Process for coatings or optical elements

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CPC
H01L27/14685

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14685Process for coatings or optical elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method, apparatus and system providing holographic layer as micro-l...
- Patent number 12,181,837
- Issue date Dec 31, 2024
- Alexander Mokhnatyuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of making
- Patent number 12,183,753
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, back-side illuminated image sensor and met...
- Patent number 12,183,761
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-photon avalanche diodes with deep trench isolation
- Patent number 12,183,754
- Issue date Dec 31, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ping Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic apparatus
- Patent number 12,183,755
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kaito Yokochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation-enhanced image sensor and surface-passivation method
- Patent number 12,176,364
- Issue date Dec 24, 2024
- OmniVision Technologies, Inc.
- Shiyu Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric structure overlying image sensor element to increase qua...
- Patent number 12,176,372
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with varying same-color color filter thickness
- Patent number 12,176,366
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Dong Min Keum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 12,170,299
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal mirror based multispectral filter array of optical sensor device
- Patent number 12,170,300
- Issue date Dec 17, 2024
- Viavi Solutions Inc.
- Georg J. Ockenfuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased optical path for long wavelength light by grating structure
- Patent number 12,170,302
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with passivation layer for dark current reduction
- Patent number 12,166,054
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 12,166,057
- Issue date Dec 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuka Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element, method of manufacturing image pickup element,...
- Patent number 12,166,058
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shuji Manda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method of manufacturing the same, and e...
- Patent number 12,164,116
- Issue date Dec 10, 2024
- Sony Group Corporation
- Hirokazu Shibuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,166,048
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation imaging apparatus and manufacturing method of same
- Patent number 12,158,551
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Masato Ofuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unequal CMOS image sensor pixel size to boost quantum efficiency
- Patent number 12,159,886
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with stress adjusting layers
- Patent number 12,154,933
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow band filter with high transmission
- Patent number 12,154,924
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced cross-talk in color and infrared image sensor
- Patent number 12,148,783
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro lens arrays and methods of formation thereof
- Patent number 12,148,778
- Issue date Nov 19, 2024
- STMicroelectronics Ltd.
- Yu-Tsung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detector, light detection system, LIDAR device, and mobile body
- Patent number 12,142,616
- Issue date Nov 12, 2024
- Kabushiki Kaisha Toshiba
- Mariko Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eye gesture tracking
- Patent number 12,141,351
- Issue date Nov 12, 2024
- Artilux, Inc.
- Yun-Chung Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imaging device and signal processing device
- Patent number 12,136,641
- Issue date Nov 5, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jun Ogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices for image sensing
- Patent number 12,136,638
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Chia Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera package, method for manufacturing camera package, and electr...
- Patent number 12,132,064
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroyasu Matsugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device
- Patent number 12,132,068
- Issue date Oct 29, 2024
- SK hynix Inc.
- Ho Young Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having fingerprint recognition function
- Patent number 12,125,863
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Gee-Bum Kim
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
NON-SCATTERING NANOSTRUCTURES OF SILICON PIXEL IMAGE SENSORS
- Publication number 20250006759
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING MODULE MANUFACTURING METHOD
- Publication number 20250006756
- Publication date Jan 2, 2025
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS
- Publication number 20250006772
- Publication date Jan 2, 2025
- Dexerials Corporation
- Yuina KOKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250006757
- Publication date Jan 2, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE
- Publication number 20250006760
- Publication date Jan 2, 2025
- Arvin EMADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240429254
- Publication date Dec 26, 2024
- Sony Semiconductor Solutions Corporation
- SHINICHIRO NOUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240429255
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...
- Publication number 20240429261
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ChunHao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND ME...
- Publication number 20240429256
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Gwangho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALENS FOR NEAR INFRARED PHOTODETECTOR
- Publication number 20240429257
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240421174
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240413179
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- YUKA OHKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Sensor Integration
- Publication number 20240413189
- Publication date Dec 12, 2024
- Artilux, Inc.
- Yun-Chung Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240413182
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS
- Publication number 20240405047
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395837
- Publication date Nov 28, 2024
- VisEra Technologies Company Ltd.
- Cheng-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395843
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...
- Publication number 20240395847
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240387576
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Stress Adjusting Layers
- Publication number 20240387595
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE HOLES FOR PIXEL SENSORS AND METHODS OF FORMING THE SAME
- Publication number 20240387599
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE
- Publication number 20240387592
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387578
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS AND MANUFACTURING METHOD FOR THE SAME, AND ELECTR...
- Publication number 20240387580
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- TATSUKI MIYAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240387589
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE INCLUDING NEAR INFRARED PHOTODIODES AND NEAR...
- Publication number 20240387600
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manfacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240379705
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTUR...
- Publication number 20240379710
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Process for coatings or optical elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method, apparatus and system providing holographic layer as micro-l...

Image sensor and method of making

Semiconductor structure, back-side illuminated image sensor and met...

Single-photon avalanche diodes with deep trench isolation

Imaging device and electronic apparatus

Passivation-enhanced image sensor and surface-passivation method

Dielectric structure overlying image sensor element to increase qua...

Image sensor with varying same-color color filter thickness

Image sensors

Metal mirror based multispectral filter array of optical sensor device

Increased optical path for long wavelength light by grating structure

Image sensor with passivation layer for dark current reduction

Solid-state imaging device, manufacturing method thereof, and elect...

Image pickup element, method of manufacturing image pickup element,...

Solid-state imaging device, method of manufacturing the same, and e...

Pixel array including octagon pixel sensors

Radiation imaging apparatus and manufacturing method of same

Unequal CMOS image sensor pixel size to boost quantum efficiency

Image sensors with stress adjusting layers

Narrow band filter with high transmission

Reduced cross-talk in color and infrared image sensor

Micro lens arrays and methods of formation thereof

Method of forming semiconductor device

Light detector, light detection system, LIDAR device, and mobile body

Eye gesture tracking

Imaging device and signal processing device

Semiconductor devices for image sensing

Camera package, method for manufacturing camera package, and electr...

Image sensing device

Display apparatus having fingerprint recognition function

Patents Applicationslast 30 patents

NON-SCATTERING NANOSTRUCTURES OF SILICON PIXEL IMAGE SENSORS

IMAGE SENSING MODULE MANUFACTURING METHOD

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR STRUCTURE

IMAGING DEVICE

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...

SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND ME...

METALENS FOR NEAR INFRARED PHOTODETECTOR

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

IMAGING DEVICE

Optical Sensor Integration

IMAGE SENSOR

OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

Image Sensors With Stress Adjusting Layers

NANOSCALE HOLES FOR PIXEL SENSORS AND METHODS OF FORMING THE SAME

SOLID-STATE IMAGE PICKUP DEVICE

IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME

IMAGING APPARATUS AND MANUFACTURING METHOD FOR THE SAME, AND ELECTR...

IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

OPTOELECTRONIC DEVICE INCLUDING NEAR INFRARED PHOTODIODES AND NEAR...

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTUR...

Method of Forming Semiconductor Device

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME