Process control or regulation

Industry

CPC
C25D21/12

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D21/00Processes for servicing or operating cells for electrolytic coating

Current Industry

C25D21/12Process control or regulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for electrochemical additive manufacturing of parts
- Patent number 12,227,862
- Issue date Feb 18, 2025
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for electrochemical process
- Patent number 12,227,866
- Issue date Feb 18, 2025
- Yuming Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 12,221,712
- Issue date Feb 11, 2025
- Ebara Corporation
- Shigeyuki Nakahama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for creating a chromium-plated surface with a matte finish
- Patent number 12,221,717
- Issue date Feb 11, 2025
- Kings Mountain International, Inc
- Jordi Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface processing system
- Patent number 12,216,739
- Issue date Feb 4, 2025
- Nippon Telegraph and Telephone Corporation
- Yuichi Okabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanofiltration for wafer rinsing
- Patent number 12,209,325
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- John L. Klocke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Meniscus-confined three-dimensional electrodeposition
- Patent number 12,202,193
- Issue date Jan 21, 2025
- Ramot at Tel-Aviv University Ltd.
- David Eliyahu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer immersion in semiconductor processing chambers
- Patent number 12,188,144
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- John L. Klocke
- G05 - CONTROLLING REGULATING
Information Patent Grant
Plating apparatus
- Patent number 12,180,606
- Issue date Dec 31, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition system including optical probes
- Patent number 12,180,607
- Issue date Dec 31, 2024
- Lam Research Corporation
- Andrew James Pfau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of adjusting plating module
- Patent number 12,163,244
- Issue date Dec 10, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic device including metal housing
- Patent number 12,150,263
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Jongsu Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical treatment system
- Patent number 12,139,809
- Issue date Nov 12, 2024
- Corrdesa, LLC
- Alan Rose
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip component production method
- Patent number 12,125,618
- Issue date Oct 22, 2024
- Koa Corporation
- Yasushi Akahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for continuous electrochemical production of t...
- Patent number 12,123,101
- Issue date Oct 22, 2024
- ADDIONICS IL LTD
- Moshiel Biton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming apparatus for forming metal film and film forming meth...
- Patent number 12,123,103
- Issue date Oct 22, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Parameter adjustment model for semiconductor processing chambers
- Patent number 12,116,686
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective screen electroplating
- Patent number 12,116,689
- Issue date Oct 15, 2024
- Seagate Technology LLC
- Riyan Alex Mendonsa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for preparing copper-based negative electrode material by us...
- Patent number 12,095,058
- Issue date Sep 17, 2024
- GUANGDONG BRUNP RECYCLING TECHNOLOGY CO., LTD.
- Haijun Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System for reliable, high throughput, complex electric field genera...
- Patent number 12,077,876
- Issue date Sep 3, 2024
- Modumetal, Inc.
- Leslie Ann Collinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating with a polycarboxylate ether supressor
- Patent number 12,071,700
- Issue date Aug 27, 2024
- BASF SE
- Tobias Urban
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electro-chemical plating
- Patent number 12,071,699
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating system and method of plating wafer
- Patent number 12,071,701
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for plating and method of plating
- Patent number 12,054,841
- Issue date Aug 6, 2024
- Ebara Corporation
- Kazuma Ideguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20250051955
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical Layer Deposition by Anode Array Using Measurement I...
- Publication number 20250043453
- Publication date Feb 6, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF MOLYBDENUM DISULFIDE DRY FILM LUBRICANT COATINGS
- Publication number 20250027223
- Publication date Jan 23, 2025
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Adam Paul Rabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20250011966
- Publication date Jan 9, 2025
- EBARA CORPORATION
- Kazuhito TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR ANODISING AN INNER SURFACE OF A TUBE
- Publication number 20250003107
- Publication date Jan 2, 2025
- Carrier Corporation
- Ian Robinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for Electrochemical Treatment and Method Thereof
- Publication number 20240417879
- Publication date Dec 19, 2024
- QUAKER CHEMICAL CORPORATION
- Danijela Milosevic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR COLORIZING ALUMINUM-CONTAINING OBJECT AND COLORIZED ALUM...
- Publication number 20240384431
- Publication date Nov 21, 2024
- Jabil Circuit (Singapore) Pte. Ltd.
- Yi-Chung Su
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240368800
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Shigeyuki NAKAHAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ELECTROCHEMICAL PLATING
- Publication number 20240360585
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEM AND METHOD OF PLATING WAFER
- Publication number 20240360584
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COUNTER-ELECTRODE FOR ELECTROCHEMICAL METHOD WITH AUTOMATIC ADAPTAT...
- Publication number 20240344232
- Publication date Oct 17, 2024
- Centre de Recherches Métallurgiques ASBL - Centrum voor Research in de Metall...
- Nicolas NUTAL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...
- Publication number 20240337628
- Publication date Oct 10, 2024
- ECI Technology, Inc.
- Jake Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Dynamic Glass Element Using Reversible Metal Electrodeposition Elec...
- Publication number 20240329480
- Publication date Oct 3, 2024
- The Board of Regents of the Nevada System of Higher Education, on behalf of t...
- Christopher J. Barile
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ferritic Stainless Steel Used for Bipolar Plates of Fuel Cells, Con...
- Publication number 20240301539
- Publication date Sep 12, 2024
- SHANDONG INDUSTRIAL RESEARCH INSTITUTE OF ADVANCED MATERIALS CO., LTD.
- Huaxing LU
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
NANOFILTRATION FOR WAFER RINSING
- Publication number 20240295046
- Publication date Sep 5, 2024
- Applied Materials, Inc.
- John L. Klocke
- B08 - CLEANING
Information Patent Application
PLATING APPARATUS
- Publication number 20240295045
- Publication date Sep 5, 2024
- EBARA CORPORATION
- Tsubasa ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
- Publication number 20240279838
- Publication date Aug 22, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE COMPOSITION, ELECTROCHEMICAL PROCESS AND ANODIZED COMPO...
- Publication number 20240279836
- Publication date Aug 22, 2024
- ZF Active Safety GmbH
- Denis Monpetit
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240271313
- Publication date Aug 15, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING OF PARTS
- Publication number 20240271304
- Publication date Aug 15, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MAINTENANCE METHOD OF PLATING APPARATUS
- Publication number 20240263337
- Publication date Aug 8, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR SURFACE MODIFICATION OF PIPES
- Publication number 20240254650
- Publication date Aug 1, 2024
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Jung Han KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240254648
- Publication date Aug 1, 2024
- EBARA CORPORATION
- Yusui GOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS
- Publication number 20240247396
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS FOR UPDATING TARGET MAPS INCLUDING CONSIDERATIONS OF ROTATI...
- Publication number 20240246299
- Publication date Jul 25, 2024
- FABRIC8LABS, INC.
- David Pain
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Process control or regulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for electrochemical additive manufacturing of parts

Systems and methods for electrochemical process

Plating apparatus

Plating method and plating apparatus

Method for creating a chromium-plated surface with a matte finish

Surface processing system

Nanofiltration for wafer rinsing

Meniscus-confined three-dimensional electrodeposition

Semiconductor manufacturing apparatus, failure prediction method fo...

Wafer immersion in semiconductor processing chambers

Plating apparatus

Electrochemical deposition system including optical probes

Method of adjusting plating module

Plating method, insoluble anode for plating, and plating apparatus

Cross flow conduit for foaming prevention in high convection platin...

Plating and deplating currents for material co-planarity in semicon...

Electronic device including metal housing

Electrochemical treatment system

Plating apparatus and cleaning method of contact member of plating...

Chip component production method

Method and apparatus for continuous electrochemical production of t...

Film forming apparatus for forming metal film and film forming meth...

Parameter adjustment model for semiconductor processing chambers

Selective screen electroplating

Method for preparing copper-based negative electrode material by us...

System for reliable, high throughput, complex electric field genera...

Electroplating with a polycarboxylate ether supressor

Apparatus for electro-chemical plating

Plating system and method of plating wafer

Apparatus for plating and method of plating

Patents Applicationslast 30 patents

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

METHOD OF ADJUSTING PLATING MODULE

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

Electrochemical Layer Deposition by Anode Array Using Measurement I...

ELECTRODEPOSITION OF MOLYBDENUM DISULFIDE DRY FILM LUBRICANT COATINGS

PLATING METHOD AND PLATING APPARATUS

APPARATUS AND METHOD FOR ANODISING AN INNER SURFACE OF A TUBE

System for Electrochemical Treatment and Method Thereof

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

METHOD FOR COLORIZING ALUMINUM-CONTAINING OBJECT AND COLORIZED ALUM...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

PLATING APPARATUS

METHODS OF ELECTROCHEMICAL PLATING

PLATING SYSTEM AND METHOD OF PLATING WAFER

COUNTER-ELECTRODE FOR ELECTROCHEMICAL METHOD WITH AUTOMATIC ADAPTAT...

QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...

Dynamic Glass Element Using Reversible Metal Electrodeposition Elec...

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

Ferritic Stainless Steel Used for Bipolar Plates of Fuel Cells, Con...

NANOFILTRATION FOR WAFER RINSING

PLATING APPARATUS

ELECTROPLATING DEVICE AND ELECTROPLATING METHOD

ELECTROLYTE COMPOSITION, ELECTROCHEMICAL PROCESS AND ANODIZED COMPO...

PLATING APPARATUS

METHODS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING OF PARTS

MAINTENANCE METHOD OF PLATING APPARATUS

ELECTROPLATING APPARATUS FOR SURFACE MODIFICATION OF PIPES

PLATING APPARATUS AND PLATING METHOD

LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS

SYSTEMS FOR UPDATING TARGET MAPS INCLUDING CONSIDERATIONS OF ROTATI...