING FOR CONTROLLING AN ELECTRICAL HEATING...
- Publication number 20220346194
- Publication date Oct 27, 2022
- VALEO SYSTEMES THERMIQUES
- Erwan Gogmos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Printed circuits or mounted components having integral heating means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for shaping flexible circuits to improve routin...

Film-closure apparatus for plastic film material, printed circuit b...

Heater having flexible printed wiring board and method for manufact...

Storage device unit

Cost effective, mass producible temperature controlled thermal imag...

Heater for apparatus for detecting molecule(s)

Lens heater assembly for camera

Electronic equipment including a sound-proof acoustic duct

Board, circuit board, and fixture

Electronic device and circuit board module thereof

Power converter

Test element support

Electric wiring member and liquid ejection head

Optical device with heating element

Thermal substrate with high-resistance magnification and positive t...

Printed circuit board and a storage system including the same

Thermal insulation and temperature control of components

Lens heater assembly for camera

Heater apparatus-integrated peripheral component interconnect card...

Reflow grid array to support late attach of components

Composite part with integral electronic instrumentation circuit and...

Apparatus, system and method of providing a fluid bag heater

Embedded electronic heater controller

Relay arrangement with improved heat dissipation and converter devi...

Circuit-including film

Microfluidic delivery system with a die on a rigid substrate

Lens heater assembly for camera

Wiring structure, fuser device, and image forming apparatus

System and method for detecting metal migration in two-phase immers...

Electric device

Patents Applicationslast 30 patents

COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

COST EFFECTIVE, MASS PRODUCIBLE TEMPERATURE CONTROLLED THERMAL IMAG...

HEAT SPREADER FOR MODIFIED EDGE COOLING

Circuit Board Cooling Configurations

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES

CAMERA MODULE

PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES

THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...

Carrier Substrate

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY EMBEDDED THERMAL MANAGEMENT SYSTEM U...

SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...

CIRCUIT ASSEMBLY

Printed Circuits with Embedded Resistive Thermal Devices

HEAT DISSIPATION SUBSTRATE

LENS HEATER ASSEMBLY FOR CAMERA

HEATERS FOR MEDICAL DEVICES

HEATER APPARATUS FOR A COMPUTING DEVICE

HEATER APPARATUS-INTEGRATED PERIPHERAL COMPONENT INTERCONNECT CARD...

HUMIDITY-ADJUSTED POWER SUPPLY

ELECTRONIC CIRCUIT

ELECTRONIC DEVICE AND CIRCUIT BOARD MODULE THEREOF

CIRCUIT BOARD, CIRCUIT BOARD CONNECTION STRUCTURE, AND METHOD OF MA...

LENS HEATER ASSEMBLY FOR CAMERA

CIRCUIT BOARD, PROBE CARD SUBSTRATE, AND PROBE CARD

PRINTED CIRCUIT BOARD AND FLUID HEATER

BOARD, CIRCUIT BOARD, AND FIXTURE

ELECTRONIC INTERFACE HOUSING FOR CONTROLLING AN ELECTRICAL HEATING...